In-situ semiconductor processing chamber temperature apparatus

US12183605B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12183605-B2
Application numberUS-202117477750-A
CountryUS
Kind codeB2
Filing dateSep 17, 2021
Priority dateJun 19, 2017
Publication dateDec 31, 2024
Grant dateDec 31, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Methods and systems for in-situ temperature control are provided. The method includes delivering a temperature-sensing disc into a processing region of a processing chamber without breaking vacuum. The temperature-sensing disc includes one or more cameras configured to perform IR-based imaging. The method further includes measuring a temperature of at least one region of at least one chamber surface in the processing region of the processing chamber by imaging the at least one surface using the temperature-sensing disc. The method further includes comparing the measured temperature to a desired temperature to determine a temperature difference. The method further includes adjusting a temperature of the at least one chamber surface to compensate for the temperature difference.

First claim

Opening claim text (preview).

The invention claimed is: 1. A showerhead assembly, comprising: a gas distribution plate having a plurality of through-holes operable to deliver process gases to a processing chamber and being divided into a plurality of temperature-control regions; a bottom plate coupled to the gas distribution plate and comprising a plurality of holes; bonding layer disposed between the bottom plate and the gas distribution plate; a plurality of heat control devices disposed above the bottom plate and operable to manage heat transfer independently in each of the plurality of the temperature-control regions, the plurality of the heat control devices comprising a plurality of thermoelectric modules configured to cool and heat the plurality of the temperature-control regions; a chill plate being a lid of the showerhead assembly and comprising a recess configured to contain containing the plurality of the heat control devices; and a plurality of heat pipes extending from the plurality of the thermoelectric modules into the plurality of the holes of the bottom plate, the plurality of thermoelectric modules comprising a first thermoelectric module being disposed between a first heat pipe and the chill plate, and the bonding layer being disposed between the first heat pipe and the gas distribution plate. 2. The showerhead assembly of claim 1 , wherein: the plurality of thermoelectric modules are operable to control the heat transfer independently in each of the temperature-control regions of the gas distribution plate. 3. The showerhead assembly of claim 2 , wherein the thermoelectric modules are arranged in concentric rings, each ring having at least one thermoelectric module that is operable to control the heat transfer independently from another thermoelectric module of an adjacent one of the concentric rings. 4. The showerhead assembly of claim 3 , wherein the thermoelectric modules in each concentric ring are arranged in segments having at least one thermoelectric module that is operable to control the heat transfer independently from another thermoelectric module of an adjacent one of the segments. 5. The showerhead assembly of claim 3 , wherein the thermoelectric modules in each concentric ring are arranged in segments, each segment associated with one of the thermoelectric modules, each thermoelectric module of each segment operable to control the heat transfer independently from other thermoelectric modules. 6. The showerhead assembly of claim 2 , wherein each thermoelectric module is interfaced with at least one heat pipe. 7. The showerhead assembly of claim 2 wherein: the thermoelectric modules separating the chill plate from the bottom plate. 8. The showerhead assembly of claim 7 , wherein the chill plate comprises a recessed portion, the recessed portion housing the thermoelectric modules. 9. The showerhead assembly of claim 7 , wherein the chill plate is fabricated from aluminum oxide, aluminum nitride, or silicon carbide. 10. The showerhead assembly of claim 2 , wherein the thermoelectric modules are arranged in an X/Y pattern of pixels, each pixel having at least one thermoelectric module that is operable to control the heat transfer independently from another thermoelectric module of an adjacent one of the pixels. 11. A showerhead assembly, comprising: a gas distribution plate having a plurality of through-holes operable to deliver process gases to a processing chamber and being divided into a plurality of temperature-control regions; a bottom plate coupled to the gas distribution plate and comprising a plurality of holes; a bonding layer disposed between the gas distribution plate and the bottom plate; a plurality of independently addressable thermoelectric modules disposed above the bottom plate and operable to manage heat transfer independently in each of the plurality of the temperature-control regions, the plurality of the thermoelectric modules being configured to cool and heat the temperature-control regions; a chill plate being a lid of the showerhead assembly and comprising a recess portion housing the plurality of the thermoelectric modules, the thermoelectric modules separating the chill plate from the gas distribution plate; and a plurality of heat pipes extending from the plurality of the thermoelectric modules into the plurality of the holes of the bottom plate, the plurality of thermoelectric modules comprising a first thermoelectric module being disposed between a first heat pipe and the chill plate, and the bonding layer being disposed between the first heat pipe and the gas distribution plate. 12. The showerhead assembly of claim 11 , wherein the thermoelectric modules are arranged in concentric rings, each ring having at least one thermoelectric module that is operable to control the heat transfer independently from another thermoelectric module of an adjacent one of the rings. 13. The showerhead assembly of claim 12 , wherein the thermoelectric modules in each concentric ring are arranged in segments having at least one thermoelectric module that is operable to control the heat transfer independently from another thermoelectric module of an adjacent one of the segments. 14. The showerhead assembly of claim 12 , wherein the thermoelectric modules in each concentric ring are arranged in segments, each segment associated with one of the thermoelectric modules, each thermoelectric module of each segment operable to control the heat transfer independently from other thermoelectric modules. 15. The showerhead assembly of claim 12 , wherein each thermoelectric module is interfaced with at least one heat pipe extending between the thermoelectric modules and the gas distribution plate. 16. The showerhead assembly of claim 11 , wherein the thermoelectric modules are arranged in an X/Y pattern of pixels, each pixel having at least one thermoelectric module that is operable to control the heat transfer independently from another thermoelectric module of an adjacent one of the pixels. 17. The showerhead assembly of claim 16 , wherein each thermoelectric module is interfaced with at least one heat pipe.

Assignees

Inventors

Classifications

  • Temperature monitoring · CPC title

  • Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

  • Apparatus for manufacture or treatment · CPC title

  • Cooled nozzles · CPC title

  • Heated nozzles · CPC title

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What does patent US12183605B2 cover?
Methods and systems for in-situ temperature control are provided. The method includes delivering a temperature-sensing disc into a processing region of a processing chamber without breaking vacuum. The temperature-sensing disc includes one or more cameras configured to perform IR-based imaging. The method further includes measuring a temperature of at least one region of at least one chamber su…
Who is the assignee on this patent?
Applied Materials Inc
What technology area does this patent fall under?
Primary CPC classification H10P72/0602. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Dec 31 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).