Planarization apparatus, planarization process, and method of manufacturing an article

Patent metadata

Field	Value
Publication number	US-12283522-B2
Application number	US-202218054487-A
Country	US
Kind code	B2
Filing date	Nov 10, 2022
Priority date	Jan 31, 2020
Publication date	Apr 22, 2025
Grant date	Apr 22, 2025

Abstract

A superstrate for planarizing a substrate. The superstrate includes a body having a first side having a contact surface and a second side having a central portion and a peripheral portion surrounding the central portion. The peripheral portion includes a recessed region.

First claim

What is claimed is:

1. A superstrate for planarizing a formable material on a substrate, wherein the superstrate is held by a chuck comprising a plurality of lands defining a central zone and a peripheral zone surrounding the central zone, the superstrate comprising:
a first side and a second side opposite to the first side;
an outermost edge; and
a mesa formed on the first side, wherein an edge of the mesa is positioned inside from the outermost edge, and wherein the mesa has a planar contact surface to be in contact with the formable material on the substrate;
wherein the second side has a central portion and a peripheral portion surrounding the central portion, and the peripheral portion includes a surface depressed in such a way as to form a step with respect to the central portion, and
wherein the depressed surface of the superstrate held by the chuck has a contact surface to be in contact with an outer land among the plurality of lands of the chuck.

2. The superstrate of claim 1 , wherein the depressed surface is concentric with the superstrate.

3. The superstrate of claim 1 , wherein the depressed surface includes a stepped down surface extending circumferentially throughout the peripheral portion of the second side.

4. The superstrate of claim 1 , wherein the depressed surface of the second side has a radial width wider than the radial width from the edge of the mesa to the edge of the superstrate.

5. The superstrate of claim 1 , wherein the depressed surface of the second side has a radial width equal to the radial width from the edge of the mesa to the edge of the superstrate.

6. The superstrate of claim 1 , wherein the depressed surface further comprises a trench extending circumferentially between the central portion and an edge of the second side.

7. A superstrate for planarizing a formable material on a substrate, the superstrate comprising:
a first side and a second side opposite to the first side;
an outermost edge; and
a mesa formed on the first side, wherein an edge of the mesa is positioned inside from the outermost edge and wherein the mesa has a planar contact surface to be in contact with the formable material on the substrate, wherein the planar contact surface has no pattern feature,
wherein the second side has a central portion and a peripheral portion surrounding the central portion, and the peripheral portion includes a surface depressed in such a way as to form a step with respect to the central portion, and
wherein the depressed surface has a contact surface to be in contact with an outer land among a plurality of lands of a chuck configured to hold the superstrate.

8. The superstrate of claim 1 , wherein the depressed surface is curved in a state that the contact surface of the depressed surface contacts the outer land among the plurality of lands of the chuck.

9. The superstrate of claim 1 , wherein the planar contact surface has no pattern feature.

Assignees

• Canon Kk

Inventors

• Bamesberger Seth J
• Ozturk Ozkan
• Jones Christopher Ellis
• Im Se-Hyuk

Classifications

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• H10P95/04

  Planarisation of conductive or resistive materials · CPC title

• H10W20/062 Primary

  by smoothing of conductive parts, e.g. by planarisation · CPC title

• H10P95/08

  Planarisation of organic insulating materials · CPC title

• H10P72/0428 Primary

  Apparatus for mechanical treatment or grinding or cutting · CPC title