Integrated electronic device having a dissipative package, in particular dual side cooling package

Patent metadata

Field	Value
Publication number	US-10535587-B2
Application number	US-201514961586-A
Country	US
Kind code	B2
Filing date	Dec 7, 2015
Priority date	Feb 4, 2015
Publication date	Jan 14, 2020
Grant date	Jan 14, 2020

Abstract

Packaged semiconductor device having a frame, of conductive material; a body of semiconductor material, fixed to the frame through a first adhesive layer; a heat-sink element, fixed to the body through a second adhesive layer; and a packaging mass surrounding the body and, at least partially, the frame and the heat-sink element. The heat-sink element is formed by a heat-sink die facing, and coplanar to, a main face of the device and by a spacer structure, which includes a pair of pedestals projecting from the perimeter of the heat-sink die towards the body and rest on the body.

First claim

The invention claimed is:

1. A packaged semiconductor device comprising:
a frame of conductive material;
first and second adhesive materials;
a die of semiconductor material fixed to the frame by the first adhesive material, the die having a surface having a center portion and a perimeter portion, the perimeter portion extending around the center portion;
a heat-sink including a main portion forming a main perimeter of the heat sink and a plurality of spacer structures extending laterally from the main perimeter of the main portion and vertically toward the die, the second adhesive material having a first portion that directly couples the main portion to at least the surface of the die at the center portion and a second portion that directly couples the plurality of spacer structures to the surface of the die at the perimeter portion, wherein the plurality of spacer structures project laterally at the main perimeter of the heat-sink and forms an outer perimeter edge of the heat-sink, the plurality of spacer structures having a surface that is a first distance from the die, the main portion having a surface that is a second distance from the die, wherein the first distance is less than the second distance; and
a packaging mass surrounding the die and at least a portion of the frame and the heat-sink, the packaging mass having a surface that is coplanar with a surface of the main portion of the heat-sink.

2. The device according to claim 1 , wherein the plurality of spacer structures include at least two pedestals extending from a same side of the main perimeter portion of the main portion of the heat-sink and forms outer perimeter edges of the heat-sink.

3. The device according to claim 2 , wherein the at least two pedestals are coined.

4. The device according to claim 1 , wherein the frame includes a plate and at least one terminal, and the heat-sink includes a support portion that is bent, with respect to the main portion of the heat-sink, towards the terminal, the main portion of the heat-sink having a regular polygonal shape with sides, wherein a resting portion extends from a first side of the main portion of the heat-sink, and the plurality of spacer structures extend from a side opposite to the first side or from a side adjacent to the first side.

5. The device according to claim 1 , wherein the heat-sink is made of a metal material.

6. The device according to claim 1 , wherein the packaging mass completely covers the plurality of spacer structures.

7. The device according to claim 1 , wherein the main portion of the heat-sink has a rectangular or square shape and is surrounded by the packaging mass, the main portion of the heat-sink having a surface that is completely exposed outside of the device.

8. The device according to claim 1 , wherein the second adhesive material is a solder material, wherein:
a first solder layer couples the main portion of the heat-sink to the die and has a first thickness, and
a second solder layer couples the plurality of spacer structures to the die and has a second thickness smaller than the first thickness.

9. A semiconductor package comprising:
a leadframe including a die pad and at least one terminal;
a die of semiconductor material coupled to the die pad, the die having a surface having a center portion and a perimeter portion;
a heat-sink including a main portion forming a main perimeter portion and a plurality of spacer structures extending laterally from a side of the main perimeter portion of the main portion and vertically towards the die, the main portion coupled to the center portion of the surface of the die by a first adhesive layer, the plurality of spacer structure coupled to the perimeter portion of the surface of the die by a second adhesive layer, the second adhesive layer being thinner than the first adhesive layer, the second adhesive layer being of a same adhesive material as the first adhesive layer, the plurality of spacer structures having a surface that is a first distance from the die, the main portion having a surface that is a second distance from the die, wherein the first distance is less than the second distance; and
packaging material surrounding the die and a portion of the die pad and the heat-sink, the packaging material being a material that is distinct from the first and second adhesive layers, a surface of the main portion of the heat-sink remaining exposed from the packaging material.

10. The semiconductor package according to claim 9 ,
wherein the plurality of spacer structures each have a width that is substantially less than a width of the side of the main perimeter portion.

11. The semiconductor package according to claim 9 ,
wherein the first and second adhesive layers are solder and the packaging material is a molded packaging mass.

12. The semiconductor package according to claim 9 ,
wherein the packaging material completely surrounds the plurality of spacer structures of the heat-sink.

13. The semiconductor package according to claim 9 ,
wherein the plurality of spacer structures extend from a same side of the main perimeter portion.

14. A packaged semiconductor device comprising:
a frame of conductive material including a die pad and a terminal;
a die of semiconductor material coupled to the die pad, the die having a surface having a center portion and a perimeter portion;
a heat-sink element coupled to the die, the heat-sink element having a main portion coupled to the surface of the die at the center portion, the main portion having a main perimeter, the heat-sink element having at least one pair of pedestals projecting laterally from side surfaces of the main perimeter of the main portion and projecting vertically towards the surface of the die at the perimeter portion, the at least one pair of pedestals being narrower than the side surfaces of the main perimeter, the at least one pair of pedestals being coupled to the surface of the die at the perimeter portion, the at least one pair of pedestals forming an outer perimeter edge of the heat-sink element, the at least one pair of pedestals having a surface that is a first distance from the die, the main portion having a surface that is a second distance from the die, wherein the first distance is less than the second distance; and
a packaging material surrounding the die, and at least partially, the frame and the heat-sink element, the at least one pair of pedestals embedded in the packaging material, an outer surface of the packaging material being flush with an exposed surface of the heat-sink element.

15. The device according to claim 14 , wherein the heat-sink element includes a support portion extending from the main portion towards the terminal, the support portion being bent and coupled to the terminal by an adhesive layer.

16. The device according to claim 15 , wherein the at least one pair of pedestals project from a same side of the main portion of the heat-sink element.

17. The device according to claim 15 , wherein each pedestals of the at least one pair of pedestals project from opposite sides of the main portion of the heat-sink element.

18. The device according to claim 15 , wherein the at least one pair of pedestals extend from a side opposite the support portion.

19. The device according to claim 15 , wherein the at least one pair of pedestals project from an end region of the main portion that is opposite from the support portion.

Assignees

• St Microelectronics Srl

Inventors

• Privitera Concetto
• Ferrara Maurizio Maria
• Coppone Fabio Vito

Classifications

• H10W90/766

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W76/60

  Seals · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W70/466 Primary

  Tape carriers or flat leads · CPC title

• H10W40/00

  Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60) · CPC title