RF voltage and current (V-I) sensors and measurement methods

US11600474B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11600474-B2
Application numberUS-202016913526-A
CountryUS
Kind codeB2
Filing dateJun 26, 2020
Priority dateJun 26, 2020
Publication dateMar 7, 2023
Grant dateMar 7, 2023

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A radio frequency (RF) system includes a RF power source configured to power a load with an RF signal; an RF pipe including an inner conductor and an outer conductor connected to ground coupling the RF power source to the load; and a current sensor aligned to a central axis of the RF pipe carrying the RF signal. A sensor casing is disposed around the RF pipe, where the sensor casing includes a conductive material connected to the outer conductor of the RF pipe. A gallery is disposed within the sensor casing and outside the outer conductor of the RF pipe, where the current sensor is disposed in the gallery. A slit in the outer conductor of the RF pipe exposes the current sensor to a magnetic field due to the current of the RF signal in the inner conductor of the RF pipe.

First claim

Opening claim text (preview).

What is claimed is: 1. A radio frequency (RF) system comprising: a radio frequency (RF) power source configured to power a load with an RF signal; an RF pipe comprising an inner conductor and an outer conductor connected to ground coupling the RF power source to the load; a current sensor aligned to a central axis of the RF pipe carrying the RF signal, the current sensor being configured to monitor the current of the RF signal, the current sensor comprising a conductive half-loop disposed proximate the RF pipe, the conductive half-loop comprising a first end and an opposite second end, the current sensor being configured to output an output signal between the first end and the second end; a sensor casing disposed around the RF pipe, wherein the sensor casing comprises a conductive material connected to the outer conductor of the RF pipe; a gallery disposed within the sensor casing and outside the outer conductor of the RF pipe, wherein the current sensor is disposed in the gallery; and a slit in the outer conductor of the RF pipe to expose the current sensor to a magnetic field due to the current of the RF signal in the inner conductor of the RF pipe. 2. The system of claim 1 , wherein the slit has a length along an inner circumference of the outer conductor and a width parallel to the central axis of the RF pipe, and wherein the width is between 0.5 mm and 5 mm. 3. The system of claim 1 , wherein, along a direction orthogonal to the central axis of the RF pipe, the conductive half-loop comprises a first plane of mirror symmetry comprising the central axis of the RF pipe and a second plane of mirror symmetry orthogonal to the first plane of mirror symmetry, and wherein the first plane of mirror symmetry of the conductive half-loop and the central axis of the RF pipe are co-planar. 4. The system of claim 1 , wherein the conductive half-loop comprises: a first branch aligned parallel to the central axis of the RF pipe; a second branch coupled at a first end of the first branch, the second branch being orthogonal to the first branch; and a third branch coupled at a second end of the first branch, the third branch being orthogonal to the first branch and parallel to the second branch. 5. The system of claim 4 , further comprising: insulating support structures to support the first, the second, and the third branches of the conductive half-loop. 6. The system of claim 1 , wherein the inner conductor is electrically coupled to the RF power source and the load; and wherein the outer conductor is electrically coupled to a reference potential node. 7. The system of claim 1 , further comprising: a first voltage sensor to monitor the voltage of the RF signal, the first voltage sensor disposed axisymmetrically around the RF pipe. 8. The system of claim 7 , wherein the first voltage sensor comprises: a conductive ring disposed along an inner surface of the outer conductor of the RF pipe; and an insulating ring disposed between the conductive ring and the RF pipe's outer conductor, wherein the insulating ring electrically insulates the conductive ring from the RF pipe. 9. The system of claim 8 , further comprising: a second voltage sensor disposed symmetrically around the RF pipe, wherein the first voltage sensor is located at a first location on the central axis of the RF pipe, the second voltage sensor is located at a second location on the central axis of the RF pipe, and wherein a first distance between the first location and a plane of mirror symmetry of the current sensor is about the same as a second distance between the second location and the plane of mirror symmetry. 