Carrier head having abrasive structure on retainer ring

Patent metadata

Field	Value
Publication number	US-9604340-B2
Application number	US-201314105232-A
Country	US
Kind code	B2
Filing date	Dec 13, 2013
Priority date	Dec 13, 2013
Publication date	Mar 28, 2017
Grant date	Mar 28, 2017

Abstract

A carrier head includes a housing configured to enclose a wafer and a retainer ring attached to the housing. The retainer ring includes a body and an abrasive structure. The body includes an inner periphery configured to surround the wafer, an outer periphery, and a surface connecting the inner periphery and the outer periphery. The abrasive structure is attached to the surface of the body.

First claim

What is claimed is:

1. A carrier head comprising:
a housing configured to enclose a wafer; and
a retainer ring attached to the housing, the retainer ring comprising a body, comprising:
an inner periphery configured to surround the wafer;
an outer periphery; and
a surface connecting the inner periphery and the outer periphery; and
an abrasive structure attached to and partially covering the surface of the body;

a membrane support enclosed by the housing and having one or more ports configured to provide fluid or gas that independently regulate one or more pressures of one or more chambers having walls comprising a flexible membrane and the membrane support, wherein the flexible membrane has a lower surface configured to contact the wafer; and
wherein the retainer ring comprises grooves with a constant width that are arranged along a lower surface of the abrasive structure, and that extend radially outward from a center of the retainer ring between the inner periphery and the outer periphery.

2. The carrier head of claim 1 , wherein the abrasive structure comprises:
a reinforcement layer; and
abrasive particles partially buried in the reinforcement layer.

3. The carrier head of claim 2 , wherein the abrasive particles comprise diamonds.

4. The carrier head of claim 2 , wherein the reinforcement layer has a material comprising chrome, nickel, iron, manganese, cobalt, or aluminum oxide.

5. The carrier head of claim 2 , wherein the abrasive structure further comprises:
an adhesive layer between the reinforcement layer and the surface of the body.

6. The carrier head of claim 1 , wherein
the surface of the body is configured to have a texture, the texture comprising pyramids or cones; and
the abrasive structure comprises a film conformally formed on the surface.

7. The carrier head of claim 6 , wherein the film comprising at least one of:
a diamond film;
a metal oxide film comprising zirconium, chrome, titanium, aluminum, tantalum, cobalt, ruthenium, or tungsten; or
a metal nitride film comprising zirconium, chrome, titanium, aluminum, tantalum, cobalt, ruthenium, or tungsten.

8. The carrier head of claim 1 , wherein the abrasive structure partially covers the surface of the body.

9. The carrier head of claim 1 , wherein the grooves have a width ranging from 30 mm to 100 mm.

10. The carrier head of claim 1 , wherein the grooves extend in a direction that is normal to an interior surface of the retainer ring facing a center of the retainer ring and an exterior surface of the retainer ring facing away from the center.

11. A polishing system comprising:
a polishing pad;
a carrier head configured to enclose a wafer, the carrier head comprising a retainer ring configured to surround the wafer, and the retainer ring comprising an abrasive structure that partially covers a lower surface of the retainer ring and that is configured to maintain a roughness of an upper surface of the polishing pad within a predetermined range when the polishing pad and the carrier head are operated to polish the wafer at a predetermined removal rate;
a cushion member that is configured to adjust a position of the retainer ring based upon a pressure within the cushion member; and
a membrane support surrounded by the retainer ring and having one or more ports configured to provide fluid or gas that independently regulate one or more pressures within one or more chambers having walls comprising a flexible membrane and the membrane support, wherein the flexible membrane has a lower surface configured to contact the wafer.

12. The polishing system of claim 11 , wherein the abrasive structure comprises:
a reinforcement layer; and
abrasive particles partially buried in the reinforcement layer.

13. The polishing system of claim 12 , wherein the abrasive particles comprise diamonds.

14. The polishing system of claim 12 , wherein the reinforcement layer has a material comprising chrome, nickel, iron, manganese, cobalt, or aluminum oxide.

15. The polishing system of claim 11 , wherein
the retainer ring further comprises a body, the body having a surface, the surface of the body is configured to have a texture comprising pyramids or cones; and
the abrasive structure comprises a film conformally formed on the surface.

16. The polishing system of claim 11 , wherein
the retainer ring further comprises a body, and the body having a surface; and
the abrasive structure is attached to and partially covers the surface of the body.

17. The polishing system of claim 11 , wherein the retainer ring comprises grooves having a constant width arranged along a lower surface of the abrasive structure that face the polishing pad, which extend radially outward from a center of the retainer ring between edges of the retainer ring.

18. A carrier head comprising:
a housing configured to enclose a wafer, wherein the housing includes a retainer ring recess comprising a ring-shaped recess within a surface of the housing abutting a contact membrane support having one or more ports that control a pressure of a flexible membrane having a lower surface configured to contact the wafer;
a retainer ring attached to the housing between sidewalls of the retainer ring recess, the retainer ring comprising a body, comprising:
an inner periphery configured to surround the wafer;
an outer periphery;
a surface connecting the inner periphery and the outer periphery;
an abrasive structure comprising a film attached to and partially covering the surface of the body; and

a plurality of chambers comprising the flexible membrane and the contact membrane support, wherein the one or more ports are configured to provide fluid or gas that independently regulates pressures of the plurality of chambers.

19. The carrier head of claim 18 , wherein the film comprises diamonds.

20. The carrier head of claim 18 , wherein the retainer ring comprises grooves arranged along a lower surface of the abrasive structure, and extending radially outward from a center of the retainer ring between the inner periphery and the outer periphery.

Assignees

• Taiwan Semiconductor Mfg Co Ltd
• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Lin Chang-Sheng

Classifications

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• H10P52/402

  of semiconductor materials · CPC title

• B24B37/005

  Control means for lapping machines or devices · CPC title

• B24B37/10

  for single side lapping · CPC title

• B24B53/02

  of plane surfaces on abrasive tools (B24B53/017 takes precedence) · CPC title