Method for manufacturing electronic device
US-2024134221-A1 · Apr 25, 2024 · US
US9238288B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9238288-B2 |
| Application number | US-201314104761-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 12, 2013 |
| Priority date | Dec 27, 2012 |
| Publication date | Jan 19, 2016 |
| Grant date | Jan 19, 2016 |
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In a method for processing a plate object, etching is performed for a flat plate object by a predetermined etching method and the shape of the plate object after the etching is grasped in advance. In a grinding step, the plate object is ground into a grinding-finished shape that is a non-flat shape obtained by inverting the shape of the plate object after the etching to the reverse shape. When subsequent etching by the predetermined etching method is performed for a grinding-target surface, the plate object is formed into a flat shape with a uniform thickness.
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What is claimed is: 1. A method for processing a plate object, the method comprising the steps of: performing pre-etching for a grinding-target surface of a first plate object that is flat prior to the pre-etching; checking a shape of the first plate object after the pre-etching; obtaining a grinding-finished-shape of a second plate object by inverting the shape of the first plate object after the pre-etching to the reverse shape; grinding the second plate object held by a holding table having a holding surface to hold the second plate object by a grinding unit having a grinding stone to thin the second plate object to a predetermined thickness having the grinding-finished-shape obtained; and etching a grinding-target surface of the second plate object after carrying out the grinding. 2. The method for processing a plate object according to claim 1 , wherein in the grinding, the second plate object is formed into the non-flat shape by performing grinding while making the grinding stone abut against the second plate object held by the holding table in a state in which the holding surface of the holding table that holds the second plate object and a grinding surface of the grinding stone are relatively inclined to be set non-parallel to each other. 3. The method for processing a plate object according to claim 1 , wherein the first and the second plate object each has a circular disc shape and a sectional shape of the first plate object checked in the checking is either a double-concave shape in which the periphery of the center of the first plate object has a concave shape or a double-convex shape in which the periphery of the center of the first plate object has a convex shape, the sectional shape of the second plate object is so formed as to become the double-convex shape in which the periphery of the center of the second plate object has a convex shape in the grinding, if the sectional shape of the first plate object checked in the checking is the double-concave shape in which the periphery of the center of the first plate object has a concave shape, and the sectional shape of the second plate object is so formed as to become the double-concave shape in which the periphery of the center of the second plate object has a concave shape in the grinding, if the sectional shape of the first plate object checked in the checking is the double-convex shape in which the periphery of the center of the first plate object has a convex shape.
involving a rotary work-table · CPC title
Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes · CPC title
of semiconductor materials · CPC title
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