Cutting apparatus

Patent metadata

Field	Value
Publication number	US-10022838-B2
Application number	US-201615331450-A
Country	US
Kind code	B2
Filing date	Oct 21, 2016
Priority date	Oct 21, 2015
Publication date	Jul 17, 2018
Grant date	Jul 17, 2018

Abstract

Disclosed herein is a cutting apparatus including a moving unit for moving a spindle to position a cutting blade, a rotary dressing mechanism for rotating a dressing grindstone on a rotational shaft parallel to the spindle, and an optical sensor for detecting the position of the outer periphery of the dressing grindstone. The cutting blade is positioned with respect to the rotary dressing mechanism depending on the position, detected by the optical sensor, of the outer periphery of the dressing grindstone, and the cutting blade is dressed by cutting into the dressing grindstone by a predetermined cutting distance.

First claim

What is claimed is:

1. A cutting apparatus comprising:
a chuck table for holding a workpiece thereon;
cutting means for cutting the workpiece held on said chuck table with a cutting blade mounted on a spindle, while supplying a cutting fluid to said cutting blade;
moving means for moving said spindle to position said cutting blade;
rotary dressing means for rotating a dressing grindstone on a rotational shaft parallel to said spindle; and
an optical sensor for detecting the position of the outer periphery of said dressing grindstone,
wherein said cutting blade is positioned with respect to said rotary dressing means depending on the position, detected by said optical sensor, of the outer periphery of said dressing grindstone, and said cutting blade is dressed by cutting into said dressing grindstone by a predetermined cutting distance.

2. The cutting apparatus according to claim 1 ,
wherein said optical sensor is positioned to apply an inspection light beam emitted therefrom toward the rotational shaft of said dressing grindstone to the outer peripheral surface of said dressing grindstone,
said cutting apparatus further comprises calculating means for calculating the diameter of said dressing grindstone on the basis of light reflected from the outer peripheral surface of said dressing grindstone to which said inspection light beam is applied, and
said cutting blade is positioned with respect to said rotary dressing means on the basis of the diameter of the dressing grindstone which is calculated by said calculating means, and said cutting blade is dressed by cutting into said dressing grindstone by said predetermined cutting distance.

3. The cutting apparatus according to claim 1 , further comprising:
a casing housing said optical sensor therein, said casing having an opening for passing the inspection light beam emitted from said optical sensor therethrough; and
air curtain forming means disposed near said opening,
wherein an air curtain formed by said air curtain forming means prevents debris and a cutting fluid from entering said casing through said opening and being applied to said optical sensor.

Assignees

• Disco Corp

Inventors

• Akita Soichiro
• Kiyokawa Satoshi

Classifications

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• B28D5/0058

  Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material (B28D5/0005, B28D5/024 take precedence) · CPC title

• B28D5/0094

  the supporting or holding device being of the vacuum type · CPC title

• B28D5/022 Primary

  by cutting with discs or wheels · CPC title

• B24B53/062

  using rotary dressing tools (B24B53/07 takes precedence) · CPC title