Package assembly

Patent metadata

Field	Value
Publication number	US-9906157-B2
Application number	US-201615165719-A
Country	US
Kind code	B2
Filing date	May 26, 2016
Priority date	May 29, 2015
Publication date	Feb 27, 2018
Grant date	Feb 27, 2018

Abstract

A package assembly includes a main body, a power module and replaceable top cover. The main body has a hollow part. The power module is disposed within a hollow part of the main body and located beside the bottom part of the main body. At least one first pin is disposed on a surface of the power module. The at least one first pin is accommodated within the hollow part of the main body and partially protruded out of a first open end of the hollow part near a top part of the main body. The top cover is disposed in the hollow part of the main body, and includes at least one first opening corresponding to the at least one first pin. The at least one first pin is penetrated through the corresponding first opening and exposed outside the first open end of the hollow part.

First claim

What is claimed is:

1. A package assembly, comprising:
a main body having a hollow part, wherein the hollow part runs through a top part and a bottom part of the main body;
a power module disposed within the hollow part of the main body and located beside the bottom part of the main body, wherein at least one first pin is disposed on a surface of the power module, and the at least one first pin is accommodated within the hollow part of the main body and partially protruded out of a first open end of the hollow part near the top part of the main body; and
a replaceable top cover disposed in the hollow part of the main body, and comprising at least one first opening corresponding to the at least one first pin, wherein the at least one first pin is penetrated through the corresponding first opening and exposed outside the first open end of the hollow part,
wherein the main body further comprises a housing frame, and the housing frame comprises plural frame plates and a first channel, wherein the first channel is defined by the plural frame plates,
wherein the housing frame further comprises a receiving recess, the main body further comprises a mounting bracket, and the mounting bracket comprises a first fixing part and a second fixing part, wherein the second fixing part is accommodated within the first channel, a first end of the first fixing part is locked into the receiving recess, and a second end of the first fixing part is exposed outside the package assembly and has at least one first mounting hole,
wherein the main body further comprises a housing base, and the housing base is combined with the housing frame, wherein the housing base comprises:
a first base part accommodated within the first channel, wherein the second fixing part is clamped between the first base part and the housing frame, so that the second fixing part is fixed in the first channel;
a second base part connected with the first base part, wherein the second base part is in contact with a bottom surface of the housing frame; and
a second channel running through the first base part and the second base part, wherein the power module is accommodated within the second channel to cover the second channel.

2. The package assembly according to claim 1 , wherein the power module comprises a plurality of electronic components embedded within a dielectric substrate.

3. The package assembly according to claim 1 , wherein a second open end of the hollow part near the bottom part of the main body is covered by the power module.

4. The package assembly according to claim 1 , wherein the top cover is a flat covering plate.

5. The package assembly according to claim 1 , wherein the at least one first opening of the top cover comprises plural first openings arranged in a matrix configuration.

6. The package assembly according to claim 1 , wherein the at least one first pin is disposed on a middle region of the surface of the power module.

7. The package assembly according to claim 6 , wherein at least one second pin is disposed on the surface of the power module, wherein the at least one second pin is disposed on a periphery region of the surface of the power module.

8. The package assembly according to claim 7 , wherein the main body further comprises at least one second opening corresponding to the at least one second pin, and the at least one second opening runs through the top part of the main body, wherein the at least one second pin is accommodated within the hollow part of the main body and partially protruded out of the top part of the main body.

9. The package assembly according to claim 1 , wherein the first end of the first fixing part is connected with and perpendicular to the second fixing part, so that the mounting bracket is an L-shaped bracket.

10. The package assembly according to claim 1 , wherein when the housing base and the housing frame are combined together, the first channel and the second channel are in communication with each other to define the hollow part of the main body.

Assignees

• Delta Electronics Intl Singapore Pte Ltd

Inventors

• Tan Chad Yao
• Chen Da Jung

Classifications

• H10W76/01

  Manufacture or treatment · CPC title

• H10W72/50 Primary

  Bond wires · CPC title

• H10W76/15

  Containers comprising an insulating or insulated base · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/00

  Interconnections or connectors in packages · CPC title