Electrically conductive vias and methods for producing same

Patent metadata

Field	Value
Publication number	US-12100647-B2
Application number	US-202017765365-A
Country	US
Kind code	B2
Filing date	Sep 30, 2020
Priority date	Sep 30, 2019
Publication date	Sep 24, 2024
Grant date	Sep 24, 2024

Abstract

An electrical component is provided by metallizing holes that extend through a glass substrate. The electrical component can be fabricated by forcing a suspension of electrically conductive particles suspended in a liquid medium through the holes. The suspension can be forced into the holes under an air pressure differential such as a pressure differential force, a centrifugal force, or an electrostatic force. The liquid medium in the holes can be dried, and the particles can be sintered. The particles can further be packed in the hole. Alternatively or additionally, the particles can be pressed against the outer surfaces of the substrate to produce buttons.

First claim

The invention claimed is:

1. An electrical component comprising:
a substrate defining a first surface and a second surface opposite the first surface, and an internal surface that defines a hole that extends from the first surface to the second surface; and
an electrically conductive coating that extends along the internal surface of the substrate, the coating including a metallic adhesion layer deposited onto the internal surface, and a second metallic layer that bonds to the adhesion layer; and
a hardened electrically nonconductive polymer disposed in the hole.

2. The electrical component of claim 1 , wherein the substrate is a glass substrate.

3. The electrical component of claim 1 , further comprising sintered metallic particles disposed in the hole.

4. The electrical component of claim 3 , wherein a majority of the particles are substantially non-densification sintered.

5. The electrical component of claim 3 , wherein the particles are forced into the hole under a force that is defined by one of a pressure differential, a centrifugal force, and an electrostatic force.

6. The electrical component of claim 1 , further comprising a plurality of flake particles disposed in the hole.

7. The electrical component of claim 1 , wherein the electrically conductive coating bonds an electrically conductive fill to the internal surface.

8. The electrical component of claim 7 , wherein the electrically conductive coating bonds a final fill to the internal surface.

9. The electrical component of claim 8 , the second metallic layer that bonds to both the adhesion layer and the final fill.

10. The electrical component of claim 1 , wherein the second metallic layer is a transition metal.

11. The electrical component of claim 10 , wherein the second metallic layer is a silver miscible metal.

12. The electrical component of claim 1 , wherein the coating is applied to the internal surface via a vapor deposition process.

13. The electrical component of claim 12 , wherein the vapor deposition is a physical vapor deposition (PVD).

14. The electrical component of claim 1 , wherein the first and second surfaces of the substrate are opposite each other along a direction, and the substrate defines a trench having a base that defines a first portion of the first surface that is offset from a second portion of the first surface along the direction toward the second surface.

15. An electrical component comprising:
a glass or sapphire substrate defining a first surface and a second surface opposite the first surface, and an internal surface that defines a hole that extends from the first surface to the second surface;
a transition metal coated onto each of the internal surface of the substrate, the first surface, and the second surface; and
an electrically conductive fill including electrically conductive metal particles that extend in the hole substantially from the first surface substantially to the second surface so as to define an electrically conductive via, whereby the electrically conductive fill defines an electrically conductive path substantially from the first surface substantially to the second surface,
wherein the transition metal bonds to each of the internal surface, the first surface, and the second surface.

16. The electrical component of claim 15 , wherein the transition metal is coated onto the internal surface and each of the first and second surfaces prior to introducing the electrically conductive fill into the hole.

17. The electrical component of claim 15 , wherein the transition metal comprises titanium and tungsten.

18. The electrical component of claim 17 , wherein the transition metal comprises a titanium-tungsten alloy.

19. The electrical component of claim 18 , further comprising a redistribution layer that includes a copper layer deposited on the transition metal.

20. The electrical component of claim 15 , further comprising a redistribution layer that includes a copper layer deposited on the transition metal.

21. The electrical component of claim 15 , further comprising nonporous end caps that hermetically seal the hole.

22. The electrical component of claim 1 , further comprising nonporous end caps that hermetically seal the hole.

Assignees

• Samtec Inc

Inventors

• Nolet Alan D
• Liotta Andrew Haynes
• Holland Troy Benton
• Hammann Thomas Jacob
• Bates Heidi
• Goia Daniel
• Hardikar Vishwas Vinayak
• Kumar Ajeet
• Long Daniel
• Mcgraw Nicole
• Moen Lauren Savawn
• Owens Adam

Classifications

• H10W70/692

  Ceramics or glasses · CPC title

• H10W70/635

  Through-vias · CPC title

• H10W70/095 Primary

  of vias therein · CPC title

• H10W70/611

  for connecting multiple chips together · CPC title

• H10W70/66 Primary

  Conductive materials thereof · CPC title