Ultrasound assisted immersion cooling

Patent metadata

Field	Value
Publication number	US-9516792-B2
Application number	US-201514668331-A
Country	US
Kind code	B2
Filing date	Mar 25, 2015
Priority date	Mar 25, 2015
Publication date	Dec 6, 2016
Grant date	Dec 6, 2016

Abstract

Apparatuses, methods and storage media associated with cooling one or more heat-generating components of an electronic device are disclosed herein. In embodiments, an electronic device may include a tank that may include a dielectric fluid and one or more heat-generating components. The electronic device may further include one or more transducers coupled with the tank. The transducers may be configured to generate an ultrasonic wave that controls movement of the dielectric fluid at a location within the tank. Other embodiments may be described and/or claimed.

First claim

What is claimed is:

1. An apparatus comprising:
a tank to hold a dielectric fluid and one or more heat-generating components; and
a transducer located external to and coupled with the tank, the transducer to generate an ultrasound wave that controls movement of the dielectric fluid at a location within a vicinity of at least one of the one or more heat-generating components within the tank.

2. The apparatus of claim 1 , wherein the ultrasound wave is to control the movement of the dielectric fluid via Schlichting streaming.

3. The apparatus of claim 1 , wherein the ultrasound wave is to control the movement of the dielectric fluid via Eckart acoustic streaming such that energy of the ultrasound wave is attenuated in the dielectric fluid via Reynolds-stress like mechanisms.

4. The apparatus of claim 1 , further comprising a pump coupled with the tank, the pump to cause movement of the dielectric fluid within the tank.

5. The apparatus of claim 1 , wherein the apparatus is a blade server.

6. The apparatus of claim 1 , wherein the apparatus is a chassis that includes a plurality of blade servers.

7. The apparatus of claim 1 , wherein the apparatus is a rack that includes a plurality of chassis with respective pluralities of blade servers.

8. The apparatus of claim 1 , wherein the transducer is to generate an ultrasound wave with a frequency between 20 kilohertz and 30 Megahertz.

9. The apparatus of claim 1 , wherein the transducer is further to generate an ultrasound wave to clean the one of the one or more heat-generating components within the tank.

10. The apparatus of claim 1 , wherein one of the one or more heat-generating components includes a processor, a central processing unit (CPU), or a memory stack, and the tank includes the dielectric fluid and the processor, the central processing unit (CPU), or the memory stack.

11. A system comprising:
a tank comprising one or more heat-generating components immersed in a dielectric fluid;
one or more transducers coupled with the tank at a position external to the tank; and
logic coupled with the one or more transducers, the logic to control the transducers to generate an ultrasound wave to cause movement of the dielectric fluid at a controlled location within a vicinity of one of the one or more heat-generating components.

12. The system of claim 11 , wherein the apparatus is a blade server, a chassis that includes a plurality of blade servers, or a rack that includes a plurality of chassis with respective pluralities of blade servers.

13. The system of claim 11 , wherein the logic is to cause generation of an ultrasound wave with a frequency between 20 kilohertz and 30 Megahertz.

Assignees

• Intel Corp

Inventors

• Krishnan Shankar
• Stamey Richard C
• Jarrett Brian S
• Von Allmen Geoffrey G

Classifications

• H10W40/30

  wherein the packaged device is completely immersed in a fluid other than air, e.g. immersed in a cryogenic fluid · CPC title

• H05K7/20772 Primary

  within server blades for removing heat from heat source · CPC title

• H05K7/20281

  Thermal management, e.g. liquid flow control · CPC title

• H05K7/20836 Primary

  Thermal management, e.g. server temperature control · CPC title

• H05K7/2079

  within rooms for removing heat from cabinets · CPC title