Power electronics unit having at least one semiconductor module attached by means of a plastic holder
US-2022225547-A1 · Jul 14, 2022 · US
US12185504B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12185504-B2 |
| Application number | US-202318169090-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 14, 2023 |
| Priority date | Feb 15, 2022 |
| Publication date | Dec 31, 2024 |
| Grant date | Dec 31, 2024 |
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An electrical circuit device comprises at least one first power electronics module, at least one second power electronics module, a circuit board and a supporting structure, wherein the power electronics modules each lie by a contact side against an associated contact surface of the supporting structure and have one or more terminal pins connected to the circuit board on and/or next to a connection side situated opposite the contact side, wherein the first power electronics module has a lesser thickness between the contact side and the connection side than the second power electronics module, wherein the contact surface against which the contact side of the first power electronics module bears has a lesser distance from the circuit board than the contact surface against which the contact side of the second power electronics module bears, and/or wherein the terminal pins of the first power electronics module are longer than the terminal pins of the second power electronics module.
Opening claim text (preview).
The invention claimed is: 1. An electrical circuit device, comprising: at least one first power electronics module, at least one second power electronics module, a circuit board, and a supporting structure, wherein the power electronics modules each lie by a contact side against an associated contact surface of the supporting structure and have one or more terminal pins connected to the circuit board on and/or next to a connection side situated opposite the contact side, wherein the first power electronics module has a lesser thickness between the contact side and the connection side than the second power electronics module, wherein the contact surface against which the contact side of the first power electronics module bears has a lesser distance from the circuit board than the contact surface against which the contact side of the second power electronics module bears, and/or wherein the terminal pins of the first power electronics module are longer than the terminal pins of the second power electronics module. 2. The electrical circuit device according to claim 1 , wherein the circuit board is a printed circuit board. 3. The electrical circuit device according to claim 1 , wherein the terminal pins are configured as press fit pins. 4. The electrical circuit device according to claim 1 , wherein the supporting structure is configured as a cooling body. 5. The electrical circuit device according to claim 1 , wherein the contact surfaces on one side of the supporting structure are arranged next to each other and/or separated from each other by a section of the supporting structure. 6. The electrical circuit device according to claim 1 , wherein the contact side and the connection side of the power electronics module are each one side surface of a housing of the respective power electronics module. 7. The electrical circuit device according to claim 6 , wherein the housing of the first power electronics module is formed at least partly by a gel casting compound and a frame and/or the housing of the second power electronics module is formed at least partly by a mold material. 8. The electrical circuit device according to claim 7 , wherein the mold material is an epoxy casting compound and/or a urethane casting compound. 9. The electrical circuit device according to claim 1 , wherein the first power electronics module forms an exciter circuit or is part of an exciter circuit and/or the second power electronics module forms an inverter circuit or is part of an inverter circuit. 10. The electrical circuit device according to claim 9 , wherein the inverter circuit is a multiphase inverter circuit. 11. An electrical drive device comprising an electrical circuit device according to claim 1 and an electrical machine connected to the electrical circuit device. 12. A motor vehicle comprising an electrical drive device according to claim 11 .
Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence) · CPC title
Adjacent components · CPC title
Connections made by press-fit insertion · CPC title
structurally associated with non-printed electric components (H05K1/16 takes precedence) · CPC title
associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] · CPC title
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