Wiring board having a wiring pattern that has a multi-layer structure
US-12160954-B2 · Dec 3, 2024 · US
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Gozu Yusuke patents
Gozu Yusuke is listed as an inventor on 13 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Gozu Yusuke |
| Total patents | 13 |
| First publication | Jan 7, 2016 |
| Latest publication | Dec 3, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Wiring board
US-2023026366-A1 · Jan 26, 2023 · US
Wiring substrate and semiconductor device
US-10366949-B2 · Jul 30, 2019 · US
Wiring substrate and semiconductor device
US-10262946-B2 · Apr 16, 2019 · US
Wiring substrate and semiconductor package
US-10028393-B2 · Jul 17, 2018 · US
Wiring Substrate and Semiconductor Device
US-2018166372-A1 · Jun 14, 2018 · US
Wiring substrate
US-9961760-B2 · May 1, 2018 · US
Wiring substrate and semiconductor device
US-2018061765-A1 · Mar 1, 2018 · US
Wiring substrate and semiconductor device
US-9875957-B2 · Jan 23, 2018 · US
Wiring substrate
US-2017359891-A1 · Dec 14, 2017 · US
Recent patents
Latest publications not already listed above.
Wiring substrate
US-9741652-B1 · Aug 22, 2017 · US
Wiring Substrate and Semiconductor Device
US-2016020163-A1 · Jan 21, 2016 · US
Wiring substrate and semiconductor package
US-2016007460-A1 · Jan 7, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Shinko Electric Ind Co | 14 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W70/685 | 11 |
| H10W70/635 | 10 |
| H10W74/15 | 8 |
| H10W90/00 | 8 |
| H10W72/072 | 8 |