RF voltage and current (V-I) sensors and measurement methods

US11817296B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11817296-B2
Application numberUS-202016913545-A
CountryUS
Kind codeB2
Filing dateJun 26, 2020
Priority dateJun 26, 2020
Publication dateNov 14, 2023
Grant dateNov 14, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A radio frequency sensor assembly includes a sensor casing disposed around a central hole, the sensor casing including a first conductive cover and a second conductive cover. The assembly includes a cavity disposed around the central hole and includes a dielectric material, the cavity being bounded by a first major outer surface and a second major outer surface along a radial direction from a center of the central hole, where the first conductive cover is electrically coupled to the second conductive cover through a coupling region beyond the second major outer surface of the cavity, and electrically insulated from the second conductive cover by the cavity and the central hole. The assembly includes a current sensor electrically insulated from the sensor casing and including a current pickup disposed symmetrically around the central hole, the current pickup being disposed within the cavity and being insulated from the sensor casing.

First claim

Opening claim text (preview).

What is claimed is: 1. A radio frequency (RF) sensor assembly comprising: a sensor casing disposed around a central hole, the sensor casing comprising a first conductive cover and a second conductive cover; a cavity disposed around the central hole and comprising a first dielectric material, the cavity being bounded by a first major outer surface and a second major outer surface along a radial direction from a center of the central hole, the first major outer surface comprising a continuous ring shaped region in physical contact with the central hole, and the second major outer surface at a radial distance greater than a radius of the first major outer surface, wherein the first conductive cover is electrically coupled to the second conductive cover through a coupling region beyond the second major outer surface of the cavity and, wherein the first conductive cover is electrically insulated from the second conductive cover by the cavity and the central hole; and a current sensor electrically insulated from the sensor casing and comprising a current pickup disposed symmetrically around the central hole, the current pickup being disposed within the cavity and being insulated from the sensor casing. 2. The sensor assembly of claim 1 , wherein the current sensor comprises a mandrel shaped like a toroid. 3. The sensor assembly of claim 2 , wherein the mandrel comprises a second dielectric material around a continuous hollow passage, the hollow passage coiling symmetrically around an internal circular axis, wherein the current pickup comprising a continuous conductive wire with two opposite ends, and wherein the wire is shaped like a coil threading through the hollow passage. 4. The sensor assembly of claim 3 , further comprising: a plurality of access holes extending from an outer surface of the mandrel to the hollow passage; and two electrical terminals insulated from the sensor casing, wherein the two electrical terminals are electrically connected to the respective two opposite ends of the wire extending out of the mandrel through the plurality of access holes. 5. The sensor assembly of claim 2 , wherein the mandrel comprises a second dielectric material having grooves on an outer major surface of the mandrel, the grooves coiling symmetrically around an internal circular axis, wherein the current pickup comprises a continuous conductive wire with two opposite ends, wherein the wire is shaped like a coil disposed in the grooves of the toroid. 6. The sensor assembly of claim 5 , further comprising: two electrical terminals insulated from the sensor casing, wherein the two electrical terminals are electrically coupled to the respective two opposite ends of the wire outside the mandrel. 7. A radio frequency (RF) sensor assembly comprising: a sensor casing disposed around a central hole, the sensor casing comprising a first conductive cover and a second conductive cover; a cavity disposed around the central hole and comprising a first dielectric material, the cavity being bounded by a first major outer surface and a second major outer surface along a radial direction from a center of the central hole, the first major outer surface comprising a continuous ring shaped region in physical contact with the central hole, and the second major outer surface at a radial distance greater than a radius of the first major outer surface, wherein the first conductive cover is electrically coupled to the second conductive cover through a coupling region beyond the second major outer surface of the cavity and, wherein the first conductive cover is electrically insulated from the second conductive cover by the cavity and the central hole: a current sensor electrically insulated from the sensor casing and comprising a current pickup disposed symmetrically around the central hole, the current pickup being disposed within the cavity and being insulated from the sensor casing; a voltage sensor, the voltage sensor comprising a voltage pickup and an electrical terminal, wherein the voltage pickup is disposed in the cavity interposed between the current sensor and the central hole, and wherein the electrical terminal is electrically connected to the voltage pickup; and wherein the voltage sensor is electrically insulated from the sensor casing. 