Semiconductor device and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-10285279-B2
Application number	US-201514881423-A
Country	US
Kind code	B2
Filing date	Oct 13, 2015
Priority date	Nov 13, 2014
Publication date	May 7, 2019
Grant date	May 7, 2019

Abstract

A semiconductor device includes a semiconductor module which has an external terminal protruding from one surface thereof; a printed circuit board which is electrically and mechanically connected to the external terminal of the semiconductor module; a heatsink which abuts against the other surface of the semiconductor module opposite to the one surface; and a joint member which serves as an elastic support column having a first head portion and a second head portion. The first head portion is shaped like a truncated cone and disposed at one end of the elastic support column, and the second head portion is disposed at the other end of the elastic support column. The semiconductor module, the printed circuit board and the heat sink are integrated by the first head portions and the second head portions.

First claim

What is claimed is:

1. A semiconductor device comprising:
a semiconductor module having an external terminal protruding from one surface of the semiconductor module in a first direction, the external terminal including a protruding portion extending in a second direction crossing the first direction;
a printed circuit board electrically and mechanically connected to the external terminal of the semiconductor module;
a heatsink abutting against another surface of the semiconductor module opposite to the one surface; and
one unitary joint member including a rod portion, a first head portion and a second head portion, the first head portion having a truncated cone shape including a flat top surface, a bottom surface extending outwardly from an outer surface of the rod portion, and a tapered surface extending from the flat top surface to the bottom surface, the first head portion being disposed at one end of the rod portion, and the second head portion being disposed at another end of the rod portion,
wherein the first head portion and the second head portion integrate the semiconductor module, the printed circuit board, and
the heatsink, and the printed circuit board is sandwiched between the first head portion and the protruding portion of the external terminal.

2. The semiconductor device according to claim 1 , wherein the joint member is an elastic element having a compression force in the first direction so that the printed circuit board is elastically sandwiched between the first head portion and the protruding portion.

3. The semiconductor device according to claim 2 , wherein each of the first and second head portions and the rod portion is a solid piece, and the first and second head portions and the rod portion are formed integrally as one structure.

4. The semiconductor device according to claim 3 , wherein the tapered surface of the first head portion is tapered so that a diameter of the first head portion increases from the flat top surface to the bottom surface,
the second head portion has a truncated cone shape including a first flat surface, a second surface extending from the outer surface of the rod portion, and a third surface extending from the first flat surface to the second surface of the second head portion and tapered so that a diameter of the second head portion increases from the first flat surface to the second surface of the second head portion, and
the rod portion extends from the bottom surface of the first head portion to the second surface of the second head portion.

5. The semiconductor device according to claim 4 , wherein the diameter of the first head portion at the bottom surface and the diameter of the second head portion at the second surface are greater than a diameter of the rod portion.

6. The semiconductor device according to claim 5 , wherein the diameter of the second head portion at the second surface is greater than the diameter of the first head portion at the bottom surface.

7. The semiconductor device according to claim 1 , wherein the rod portion of the joint member has a predetermined length when the joint member is detached from the semiconductor module, the printed circuit board and the heatsink, and
the rod portion is elastically extendable to have an attachment length greater than the predetermined length when the joint member is attached to integrate the semiconductor module, the printed circuit board, and the heatsink to thereby provide the compression force when the joint member is attached to the semiconductor module, the printed circuit board and the heat sink.

8. The semiconductor device according to claim 7 ,
wherein the heatsink includes
a first through hole extending in the first direction and receiving the rod portion of the joint member, and
a second through hole extending in the first direction and communicating with the first through hole, the second through hole having a diameter greater than that of the first through hole to receive the second head portion,
the printed circuit board includes a third through hole having a diameter less than the diameter of the first through hole and the diameter of the second through hole, and
a diameter of the first head portion at the bottom surface is less than a maximum diameter of the second head portion.

9. The semiconductor device according to claim 1 , wherein a surface of the heatsink opposite to a surface of the heatsink abutting against the semiconductor module is formed with a hole to embed the second head portion of the joint member.

10. A method for manufacturing a semiconductor device, comprising the steps of:
preparing a semiconductor module having an external terminal protruding from one surface in a first direction, a printed circuit board, a heatsink, and one unitary joint member including a rod portion, a first head portion and a second head portion, the joint member being an elastic element having a compression force in the first direction, the external terminal including a protruding portion extending in a second direction crossing the first direction, the first head portion having a truncated cone shape including a flat top surface, a bottom surface extending outwardly from an outer surface of the rod portion, and a tapered surface extending from the flat top surface to the bottom surface, the first head portion being disposed at one end of the rod portion, and the second head portion being disposed at another end of the rod portion;
electrically and mechanically connecting the printed circuit board to the external terminal of the semiconductor module;
abutting the heatsink against another surface of the semiconductor module;
extending the joint member to insert the joint member into through holes of the semiconductor module, the printed circuit board, and the heat sink disposed to align each other; and
sandwiching the semiconductor module, the printed circuit board, and the heatsink between the first head portion and the second head portion disposed at two ends of the joint member to fix the semiconductor module, the printed circuit board, and the heatsink to each other by the compression force of the joint member,
wherein the printed circuit board is elastically sandwiched between the first head portion and the protruding portion of the external terminal.

11. A semiconductor device comprising:
a semiconductor module having an external terminal protruding from one surface;
a printed circuit board electrically and mechanically connected to the external terminal of the semiconductor module;
a heatsink abutting against another surface of the semiconductor module opposite to the one surface; and
one unitary joint member including a rod portion, a first head portion and a second head portion, the first head portion having a truncated cone shape including a flat top surface, a bottom surface extending outwardly from an outer surface of the rod portion, and a tapered surface extending from the flat top surface to the bottom surface, the first head portion being disposed at one end of the rod portion, and the second head portion being disposed at another end of the rod portion,
wherein the first head portion and the second head portion integrate the semiconductor module, the printed circuit board, and the heatsink,
the tapered surface of the first head portion is tapered so that a diameter of the first head portion increases from the flat top surface to the bottom surface,
the second head portion has a truncated cone shape including a first flat surface, a second surface extending from the outer surface of the rod portion, and a third surface extending from the first flat surface to the second surface of the second head portion and tapered so that a diameter

Assignees

• Fuji Electric Co Ltd

Inventors

• Sekino Yusuke

Classifications

• H10W40/625

  Clamping parts not primarily conducting heat · CPC title

• H10W40/233

  attached to chips · CPC title

• H10W40/641

  Snap-on arrangements, e.g. clips · CPC title

• H10W40/611

  Bolts or screws · CPC title

• H10W40/60

  Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title