RF switch device including multi-width air gaps

US12406927B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12406927-B2
Application numberUS-202217730495-A
CountryUS
Kind codeB2
Filing dateApr 27, 2022
Priority dateMay 12, 2021
Publication dateSep 2, 2025
Grant dateSep 2, 2025

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

An RF switch device in a stacked configuration and a method of manufacturing the same seek to reduce or eliminate a voltage imbalance, a condition in which different voltages are applied to different stages of the RF switch device, by forming air gaps on or over corresponding gate electrodes, in which each of the air gaps in a single stage has a different width.

First claim

Opening claim text (preview).

The invention claimed is: 1. An RF switch device, comprising: a semiconductor layer; gate electrodes spaced apart from each other in a single stage and on the semiconductor layer; sources in the semiconductor layer; drains in the semiconductor layer; a lower source contact connected to one of the sources; a first lower metal structure connected to the lower source contact; an upper source contact connected to the first lower metal structure; a first upper metal structure connected to the upper source contact; a lower drain contact connected to one of the drains; a second lower metal structure connected to the lower drain contact; an upper drain contact connected to the second lower metal structure; a second upper metal structure connected to the upper drain contact; and air gaps configured such that, in the single stage and on or over each gate electrode, at least one of the air gaps has a different width than other ones of the air gaps, wherein the first upper metal structure includes: a source tab extending along a first direction; and a plurality of source extensions extending in a second direction from the source tab, the second upper metal structure includes: a drain tab extending in the first direction and spaced apart from the source tab in the second direction; and a plurality of drain extensions extending in the second direction from the drain tab, and each of the source extensions and the drain extensions has a length less than half a distance between the source tab and the drain tab in the second direction. 2. The RF switch device of claim 1 , comprising multiple stages, the multiple stages including the single stage. 3. The RF switch device of claim 2 , wherein the air gaps within the single stage have different widths to reduce or eliminate a voltage imbalance in the RF switch device. 4. The RF switch device of claim 1 , wherein the source extensions and the drain extensions do not overlap each other along the first direction.

Assignees

Inventors

Classifications

  • by forming conductive members before forming protective insulating material · CPC title

  • Insulating materials thereof · CPC title

  • H10W20/072Primary

    of dielectric parts comprising air gaps · CPC title

  • comprising air gaps · CPC title

  • comprising two or more dielectric layers having different properties, e.g. different dielectric constants · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US12406927B2 cover?
An RF switch device in a stacked configuration and a method of manufacturing the same seek to reduce or eliminate a voltage imbalance, a condition in which different voltages are applied to different stages of the RF switch device, by forming air gaps on or over corresponding gate electrodes, in which each of the air gaps in a single stage has a different width.
Who is the assignee on this patent?
Db Hitek Co Ltd
What technology area does this patent fall under?
Primary CPC classification H10W20/072. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Sep 02 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).