8. The sensor assembly of claim 7 , wherein the voltage pickup is an electrode shaped like a ring disposed symmetrically around the central hole, and wherein the voltage pickup is mechanically supported by a third dielectric material in the cavity disposed between the first conductive cover and the second conductive cover. 9. The sensor assembly of claim 8 , wherein the third dielectric material is a solid dielectric material and the first dielectric material is a gas. 10. The sensor assembly of claim 8 , wherein the voltage pickup is electrically insulated from the sensor casing by a slit region, the slit region comprising a continuous zig-zag region shaped like a ring, and wherein the slit region is in physical contact with the central hole, the voltage pickup, and the current sensor. 11. A plasma system comprising: a radio frequency (RF) sensor assembly comprising: a sensor casing disposed around a central hole, the sensor casing comprising a first conductive cover and a second conductive cover; a cavity disposed around the central hole and comprising a first dielectric material, the cavity being bounded by a first major outer surface and a second major outer surface along a radial direction from a center of the central hole, the first major outer surface comprising a continuous ring shaped region in physical contact with the central hole, and the second major outer surface at a radial distance greater than a radius of the first major outer surface, wherein the first conductive cover is electrically coupled to the second conductive cover through a coupling region beyond the second major outer surface of the cavity and, herein the first conductive cover is electrically insulated from the second conductive cover by the cavity and the central hole; and a current sensor electrically insulated from the sensor casing and comprising a current pickup disposed symmetrically around the central hole, the current pickup being disposed within the cavity and being insulated from the sensor casing. 12. The plasma system of claim 11 , wherein the current sensor comprises a mandrel shaped like a toroid. 13. The plasma system of claim 12 , wherein the mandrel comprises a second dielectric material around a continuous hollow passage, the hollow passage coiling symmetrically around an internal circular axis, wherein the current pickup comprising a continuous conductive wire with two opposite ends, and wherein the wire is shaped like a coil threading through the hollow passage. 14. The plasma system of claim 13 , further comprising: a plurality of access holes extending from an outer surface of the mandrel to the hollow passage; and two electrical terminals insulated from the sensor casing, wherein the two electrical terminals are electrically connected to the respective two opposite ends of the wire extending out of the mandrel through the plurality of access holes. 15. The plasma system of claim 12 , wherein the mandrel comprises a second dielectric material having grooves on an outer major surface of the mandrel, the grooves coiling symmetrically around an internal circular axis, wherein the current pickup comprises a continuous conductive wire with two opposite ends, wherein the wire is shaped like a coil disposed in the grooves of the toroid. 16. The plasma system of claim 15 , wh

Assignees

Inventors

Classifications

  • Circuits specially adapted for controlling the RF discharge · CPC title

  • Sensors; antennas; probes; detectors (wave guide measuring sections G01R1/24) · CPC title

  • Radio frequency generated discharge (H01J37/32357, H01J37/32366, H01J37/32394 and H01J37/32403 take precedence) · CPC title

  • Monitoring and controlling tubes by information coming from the object and/or discharge · CPC title

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What does patent US11817296B2 cover?
A radio frequency sensor assembly includes a sensor casing disposed around a central hole, the sensor casing including a first conductive cover and a second conductive cover. The assembly includes a cavity disposed around the central hole and includes a dielectric material, the cavity being bounded by a first major outer surface and a second major outer surface along a radial direction from a c…
Who is the assignee on this patent?
Tokyo Electron Ltd
What technology area does this patent fall under?
Primary CPC classification H01J37/32174. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Nov 14 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).