Semiconductor device and method of forming an optical semiconductor package with a shield structure

Patent metadata

Field	Value
Publication number	US-12302657-B2
Application number	US-202217664510-A
Country	US
Kind code	B2
Filing date	May 23, 2022
Priority date	May 28, 2021
Publication date	May 13, 2025
Grant date	May 13, 2025

Abstract

A semiconductor device has a substrate. A semiconductor die including a photosensitive circuit is disposed over the substrate. A shield is disposed over the substrate and semiconductor die with a first opening of the shield disposed over the photosensitive circuit. An outer section of the shield is attached to the substrate and includes a second opening. An encapsulant is deposited over the substrate and semiconductor die. The encapsulant extends into the first opening and a first area between the shield and substrate while a second area over the photosensitive circuit remains devoid of the encapsulant.

First claim

What is claimed:

1. A semiconductor device, comprising:
a substrate;
a semiconductor die including a photosensitive circuit disposed over the substrate;
a shield disposed over the substrate and semiconductor die with a first opening of the shield disposed over the photosensitive circuit, wherein the shield includes a peak, an inner section oriented toward the semiconductor die relative to the peak, and an outer section oriented away from the semiconductor die relative to the peak, and wherein the outer section of the shield is attached to the substrate and includes a second opening formed through a sloped portion of the outer section;
a bead of adhesive extending around the photosensitive circuit between the shield and semiconductor die; and
an encapsulant deposited over the substrate and semiconductor die, wherein the encapsulant extends into the second opening and a first area between the shield and substrate while the bead of adhesive seals a gap between the shield and semiconductor die so that a second area over the photosensitive circuit remains devoid of the encapsulant.

2. The semiconductor device of claim 1 , further including a lens disposed on the shield over the first opening.

3. The semiconductor device of claim 2 , wherein a height of the shield over the substrate is greater than a distance from the substrate to a top of the lens.

4. The semiconductor device of claim 2 , wherein the inner section of the shield provides physical separation between the lens and the encapsulant.

5. The semiconductor device of claim 1 , further including a bond wire coupled between the semiconductor die and a contact pad of the substrate.

6. The semiconductor device of claim 5 , wherein the shield is coupled to the contact pad of the substrate.

7. A semiconductor device, comprising:
a substrate;
a semiconductor die including a photosensitive circuit disposed over the substrate; and
a shield disposed over the substrate and semiconductor die with a first opening of the shield disposed over the photosensitive circuit, wherein the shield includes a peak, an inner section oriented toward the semiconductor die relative to the peak, and an outer section oriented away from the semiconductor die relative to the peak, and wherein the outer section of the shield includes a second opening.

8. The semiconductor device of claim 7 , further including a lens disposed on the shield over the first opening.

9. The semiconductor device of claim 8 , wherein the lens includes a curved surface.

10. The semiconductor device of claim 7 , further including a step formed in the outer section or the inner section of the shield.

11. The semiconductor device of claim 7 , further including a mold plate physically contacting a top of the shield around the photosensitive circuit.

12. The semiconductor device of claim 11 , further including an encapsulant deposited into the mold, wherein the encapsulant extends into the second opening.

13. The semiconductor device of claim 12 , further including a bead of adhesive extending around the photosensitive circuit between the shield and semiconductor die, wherein the encapsulant extends to the bead of adhesive.

14. A method of making a semiconductor device, comprising:
providing a substrate;
disposing a semiconductor die including a photosensitive circuit over the substrate;
disposing a shield over the substrate and semiconductor die with a first opening of the shield disposed over the photosensitive circuit, wherein the shield includes a peak, an inner section oriented toward the semiconductor die relative to the peak, and an outer section oriented away from the semiconductor die relative to the peak, and wherein the outer section of the shield includes a second opening; and
depositing an encapsulant over the substrate and semiconductor die, wherein the encapsulant flows through the second opening to fill an area between the shield and the substrate.

15. The method of claim 14 , wherein the inner section of the shield blocks encapsulant from covering the photosensitive circuit while depositing the encapsulant.

16. The method of claim 14 , further including disposing a lens over the first opening.

17. The method of claim 14 , further including disposing the substrate, semiconductor die, and shield into a mold, wherein the mold physically contacts a top of the shield.

18. The method of claim 17 , further including applying pressure to the top of the shield with the mold, wherein the shield compresses to absorb a portion of the pressure.

19. The method of claim 14 , wherein the outer section of the shield includes a step.

20. The method of claim 14 , wherein the inner section of the shield includes a step.

Assignees

• Utac Headquarters Pte Ltd

Inventors

• Espiritu Emmanuel
• Shim Il Kwon
• Punzalan Jeffrey
• Carreon Teddy Joaquin

Classifications

• H10W74/131

  the semiconductor body being only partially enclosed · CPC title

• H10F39/8063 Primary

  Microlenses · CPC title

• H10F39/811

  Interconnections · CPC title

• H10F39/804

  Containers or encapsulations · CPC title

• H10F39/011

  Manufacture or treatment of image sensors covered by group H10F39/12 · CPC title