Camera module, method of manufacturing the same, and electronic apparatus

Patent metadata

Field	Value
Publication number	US-11614606-B2
Application number	US-201816490994-A
Country	US
Kind code	B2
Filing date	Mar 2, 2018
Priority date	Mar 15, 2017
Publication date	Mar 28, 2023
Grant date	Mar 28, 2023

Abstract

There is provided a camera module including a first lens substrate having a light-incident side. The first lens substrate includes a lens disposed at an inner side of a through-hole of the first lens substrate, and a wiring layer disposed at an opposite side of the light-incident side of the first lens substrate. The camera module may include an imaging element including a pixel array disposed at a light-incident side of a substrate, where the imaging element is electrically connected to the wiring layer of the first lens substrate, and where a width of the imaging element in a direction parallel to the light-incident surface of the imaging element is smaller than a width of the first lens substrate in the direction parallel to the light-incident surface of the first lens substrate.

First claim

What is claimed is:

1. A camera module, comprising:
a first lens substrate having a light-incident side, the first lens substrate including:
a lens,

wherein an antireflection film covers an upper surface of the lens;
a through-hole having a downward tapering shape such that a top opening of the through-hole formed at the light-incident side is larger than a bottom opening of the through-hole, wherein the lens is disposed completely within the through-hole; and

a wiring layer disposed at an opposite side of the light-incident side of the first lens substrate; and
an imaging element including a pixel array disposed at a light-incident side of a substrate,
wherein the imaging element is electrically connected to the wiring layer of the first lens substrate, and
wherein a width of the imaging element in a direction parallel to a light-incident surface of the imaging element is smaller than a width of the first lens substrate in the direction parallel to the light-incident side of the first lens substrate.

2. The camera module according to claim 1 , wherein the first lens substrate is directly bonded to a second lens substrate.

3. The camera module according to claim 2 , further comprising:
a first layer formed on the first lens substrate; and
a second layer formed on the second lens substrate, wherein each of the first and second layers include one or more of an oxide material, nitride material and carbon material.

4. The camera module according to claim 3 , wherein the first lens substrate is directly bonded to the second lens substrate via the first layer and the second layer.

5. The camera module according to claim 4 , wherein the first layer and the second layer include a plasma bonded portion.

6. The camera module according to claim 1 , further comprising: a first connection terminal attached to the first lens substrate such that the wiring layer is electrically connected to the first lens substrate.

7. The camera module according to claim 1 , wherein the first lens substrate includes a passive component mounted thereon.

8. The camera module according to claim 6 , wherein the first connection terminal includes a solder ball, and wherein a diameter of the solder ball is greater than a thickness of the imaging element.

9. The camera module according to claim 6 , wherein the wiring layer of the first lens substrate and the imaging element are electrically connected to each other by a second connection terminal.

10. The camera module according to claim 9 , wherein the second connection terminal includes a metal stud bump, a solder ball, or a copper pillar.

11. The camera module according to claim 9 , further comprising: an underfill resin layer covering the second connection terminal.

12. The camera module according to claim 1 , wherein the wiring layer of the first lens substrate and the imaging element are electrically connected to each other by one of an anisotropic conductive resin and metal bonding.

13. The camera module according to claim 1 , further comprising a light-blocking film disposed at an inner side of the through-hole formed in the first lens substrate.

14. The camera module according to claim 1 , wherein a diameter of the through-hole at a surface of the first lens substrate nearest to the imaging element is smaller than a diameter of the through-hole at a surface of the first lens substrate opposite to the surface of the first lens substrate nearest to the imaging element.

15. A method of manufacturing a camera module, comprising:
mounting an imaging element to a wiring layer of a first lens substrate such that the imaging element is electrically connected to the wiring layer,
wherein the first lens substrate has a light-incident side and includes a lens,
wherein an antireflection film covers an upper surface of the lens,
wherein the first lens substrate further includes a through-hole having a downward tapering shape such that a top opening of the through-hole formed at the light-incident side is larger than a bottom opening of the through-hole,
wherein the lens is disposed completely within the through-hole,
wherein the wiring layer is disposed at an opposite side of the light-incident side of the first lens substrate, and
wherein a width of the imaging element in a direction parallel to a light-incident surface of the imaging element is smaller than a width of the first lens substrate in the direction parallel to the light-incident side of the first lens substrate.

16. The method of manufacturing the camera module according to claim 15 , further comprising: forming the through-hole and the lens in the first lens substrate after the wiring layer is formed on the first lens substrate.

17. The method of manufacturing the camera module according to claim 15 further comprising: forming the wiring layer on the first lens substrate after the through-hole and the lens are formed in the first lens substrate.

18. The method of manufacturing the camera module according to claim 15 , further comprising: mounting a connection terminal formed at the light-incident surface of the imaging element such that the first lens substrate is electrically connected to the imaging element.

19. The method of manufacturing the camera module according to claim 15 , wherein the wiring layer of the first lens substrate includes a connection terminal, and wherein the imaging element is mounted to the connection terminal and electrically connected thereto.

20. The method of manufacturing the camera module according to claim 15 , further comprising: dividing the first lens substrate after divided imaging elements are mounted to the wiring layer of the first lens substrate and electrically connected thereto.

21. The method of manufacturing the camera module according to claim 15 , wherein the wiring layer is formed on the first lens substrate by a semi additive method.

22. An electronic apparatus, comprising:
a camera module including:
a first lens substrate having a light-incident side, the first lens substrate including:
a lens,

wherein an antireflection film covers an upper surface of the lens;
a through-hole having a downward tapering shape such that a top opening of the through-hole formed at the light-incident side is larger than a bottom opening of the through-hole, wherein the lens is disposed completely within the through-hole; and
a wiring layer disposed at an opposite side of the light-incident side of the first lens substrate; and

an imaging element including a pixel array disposed at a light-incident side of a substrate,
wherein the imaging element is electrically connected to the wiring layer of the first lens substrate, and
wherein a width of the imaging element in a direction parallel to a light-incident surface of the imaging element is smaller than a width of the first lens substrate in the direction parallel to the light-incident side of the first lens substrate.

Assignees

• Sony Semiconductor Solutions Corp

Inventors

• Komai Naoki

Classifications

• H10F39/024

  of coatings or optical elements · CPC title

• H10F39/806

  Optical elements or arrangements associated with the image sensors · CPC title

• H10F39/804

  Containers or encapsulations · CPC title

• H10F39/026 Primary

  Wafer-level processing · CPC title

• H10F39/802

  Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes · CPC title