Two-phase immersion-type composite heat dissipation device

Patent metadata

Field	Value
Publication number	US-12207445-B2
Application number	US-202318154858-A
Country	US
Kind code	B2
Filing date	Jan 16, 2023
Priority date	Jan 16, 2023
Publication date	Jan 21, 2025
Grant date	Jan 21, 2025

Abstract

A two-phase immersion-type composite heat dissipation device is provided, which includes a heat dissipation substrate, a plurality of fins, and a surface porous layer. The heat dissipation substrate has a first surface and a second surface. The first surface is configured to be in contact with a heat source, and the second surface is opposite to the first surface and is distant from the heat source. A projection region of the heat dissipation substrate that corresponds to the heat source is defined as a high-temperature region, and a low-temperature region is defined at an outer periphery of the high-temperature region. The fins are opposite to the heat source, and are disposed within the high-temperature region of the second surface of the heat dissipation substrate. The surface porous layer is disposed within a range of the low-temperature region of the heat dissipation substrate.

First claim

What is claimed is:

1. A two-phase immersion-type composite heat dissipation device, comprising:
a heat dissipation substrate having a first surface and a second surface, wherein the first surface is configured to be in contact with a heat source, and the second surface is opposite to the first surface and is distant from the heat source; wherein a projection region of the heat dissipation substrate that corresponds to the heat source is defined as a high-temperature region, and a low-temperature region is defined at an outer periphery of the high-temperature region;
a plurality of fins opposite to the heat source and disposed within the high-temperature region of the second surface of the heat dissipation substrate; and
a surface porous layer disposed within a range of the low-temperature region of the heat dissipation substrate.

2. The two-phase immersion-type composite heat dissipation device according to claim 1 , wherein a material of the fins is made from copper, a copper alloy, aluminum, or an aluminum alloy.

3. The two-phase immersion-type composite heat dissipation device according to claim 1 , wherein the fins are formed by one of following manufacturing processes: a bending process, a forging process, an extrusion process, or a powder sintering process.

4. The two-phase immersion-type composite heat dissipation device according to claim 1 , wherein the fins have a height greater than 3 mm and a porosity less than 15%.

5. The two-phase immersion-type composite heat dissipation device according to claim 1 , wherein the fins cover 90% of a region that is located directly above the heat source.

6. The two-phase immersion-type composite heat dissipation device according to claim 1 , wherein a material of the surface porous layer is made from copper, a copper alloy, an aluminum alloy, graphite, or silver.

7. The two-phase immersion-type composite heat dissipation device according to claim 1 , wherein the surface porous layer is arranged on the second surface, and covers 70% of a surface area of the second surface aside from the surface area occupied by the fins.

8. The two-phase immersion-type composite heat dissipation device according to claim 1 , wherein the surface porous layer is arranged on the first surface, and covers 20% of a surface area of the first surface aside from the surface area occupied by an orthogonal projection of the heat source.

9. The two-phase immersion-type composite heat dissipation device according to claim 1 , wherein the surface porous layer has a thickness less than 1.2 mm and a porosity greater than 40%.

10. The two-phase immersion-type composite heat dissipation device according to claim 1 , wherein the surface porous layer is formed by one of following manufacturing processes: a metal mesh process, a chemical etching process, a powder sintering process in cooperation with a pore-forming agent, a chemical deposition process, an electroplating process, a vapor deposition process, or a machining process.

Assignees

• Amulaire Thermal Tech Inc

Inventors

• Wu Chun-Te
• Yang Ching-Ming
• Chiu Yu-Wei
• Yeh Tze-Yang

Classifications

• H10W40/257

  having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures (H10W40/254, H10W40/251 take precedence) · CPC title

• H10W40/22

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title

• H10W40/30 Primary

  wherein the packaged device is completely immersed in a fluid other than air, e.g. immersed in a cryogenic fluid · CPC title

• H05K7/203

  by immersion · CPC title

• H05K7/20809

  within server blades for removing heat from heat source · CPC title