A process for electrochemical deposition of copper with different current densities
US-2024183052-A1 · Jun 6, 2024 · US
Polyimide
Polyimide · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K2201/0154 |
| Official title | Polyimide |
| Display label | Polyimide |
| Total patents | 1,571 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 95 |
| 2016 | 116 |
| 2017 | 117 |
| 2018 | 138 |
| 2019 | 146 |
| 2020 | 204 |
| 2021 | 186 |
| 2022 | 186 |
| 2023 | 145 |
| 2024 | 126 |
| 2025 | 99 |
| 2026 | 13 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Electronic device
US-2024096378-A1 · Mar 21, 2024 · US
Overlap Joint Flex Circuit Board Interconnection
US-2024049392-A1 · Feb 8, 2024 · US
Flexible circuit board
US-2015380848-A1 · Dec 31, 2015 · US
Wired circuit board and producing method thereof
US-2015382453-A1 · Dec 31, 2015 · US
Multilayer substrate and manufacturing method for the multilayer substrate
US-2015382464-A1 · Dec 31, 2015 · US
Strain isolation structures for stretchable electronics
US-9226402-B2 · Dec 29, 2015 · US
Multi-layer flexible metal-clad laminate and manufacturing method thereof
US-2015373843-A1 · Dec 24, 2015 · US
Resin article having plating layer and method of manufacturing the same
US-2015361560-A1 · Dec 17, 2015 · US
Wiring base plate and method for manufacturing the same
US-9215810-B2 · Dec 15, 2015 · US
Wiring substrate, semiconductor device, and method for manufacturing wiring substrate
US-2015357276-A1 · Dec 10, 2015 · US
Flexible printed circuit integrated with stiffener
US-9204528-B2 · Dec 1, 2015 · US
Polyimide metal clad laminate
US-2015336354-A1 · Nov 26, 2015 · US
Method for fabricating a flexible electronic structure and a flexible electronic structure
US-2015342036-A1 · Nov 26, 2015 · US
Substrate structure and manufacturing method thereof
US-2015342040-A1 · Nov 26, 2015 · US
Production process of polyimide film laminate, and polyimide film laminate
US-9187676-B2 · Nov 17, 2015 · US
Wiring substrate and semiconductor package
US-9192049-B2 · Nov 17, 2015 · US
Adhesive agent, adhesive film, and semiconductor device and method for manufacturing same
US-2015315436-A1 · Nov 5, 2015 · US
Flexible printed circuit board having gold fingers
US-9178295-B1 · Nov 3, 2015 · US
Foldable display apparatus
US-9173288-B1 · Oct 27, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K2201/0154?
- CPC H05K2201/0154 is the Cooperative Patent Classification code for “Polyimide.”
- How many patents are filed under CPC H05K2201/0154 (Polyimide)?
- Our database includes 1,571 publications tagged with this CPC code.
- Is patent activity under CPC H05K2201/0154 growing?
- Publication counts under this code: 126 in 2024 vs 99 in 2025 (latest complete years).