Dressing ring

Patent metadata

Field	Value
Publication number	US-12358099-B2
Application number	US-202217816858-A
Country	US
Kind code	B2
Filing date	Aug 2, 2022
Priority date	Aug 11, 2021
Publication date	Jul 15, 2025
Grant date	Jul 15, 2025

Abstract

A dressing ring includes a ring-shaped dressing member for dressing a processing stone. Preferably, the dressing member has an opening in which a workpiece is arranged when the workpiece is ground. Also preferably, the dressing ring further includes a ring-shaped support plate having an upper surface on which the dressing member is fixed. In addition, a grinding method of the workpiece includes the steps of holding the ring-shaped dressing member on a holding surface of a chuck table, holding the workpiece in the opening of the dressing member such that a back surface of the workpiece is located higher than the upper surface of the dressing member, grinding the workpiece by grinding stones of a grinding wheel, and dressing the grinding stones with the dressing member on the holding surface.

First claim

What is claimed is:

1. A grinding method of a workpiece having a front surface and a back surface, comprising:
a dressing member holding step of holding a ring-shaped dressing member that has an upper surface and an opening and is for dressing a plurality of grinding stones of a grinding wheel, on a holding surface of a chuck table, the holding surface being capable of holding the workpiece thereon;
a workpiece holding step of holding the workpiece, with the front surface thereof directed downward, in the opening of the dressing member held on the holding surface such that the back surface of the workpiece is located higher than the upper surface of the dressing member;
a grinding step of grinding the workpiece by the grinding wheel that is rotating about an axis of rotation of a spindle; and
a dressing step of dressing the grinding stones with the dressing member by relatively moving the grinding wheel toward the holding surface while rotating the chuck table about a predetermined axis of rotation with the grinding wheel positioned above the dressing member and further outside of the workpiece in a radial direction of the holding surface.

2. The grinding method according to claim 1 , wherein the grinding step includes creep feed grinding that grinds the workpiece while relatively moving the grinding wheel and the chuck table in a predetermined direction orthogonal to a longitudinal direction of the spindle, the grinding wheel rotating about the axis of rotation of the spindle with lower surfaces of the grinding stones arranged at a predetermined height position lower than the back surface of the workpiece held on the holding surface but higher than the upper surface of the dressing member, the chuck table holding the workpiece thereon and not rotating about the predetermined axis of rotation.

3. The grinding method according to claim 1 , wherein the grinding step includes infeed grinding that grinds the workpiece while relatively moving the grinding wheel and the chuck table along a longitudinal direction of the spindle, the grinding wheel rotating about the axis of rotation of the spindle, the chuck table holding the workpiece thereon and rotating about the predetermined axis of rotation.

4. The grinding method according to claim 1 , wherein the dressing member contains abrasive grains of white alundum or green carbon and a bonding material comprising a vitrified bond or a resin bond.

5. The grinding method according to claim 1 , wherein the dressing member has a thickness of less than 1 mm.

6. The grinding method according to claim 1 , further comprising:
a ring-shaped support plate having an upper surface on which the dressing member is fixed.

7. The grinding method according to claim 6 , wherein the support plate is made of a resin or a composite material.

8. The grinding method according to claim 7 , wherein the support plate is made of an acrylic resin, a vinyl chloride resin, or glass fiber-reinforced polyethylene terephthalate.

9. The grinding method according to claim 6 ,
wherein the support plate has an outer diameter greater than that of the dressing member,
wherein the support plate has an opening, and
wherein the opening of the support plate and the opening of the dressing member have the same diameter.

10. The grinding method according to claim 1 , wherein the chuck table comprises:
a disc-shaped porous plate fixed in a recessed portion of a frame;
on an outer peripheral portion of the porous plate, a nonporous ring is disposed; and
on an outer peripheral portion of the nonporous ring, a porous ring is disposed, wherein the porous ring at an outer peripheral side surface thereof, is in contact with an inner peripheral side surface of the frame;
wherein the frame, the porous plate, the nonporous ring, and the porous ring are flush with one another at their upper surfaces, thereby constituting the holding surface of the chuck table.

11. The grinding method according to claim 10 ,
wherein the porous plate has the same in diameter as the workpiece;
wherein the outer diameter of the nonporous ring is the same as the inner diameter of the opening of the dressing member.

12. The grinding method according to claim 1 , wherein in the dressing step:
the rotational speed of the chuck table 10 is set at a predetermined value of 40 rpm or higher but 300 rpm or lower;
the rotational speed of the spindle is set at a predetermined value of 1,000 rpm or higher but 3,000 rpm or lower; and
the grinding feed rate is set at a predetermined value of 0.5 μm/s or higher but 6.0 μm/s or lower.

Assignees

• Disco Corp

Inventors

• Suzuki Yoshikazu
• Kihara Tomoharu

Classifications

• B24B7/228

  for grinding thin, brittle parts, e.g. semiconductors, wafers (grinding edges of thin, brittle parts B24B9/065) · CPC title

• B24B53/12 Primary

  Dressing tools; Holders therefor · CPC title

• B24B53/062 Primary

  using rotary dressing tools (B24B53/07 takes precedence) · CPC title

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title