Thermally conductive silicone composition, production method thereof, and semiconductor device
US-12104113-B2 · Oct 1, 2024 · US
Silicone-based thermal interface materials
US2017148706A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2017148706-A1 |
| Application number | US-201715426249-A |
| Country | US |
| Kind code | A1 |
| Filing date | Feb 7, 2017 |
| Priority date | Sep 16, 2015 |
| Publication date | May 25, 2017 |
| Grant date | — |
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Abstract
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In an example, a silicone-based thermal interface material includes a thermally conductive material and a silicone-based polymeric material having a solubility parameter that is not less than 9.09 cal1/2 cm−3/2.
First claim
Opening claim text (preview).
1 . An apparatus comprising: a first component representing a heat source; a second component; and a silicone-based thermal interface material disposed between the first component and the second component, the silicone-based thermal interface material comprising: a thermally conductive material; and a silicone-based polymeric material having a solubility parameter that is not less than 9.09 cal 1/2 cm 3/2 . 2 . The apparatus of claim 1 , wherein the first component includes an integrated circuit, and wherein the second component includes a heat sink. 3 . The apparatus of claim 1 , wherein the solubility parameter of the silicone-based polymeric material is shifted by at least 2 cal 1/2 cm −3/2 from a second solubility parameter of an immersion cooling fluid. 4 . The apparatus of claim 3 , wherein the immersion cooling fluid includes mineral oil having the second solubility parameter of 7.09 cal 1/2 cm −3/2 . 5 . The apparatus of claim 1 , wherein the silicone-based polymeric material includes a grafted polydimethylsiloxane (PDMS) material having pendant alcohol groups.
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Classifications
Organics · CPC title
wherein the packaged device is completely immersed in a fluid other than air, e.g. immersed in a cryogenic fluid · CPC title
- H01L23/3737Primary
Electricity · mapped topic
containing only polysiloxane sequences · CPC title
Electricity · mapped topic
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Frequently asked questions
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- What does patent US2017148706A1 cover?
- In an example, a silicone-based thermal interface material includes a thermally conductive material and a silicone-based polymeric material having a solubility parameter that is not less than 9.09 cal1/2 cm−3/2.
- Who is the assignee on this patent?
- IBM
- What technology area does this patent fall under?
- Primary CPC classification H01L23/3737. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu May 25 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).