Wiring board having a wiring pattern that has a multi-layer structure

Patent metadata

Field	Value
Publication number	US-12160954-B2
Application number	US-202217864876-A
Country	US
Kind code	B2
Filing date	Jul 14, 2022
Priority date	Jul 19, 2021
Publication date	Dec 3, 2024
Grant date	Dec 3, 2024

Abstract

A wiring board includes a wiring layer, an insulating layer, a plurality of opening portions, and a connection terminal. The insulating layer is laminated on the wiring layer and covers a wiring pattern. Each of the plurality of opening portions penetrates through the insulating layer to the wiring pattern. The connection terminal is formed on the respective opening portions and comes into contact with the upper surface of the wiring pattern. The wiring layer includes a first wiring pattern, and a second wiring pattern that is formed of a plurality of laminated metal layers and that is thicker than the first wiring pattern. An upper surface of a metal layer serving as an uppermost layer of the second wiring pattern is a contact surface with the connection terminal and has a same width as an upper surface of a metal layer serving as a layer other than the uppermost layer.

First claim

What is claimed is:

1. A wiring board comprising:
a wiring layer that includes a wiring pattern;
an insulating layer that is on the wiring layer and covers the wiring pattern;
a plurality of opening portions each penetrating through the insulating layer to the wiring pattern, the plurality of opening portions being different from each other in at least one of diameters and pitches; and
a connection terminal that is formed on each of the opening portions and comes into contact with an upper surface of the wiring pattern exposed from each of the opening portions, wherein
the wiring pattern of the wiring layer includes
a first wiring pattern that is formed of a single metal layer; and
a second wiring pattern that is formed of a plurality of metal layers and that is thicker than the first wiring pattern,

a metal layer serving as an uppermost layer of the second wiring pattern has an upper surface that is a contact surface with the connection terminal and that has a same width as an upper surface of a metal layer serving as a layer other than the uppermost layer or a larger width than the upper surface of the metal layer serving as the layer other than the uppermost layer, and
an upper surface of the first wiring pattern and the upper surface of the second wiring pattern are respectively disposed below the plurality of opening portions.

2. The wiring board according to claim 1 , wherein
the metal layer serving as the uppermost layer of the second wiring pattern has a linear cross-sectional shape in which side surfaces are located on same straight lines as side surfaces of the metal layer serving as the layer other than the uppermost layer.

3. The wiring board according to claim 1 , wherein
the metal layer serving as the uppermost layer of the second wiring pattern has a tapered cross-sectional shape in which side surfaces are located on same straight lines as side surfaces of the metal layer serving as the layer other than the uppermost layer.

4. The wiring board according to claim 1 , wherein
the metal layer serving as the uppermost layer of the second wiring pattern has a cross-sectional shape in which side surfaces are located outward relative to side surfaces of the metal layer serving as the layer other than the uppermost layer, and
the metal layer serving as the uppermost layer and the metal layer serving as the layer other than the uppermost layer are connected via a step in a width direction in the cross-sectional shape.

5. The wiring board according to claim 1 , wherein
the metal layer serving as the uppermost layer of the second wiring pattern is made of a different metal from the metal layer as the layer other than the uppermost layer.

6. The wiring board according to claim 1 , wherein
the plurality of opening portions include
a first opening portion; and
a second opening portion that has a smaller diameter and a smaller pitch than the first opening portion,

the first opening portion penetrates through the insulating layer to the first wiring pattern, and
the second opening portion penetrates through the insulating layer to the second wiring pattern.

7. The wiring board according to claim 1 , wherein
the plurality of opening portions include
a first opening portion; and
a second opening portion that has a larger diameter and a larger pitch than the first opening portion,

the first opening portion penetrates through the insulating layer to the first wiring pattern, and
the second opening portion penetrates through the insulating layer to the second wiring pattern.

8. The wiring board according to claim 1 , wherein
the insulating layer covers side surfaces of the first wiring pattern and the second wiring pattern, and a part of upper surfaces of the first wiring pattern and the second wiring pattern, and
the insulating layer covers a part of the upper surface of the metal layer serving as the uppermost layer of the second wiring pattern.

9. The wiring board according to claim 1 , wherein
the plurality of metal layers of the second wiring pattern are made of a same metal.

Assignees

• Shinko Electric Ind Co

Inventors

• Gozu Yusuke

Classifications

• H05K3/18

  using precipitation techniques to apply the conductive material · CPC title

• H05K2203/0723

  Electroplating, e.g. finish plating · CPC title

• H05K2201/09827

  Tapered, e.g. tapered hole, via or groove · CPC title

• H05K3/108 Primary

  by semi-additive methods; masks therefor (characterised by metallic etch mask H05K3/062; electroplating methods or apparatus H05K3/241) · CPC title

• H05K2201/0154

  Polyimide · CPC title