RF voltage and current (V-I) sensors and measurement methods

Patent metadata

Field	Value
Publication number	US-12176183-B2
Application number	US-202318486220-A
Country	US
Kind code	B2
Filing date	Oct 13, 2023
Priority date	Jun 26, 2020
Publication date	Dec 24, 2024
Grant date	Dec 24, 2024

Abstract

A radio frequency sensor assembly includes a sensor casing disposed around a central hole, the sensor casing including a first conductive cover and a second conductive cover. The assembly includes a cavity disposed around the central hole and includes a dielectric material, the cavity being bounded by a first major outer surface and a second major outer surface along a radial direction from a center of the central hole, where the first conductive cover is electrically coupled to the second conductive cover through a coupling region beyond the second major outer surface of the cavity, and electrically insulated from the second conductive cover by the cavity and the central hole. The assembly includes a current sensor electrically insulated from the sensor casing and including a current pickup disposed symmetrically around the central hole, the current pickup being disposed within the cavity and being insulated from the sensor casing.

First claim

What is claimed is:

1. A radio frequency (RF) sensor assembly comprising:
a sensor casing disposed symmetrically around a central hole, the sensor casing comprising a first conductive cover and a second conductive cover;
a cavity shaped like an annulus disposed symmetrically around the central hole and comprising a first dielectric material, the cavity being bounded by first and second major outer surfaces along a radial direction from a center of the central hole, the first major outer surface comprising a ring-shaped continuous region in physical contact with the central hole, and the second major outer surface comprising a closed outer boundary at a radial distance greater than a radius of the first major outer surface;
a current sensor comprising a current pickup coil disposed symmetrically around the central hole, the current pickup being insulated from the sensor casing and the current pickup being disposed within the cavity; and
a conductive ridge shaped like a ring interposed between the current pickup and the central hole and electrically coupled to the second conductive cover, the conductive ridge being covered with the dielectric material.

2. The sensor assembly of claim 1 ,
wherein the first conductive cover, along the radial direction from a center of the central hole, comprises
a first groove shaped like an annulus disposed vertically above the conductive ridge,
at a radial distance farther from the central hole, a second groove shaped like an annulus, and
a beam shaped like a ring comprising a conductive region between the first groove and the second groove; and

wherein the second conductive cover comprises a third groove shaped like an annulus disposed vertically below the beam and the second groove; and
wherein the current sensor comprises an upper portion disposed in the portion of the cavity comprising the second groove, and a lower portion disposed in the portion of the cavity comprising the third groove.

3. The sensor assembly of claim 1 ,
wherein the cavity, along the radial direction from a center of the central hole, comprises a slit region, the slit region comprises a continuous zig-zag dielectric region shaped like a ring,
wherein the slit region is in physical contact with the central hole, the conductive ridge, and the current sensor.

4. The sensor assembly of claim 1 , wherein the first conductive cover is electrically coupled to the second conductive cover through a region beyond the second major outer surface of the cavity, and wherein the first conductive cover is electrically insulated from the second conductive cover by the cavity and the central hole in the region enclosed by the closed outer boundary.

5. A radio frequency (RF) sensor assembly comprising:
a sensor casing comprising a first conductive cover, a second conductive cover, and a central hole extending through the first and the second conductive covers;
a cavity shaped like an annulus disposed symmetrically around the central hole and comprising an inner groove and an outer groove, the inner and outer grooves comprising a dielectric material;
a current sensor comprising a mandrel and a current pickup disposed within the mandrel, the current sensor being disposed within the cavity between the inner and outer grooves, the current pickup being insulated from the sensor casing by the outer groove; and
a conductive ridge shaped like a ring interposed between the current pickup and the central hole and electrically coupled to the second conductive cover, the conductive ridge being covered with the dielectric material.

6. The sensor assembly of claim 5 , wherein the mandrel comprises a toroidal shape.

7. The sensor assembly of claim 5 , wherein outside the outer groove, the first conductive cover and the second conductive cover are physically and electrically coupled together, and wherein inside the outer groove, the first conductive cover and the second conductive cover are isolated.

8. The sensor assembly of claim 5 , further comprising a dielectric slit comprising the dielectric material disposed over the inner and outer grooves on either side of the conductive ridge, wherein a conductive floor of the cavity is electrically and physically separated from a conductive roof of the cavity by an unbroken continuous dielectric region.

9. The sensor assembly of claim 5 , wherein the mandrel comprises access holes for a conducting wire.

10. The sensor assembly of claim 5 , wherein the cavity is bounded by first and second major outer surfaces along a radial direction from a center of the central hole, the first major outer surface comprising a ring-shaped continuous region in physical contact with the central hole, and the second major outer surface comprising a closed outer boundary at a radial distance greater than a radius of the first major outer surface.

11. The sensor assembly of claim 10 ,
wherein the cavity, along the radial direction from a center of the central hole, comprises a slit region, the slit region comprises a continuous zig-zag dielectric region shaped like a ring,
wherein the slit region is in physical contact with the central hole, the conductive ridge, and the current sensor.

12. The sensor assembly of claim 10 , wherein the first conductive cover is electrically coupled to the second conductive cover through a region beyond the second major outer surface of the cavity, and wherein the first conductive cover is electrically insulated from the second conductive cover by the cavity and the central hole in the region enclosed by the closed outer boundary.

13. A plasma system comprising:
a process chamber comprising an electrode;
a radio frequency (RF) power source configured to power the process chamber with a RF signal;
a RF pipe coupling the RF power source to the electrode of the process chamber;
a mandrel shaped like a toroid disposed symmetrically around an axis of the RF pipe carrying the RF signal; and
a voltage pickup disposed symmetrically around the axis of the RF pipe and surrounded by the mandrel.

14. The system of claim 13 , further comprising a current sensor, the current sensor comprising:
the mandrel comprising a dielectric material; and
a current pickup comprising a continuous conductive wire with two opposite ends, wherein the wire is coiled symmetrically around an internal circular axis of the mandrel; and
two electrical terminals electrically connected to the respective two opposite ends of the wire outside the mandrel.

15. The plasma system of claim 13 , further comprising a sensor assembly, the sensor assembly comprising
a central hole, wherein an inner conductor of the RF pipe is disposed in the central hole; and
a sensor casing shaped like an annulus disposed contiguously around the central hole and comprising a first conductive cover and a second conductive cover, the sensor casing being partitioned into a first annular region and a second annular region,
the first annular region being contiguous with the central hole on one side and contiguous with the second annular region on the opposing side, and
wherein, in the first annular region, the first conductive cover is electrically insulated from the second conductive cover by a cavity comprising a dielectric material, and wherein the mandrel and the voltage pickup are disposed in the cavity, and
wherein, in the second annular region, the first conductive cover is electrically coupled to the second conductive cover.

16. The plasma system of claim 15 ,
wherein the first conductive cover and the second conductive cover in the first annular region of the sensor casing is electrically c

Assignees

• Tokyo Electron Ltd

Inventors

• Lane Barton
• Funk Merritt
• Yamazawa Yohei
• Moses Justin
• Dubose Chelsea
• Hummel Michael

Classifications

• G01R29/0878

  Sensors; antennas; probes; detectors (wave guide measuring sections G01R1/24) · CPC title

• H01J37/32174 Primary

  Circuits specially adapted for controlling the RF discharge · CPC title

• H01J37/32935 Primary

  Monitoring and controlling tubes by information coming from the object and/or discharge · CPC title

• H01J37/32082 Primary

  Radio frequency generated discharge (H01J37/32357, H01J37/32366, H01J37/32394 and H01J37/32403 take precedence) · CPC title