10. A radio frequency (RF) system comprising: a radio frequency (RF) power source configured to power a load with an RF signal; an RF pipe comprising an inner conductor and an outer conductor connected to a reference potential node coupling the RF power source to the load; and a first voltage sensor disposed axisymmetrically around an axis of the RF pipe carrying the RF signal, the first voltage sensor being configured to monitor the voltage of the RF signal, the first voltage sensor being located at a first location on the axis of the RF pipe; and a current sensor disposed around the RF pipe at a second location on the axis of the RF pipe, the current sensor being aligned to the axis of the RF pipe carrying the RF signal, the current sensor being configured to monitor the current of the RF signal. 11. The system of claim 10 , further comprising: a second voltage sensor disposed symmetrically around the RF pipe, wherein the second voltage sensor is located at a third location on the axis of the RF pipe. 12. The system of claim 11 , wherein the second location is disposed between the first location and the third location. 13. The system of claim 11 , wherein the current sensor comprises a conductive half-loop comprising a first end and an opposite second end, wherein, along a direction orthogonal to the axis of the RF pipe, the conductive half-loop comprises a first plane of mirror symmetry comprising the axis of the RF pipe and a second plane of mirror symmetry orthogonal to the first plane of mirror symmetry, and wherein the first plane of mirror symmetry of the conductive half-loop and the axis of the RF pipe are co-planar. 14. The system of claim 13 , wherein a first distance between the first location and the second plane of mirror symmetry is about the same as a second distance between the third location and the second plane of mirror symmetry. 15. A method of measuring a radio frequency (RF) signal, the method comprising: having a current sensor aligned to an axis of an RF pipe carrying an RF signal, the current sensor being disposed in a gallery that is disposed within a sensor casing and outside an outer conductor of the RF pipe, the sensor casing being disposed around the RF pipe, the current sensor comprising a conductive half-loop, the conductive half-loop comprising a first end and an opposite second end; and determining a current of the RF signal based on measuring an output signal between the first end and the second end. 16. The method of claim 15 , wherein the RF pipe comprises an inner conductor electrically coupled to an RF power source and a load, and an outer conductor, wherein the method further comprises grounding the outer conductor. 17. The method of claim 15 , further comprising having a first voltage sensor disposed axisymmetrically around the RF pipe; and determining a voltage of the RF signal based on measuring an electrical signal at a terminal of the first voltage sensor. 18. The method of claim 17 , further comprising: having a second voltage sensor disposed symmetrically around the RF pipe, wherein the first voltage sensor is located at a first location on the axis of the RF pipe, the second voltage sensor is located at a second location on the axis of the RF pipe; and measuring another electrical signal at a terminal of the second voltage sensor, wherein the voltage of the RF signal is determined based on the electrical signal and the another electrical signal. 19. The method of claim 18 , wherein the conductive half-loop comprises a first plane of mirror symmetry comprising the axis of the RF pipe and a second plane of mirror symmetry orthogonal to the first plane of mirror symmetry, and wherein the first plane of mirror symmetry of the conductive half-loop and the axis of the RF pipe are co-planar.

Assignees

Inventors

Classifications

  • Monitoring and controlling tubes by information coming from the object and/or discharge · CPC title

  • High voltage power supply or regulation circuits · CPC title

  • Radio frequency generated discharge (H01J37/32357, H01J37/32366, H01J37/32394 and H01J37/32403 take precedence) · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11600474B2 cover?
A radio frequency (RF) system includes a RF power source configured to power a load with an RF signal; an RF pipe including an inner conductor and an outer conductor connected to ground coupling the RF power source to the load; and a current sensor aligned to a central axis of the RF pipe carrying the RF signal. A sensor casing is disposed around the RF pipe, where the sensor casing includes a …
Who is the assignee on this patent?
Tokyo Electron Ltd
What technology area does this patent fall under?
Primary CPC classification H01J37/32935. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 07 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).