Method of manufacturing glass substrate with through hole, method of manufacturing glass substrate including through electrode, and method of manufacturing interposer
US-2017088457-A1 · Mar 30, 2017 · US
Glass substrate manufacturing method
US2016347643A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016347643-A1 |
| Application number | US-201615162040-A |
| Country | US |
| Kind code | A1 |
| Filing date | May 23, 2016 |
| Priority date | May 29, 2015 |
| Publication date | Dec 1, 2016 |
| Grant date | — |
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Abstract
Official abstract text for this publication.
There is provided a glass substrate manufacturing method for manufacturing a glass substrate with a plurality of through-holes. The method includes a laser processing of forming the plurality of through-holes in the glass substrate, the glass substrate having a first main surface and a second main surface facing the first main surface, by irradiating a laser beam toward the first main surface; and an etching process of injecting an etchant only from a position facing the second main surface of the glass substrate toward the plurality of through-holes formed in the glass substrate.
First claim
Opening claim text (preview).
What is claimed is: 1 . A method of manufacturing a glass substrate with a plurality of through-holes, the method comprising: laser processing of forming the plurality of through-holes in the glass substrate, the glass substrate having a first main surface and a second main surface facing the first main surface, by irradiating a laser beam toward the first main surface; and an etching process of injecting an etchant only from a position facing the second main surface of the glass substrate toward the plurality of through-holes formed in the glass substrate. 2 . A method of manufacturing a glass substrate with a plurality of through-holes, the method comprising: laser processing of forming the plurality of through-holes in the glass substrate, the glass substrate having a first main surface and a second main surface facing the first main surface, by irradiating a laser beam toward the first main surface; and an etching process of injecting an etchant from a first position facing the first main surface of the glass substrate and a second position facing the second main surface of the glass substrate toward the plurality of through-holes formed in the glass substrate. 3 . The method of manufacturing according to claim 1 , wherein, in the etching process, the glass substrate is disposed, so that the second main surface is at an upper side. 4 . The method of manufacturing according to claim 2 , wherein, in the etching process, second injection pressure to inject the etchant from the second position facing the second main surface is higher than first injection pressure to inject the etchant from the first position facing the first main surface. 5 . The method of manufacturing according to claim 2 , wherein, in the etching process, a second time for injecting the etchant from the second position facing the second main surface is longer than a first time for injecting the etchant from the first position facing the first main surface. 6 . The method of manufacturing according to claim 1 , wherein, in the etching process, the glass substrate is supported by one or more conveyance rollers. 7 . The method of manufacturing according to claim 2 , wherein, in the etching process, the glass substrate is supported by one or more conveyance rollers.
Assignees
Inventors
Classifications
Ceramics or glasses · CPC title
- H10W70/095Primary
of vias therein · CPC title
Surface treatment of glass, not in the form of fibres or filaments, by etching (etching or surface-brightening compositions, in general C09K13/00) · CPC title
Electricity · mapped topic
- C03B33/091Primary
using at least one focussed radiation beam, e.g. laser beam (C03B33/0955 takes precedence) · CPC title
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Frequently asked questions
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- What does patent US2016347643A1 cover?
- There is provided a glass substrate manufacturing method for manufacturing a glass substrate with a plurality of through-holes. The method includes a laser processing of forming the plurality of through-holes in the glass substrate, the glass substrate having a first main surface and a second main surface facing the first main surface, by irradiating a laser beam toward the first main surface; …
- Who is the assignee on this patent?
- Asahi Glass Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10W70/095. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Dec 01 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).