Semiconductor device, and method for assembling semiconductor device

Patent metadata

Field	Value
Publication number	US-9917031-B2
Application number	US-201514878539-A
Country	US
Kind code	B2
Filing date	Oct 8, 2015
Priority date	Sep 30, 2013
Publication date	Mar 13, 2018
Grant date	Mar 13, 2018

Abstract

A semiconductor device includes an insulating substrate; a semiconductor element mounted on the insulating substrate; and a radiation block bonded to the semiconductor element. The radiation block includes a three-dimensional radiation portion and a base portion connected to the radiation portion. The radiation portion of the radiation block has a pin shape, a fin shape, or a porous shape.

First claim

What is claimed is:

1. A semiconductor device comprising:
an insulating substrate;
a semiconductor element mounted on the insulating substrate, and having first electrodes connected to bonding wires and second electrodes on an upper surface thereof;
a radiation block including a base portion, and a radiation portion integrally formed with the base portion and extending from the base portion, the radiation portion having a plurality of pins or fins and bonded to the second electrodes of the semiconductor element;
a plurality of metal film regions formed on the insulating substrate and connected to the first electrodes through the bonding wires;
a plurality of lead pins electrically and mechanically connected to the plurality of metal film regions, and
a metal substrate fixed with one unit module,
wherein the one unit module comprises the insulating substrate, the semiconductor element, the radiation block, the plurality of metal film regions and the plurality of lead pins, a frame made of resin and provided in a periphery of the insulating substrate, and a sealing material filled inside the frame so that the plurality of pins or fins is completely covered by the sealing material, and the base portion and the plurality of lead pins are exposed from the sealing material.

2. The semiconductor device according to claim 1 , further comprising: a conductive plate electrically connected to the semiconductor element through the radiation block.

3. The semiconductor device according to claim 1 , further comprising a lead pin block integrally fixing the plurality of lead pins together.

4. The semiconductor device according to claim 1 , wherein a plurality of unit modules, each being formed of said one unit module, is mounted on the metal substrate, and semiconductor elements of the plurality of said unit modules are electrically connected with a conductive plate.

5. The semiconductor device according to claim 1 , further comprising: a metal plate provided between the insulating substrate and the semiconductor element.

6. The semiconductor device according to claim 1 , wherein the one unit module further comprises a lead pin block integrally fixing the plurality of lead pins together.

7. The semiconductor device according to claim 6 , wherein the radiation block and the lead pin block are separately provided.

8. The semiconductor device according to claim 1 , wherein the frame includes a protrusion provided on a bottom thereof.

9. The semiconductor device according to claim 1 , further comprising: a case accommodating the metal substrate, and another sealing material filled inside the case.

10. The semiconductor device according to claim 9 , wherein said another sealing material filled inside the case is formed from a material different from the sealing material filled inside the frame.

11. The semiconductor device according to claim 1 , further comprising a feed block mounted on the insulating substrate and supplying power from outside to the semiconductor element, the feed block being located inside the frame so that an upper surface of the feed block is exposed from the sealing material.

12. A method for assembling a semiconductor device, comprising:
preparing a unit module including an insulating substrate, a semiconductor element mounted on the insulating substrate having first electrodes, a radiation block bonded to the semiconductor element and having a base portion and a radiation portion integrally formed together to form a three-dimensional radiation portion, a plurality of metal film regions formed on the insulating substrate and connected to the first electrodes;
fixing the unit module to a metal substrate;
arranging a frame made of resin in a periphery of the insulating substrate of the unit module fixed to the metal substrate;
electrically and mechanically connecting a plurality of lead pins to the plurality of metal film regions;
filling a sealing material inside the frame so that the radiation portion is completely covered by the sealing material, and the base portion and the plurality of lead pins are exposed from the sealing material;
arranging a case to enclose the frame; and
bonding the case to the metal substrate.

13. A method for assembling a semiconductor device, comprising:
preparing an insulating substrate; a semiconductor element mounted on the insulating substrate, and having first electrodes connected to bonding wires and second electrodes on an upper surface thereof; a radiation block including a base portion, and a radiation portion integrally formed with the base portion and extending from the base portion, the radiation portion having a plurality of pins or fins and bonded to the second electrodes of the semiconductor element; a plurality of metal film regions formed on the insulating substrate and connected to the first electrodes through the bonding wires; a plurality of lead pins electrically and mechanically connected to the plurality of metal film regions; and a frame made of resin and fixed to a periphery of the insulating substrate, the frame surrounding the semiconductor element the radiation block, the plurality of metal film regions and the plurality of lead pins;
filling a sealing material inside of the frame such that the plurality of pins or fins is completely covered by the sealing material, and the base portion and the plurality of lead pins are exposed from the sealing material, to thereby prepare a unit module;
fixing the unit module to a metal substrate; and
bonding a case enclosing the unit module to the metal substrate.

Assignees

• Fuji Electric Co Ltd

Inventors

• Soyano Shin

Classifications

• H10W90/764

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/07653

  changes in shapes · CPC title

• H10W72/07636

  Soldering or alloying · CPC title