Offset alignment and repair in micro device transfer

Patent metadata

Field	Value
Publication number	US-12381104-B2
Application number	US-202117915561-A
Country	US
Kind code	B2
Filing date	Mar 30, 2021
Priority date	Mar 30, 2020
Publication date	Aug 5, 2025
Grant date	Aug 5, 2025

Abstract

This invention relates to the process of correcting misalignment and filling voids after a microdevice transfer process. The process involves transfer heads, measurement of offset and misalignment in horizontal, vertical, and rotational errors. An execution of the new offset vector for the next transfer corrects the alignment.

First claim

The invention claimed is:

1. A method to operate multiple transfer heads, the method comprising:
aligning each transfer head with an associated area in a system substrate;
transferring a set of microdevices in a donor substrate from at least one transfer head into the system substrate, the at least one transfer head being aligned with the donor substrate and picking the donor substrate;
moving each transfer head or the system substrate to enable an offset between each transfer head and the system substrate; and
having a new set of microdevices from the at least one transfer head into a new area in the system substrate, wherein alignment marks on the donor substrate are aligned with corresponding alignment marks in the system substrate.

2. The method of claim 1 , wherein the each transfer head is aligned optically or electrically.

3. The method of claim 1 , wherein the microdevices in the donor substrate are directly aligned to an intended position in the system substrate.

4. The method of claim 1 , wherein the at least one transfer head is loaded and aligned to a fixed area in the system substrate.

5. The method of claim 1 , wherein positions of marks are extracted from the system substrate.

6. The method of claim 5 , wherein the positions of marks include positions of marks in the donor substrate that are extracted each time the donor substrate is loaded in the at least one transfer head.

7. The method of claim 6 , wherein a misalignment is calculated for each loaded donor substrate based on at least one of the positions of marks extracted from the system substrate and the positions of marks extracted from the donor substrate.

8. The method of claim 1 , wherein the at least one transfer head is calibrated with the system substrate and sequentially moves the donor substrate into a proper position.

9. The method of claim 8 , wherein, in a first part of an alignment process, an alignment for the multiple transfer heads occurs followed by a second part of the alignment process of the transfer by each transfer head.

10. The method of claim 9 , wherein the first part comprises extracting or measuring alignment information.

11. The method of claim 10 , wherein the second part comprises an offsetting process.

12. The method of claim 11 , wherein the second part is performed for multiple transfer heads.

13. The method of claim 9 , wherein the donor substrate is loaded in a first transfer head and then the alignment is performed for the first transfer head followed by the transfer and offset process for the first transfer head.

14. The method of claim 13 , wherein after the steps of alignment and transfer and offset in claim 13 , the steps of alignment and transfer and offset in claim 13 are repeated for a second transfer head.

Assignees

• Vuereal Inc

Inventors

• Chaji Gholamreza

Classifications

• H10W72/0198

  batch processes · CPC title

• H10W46/301

  for alignment · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W72/071

  Connecting or disconnecting · CPC title

• H10W72/073

  of die-attach connectors · CPC title