Omni directional interconnect with magnetic fillers in mold matrix

Patent metadata

Field	Value
Publication number	US-12354883-B2
Application number	US-202117484315-A
Country	US
Kind code	B2
Filing date	Sep 24, 2021
Priority date	Sep 24, 2021
Publication date	Jul 8, 2025
Grant date	Jul 8, 2025

Abstract

Various embodiments disclosed relate to methods of making omni-directional semiconductor interconnect bridges. The present disclosure includes semiconductor assemblies including a mold layer having mold material, a first filler material dispersed in the mold material, and a second filler material dispersed in the mold material, wherein the second filler material is heterogeneously dispersed.

First claim

What is claimed is:

1. A semiconductor interconnect assembly comprising:
a mold layer having a first side and a second side, the mold layer comprising a mold material, a first filler material dispersed in the mold material, and a second filler material dispersed in the mold material, wherein the second filler material includes magnetic particles;
a die embedded in the mold layer;
one or more pillars extending in the mold layer from the first side to the second side; and
wherein the second filler material is more densely dispersed within the mold layer along a gradient between the first side and the second side.

2. The assembly of claim 1 , wherein the second filler material comprises nickel, cobalt iron, nickel iron, or combinations thereof.

3. The assembly of claim 1 , wherein the second filler material comprises particles having an average diameter of about less than one micron each.

4. The assembly of claim 1 , wherein the second filler material is heterogeneously dispersed within the mold layer.

5. The assembly of claim 1 , wherein the die comprises an interconnect bridge die.

6. The assembly of claim 5 , wherein the interconnect bridge die comprises one or more through die vias for communication from a top side to a bottom side of the interconnect bridge.

7. The assembly of claim 1 , wherein the pillars comprise power delivery pillars, data transmission pillars, or an inductor.

8. The assembly of claim 1 , wherein the second filler material is densely dispersed within the mold layer adjacent the one or more pillars.

9. The assembly of claim 1 , further comprising one or more vias extending in the mold layer from the first side to the second side, each of the one or more vias filled with the second filler material.

10. The assembly of claim 1 , wherein the one or more pillars comprise the second filler material.

11. The assembly of claim 1 , further comprising one or more low filler areas with a lesser density of the second filler material compared to one or more high filler areas; and
one or more vias extending in the mold layer from the first side to the second side, the one or more vias located in the one or more low filler areas.

12. A semiconductor assembly comprising:
a layer having a first side and a second side, the layer comprising:
a resin material;
magnetic particles dispersed in the resin material; and
dielectric particles dispersed in the resin material;

a bridge die embedded in the layer;
one or more pillars extending in the layer from the first side to the second side; and
a ferromagnetic layer on the one or more pillars,
wherein the magnetic particles are more densely dispersed within the layer adjacent the one or more pillars.

13. The assembly of claim 12 , wherein the one or more pillars each comprise copper pillars.

14. The assembly of claim 12 , wherein the one or more pillars each comprise power delivery pillars.

15. A semiconductor assembly comprising:
a mold layer having a first side and a second side, the mold layer comprising a mold material, a first filler material dispersed in the mold material, and a second filler material dispersed in the mold material, wherein the second filler material includes magnetic particles;
one or more low filler areas with a lesser density of the second filler material compared to one or more high filler areas;
a bridge die embedded in the mold layer;
one or more power delivery pillars extending in the mold layer from the first side to the second side; and
one or more vias extending in the mold layer from the first side to the second side, the one or more vias located in the one or more low filler areas.

16. The assembly of claim 15 , wherein the second filler material comprises a thermally conductive material.

17. The assembly of claim 16 , wherein the magnetic particles comprise silver, aluminum, graphite, graphene, diamond, or combinations thereof.

18. The assembly of claim 15 , wherein the mold material further comprises a liquid metal, stress absorber material, dielectric material, or combinations thereof.

Assignees

• Intel Corp

Inventors

• Shan Bohan
• Xu Dingying
• Darmawikarta Kristof
• Pietambaram Srinivas Venkata Ramanuja
• Feng Hongxia
• Duan Gang
• Han Jung Kyu
• Guo Xiaoying
• Ecton Jeremy D
• Tripathi Santosh
• Nie Bai
• Chen Haobo
• Arrington Kyle Jordan
• Deng Yue
• Wei Wei

Classifications

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title

• H10W76/48

  Fillings including materials for absorbing or reacting with moisture or other undesired substances · CPC title

• H10W76/47

  Solid or gel fillings · CPC title

• H10W74/473 Primary

  containing a filler · CPC title

• H10W74/016

  using moulds · CPC title