Mounting table and plasma processing apparatus

US2018166259A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2018166259-A1
Application numberUS-201715833060-A
CountryUS
Kind codeA1
Filing dateDec 6, 2017
Priority dateDec 8, 2016
Publication dateJun 14, 2018
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Non-uniformity of temperature of a focus ring can be improved by reducing holes which hamper a heat transfer from the focus ring to a base. A mounting table includes the base configured to place a processing target object thereon; the focus ring provided on the base to surround a region on which the processing target object is placed; a connecting member provided with a through hole and configured to connect the base to a member provided below the base by being inserted into an insertion hole formed at a region of the base which corresponds to a lower portion of the focus ring; and a lifter pin provided at the base such that the lifter pin is allowed to be protruded from the insertion hole by being inserted into the through hole of the connecting member, and configured to raise the focus ring by being protruded from the insertion hole.

First claim

Opening claim text (preview).

We claim: 1 . A mounting table, comprising: a base configured to place a processing target object thereon; a focus ring provided on the base to surround a region on which the processing target object is placed; a connecting member provided with a through hole and configured to connect the base to a member provided below the base by being inserted into an insertion hole formed at a region of the base which corresponds to a lower portion of the focus ring; and a lifter pin provided at the base such that the lifter pin is allowed to be protruded from the insertion hole by being inserted into the through hole of the connecting member, and configured to raise the focus ring by being protruded from the insertion hole. 2 . The mounting table of claim 1 , wherein the focus ring is provided on the base with a heat transfer member, which is configured to be extended/contracted and provided with a through hole, therebetween, the lifter pin comes into contact with the lower portion of the focus ring after passing through the through hole of the heat transfer member when the lifter pin raises the focus ring by being protruded from the insertion hole, and the heat transfer member is extended to fill a gap between the base and the focus ring as the focus ring is raised. 3 . The mounting table of claim 1 , further comprising: a heating member provided between the base and the focus ring and configured to cover, in the region of the base which corresponds to the lower portion of the focus ring, a region except the insertion hole. 4 . The mounting table of claim 1 , wherein a hole having a bottom is formed at the lower portion of the focus ring, and the lifter pin is insertion-fitted into the hole having the bottom. 5 . The mounting table of claim 1 , further comprising: a coolant path formed within the base and configured to allow a coolant to pass therethrough. 6 . A plasma processing apparatus, comprising: a mounting table as claimed in claim 1 .

Assignees

Inventors

Classifications

  • for drying etching · CPC title

  • Details of electrostatic chucks · CPC title

  • using mechanical means, e.g. clamps or pinches · CPC title

  • for supporting or gripping · CPC title

  • Handling or holding of wafers, substrates or devices during manufacture or treatment thereof · CPC title

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Frequently asked questions

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What does patent US2018166259A1 cover?
Non-uniformity of temperature of a focus ring can be improved by reducing holes which hamper a heat transfer from the focus ring to a base. A mounting table includes the base configured to place a processing target object thereon; the focus ring provided on the base to surround a region on which the processing target object is placed; a connecting member provided with a through hole and configu…
Who is the assignee on this patent?
Tokyo Electron Ltd
What technology area does this patent fall under?
Primary CPC classification H10P72/0421. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Jun 14 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).