Cooling apparatuses having a jet orifice surface with alternating vapor guide channels

Patent metadata

Field	Value
Publication number	US-9460985-B2
Application number	US-201313734635-A
Country	US
Kind code	B2
Filing date	Jan 4, 2013
Priority date	Jan 4, 2013
Publication date	Oct 4, 2016
Grant date	Oct 4, 2016

Abstract

Jet-impingement, two-phase cooling apparatuses having alternating vapor outlet channels are disclosed. In one embodiment, a cooling apparatus includes a fluid inlet channel, a jet orifice surface, and a target surface. The jet orifice surface includes an array of jet orifices. The jet orifices are arranged in rows. Coolant fluid within the fluid inlet channel flows through the array of jet orifices as impingement jets. The jet orifice surface further includes a plurality of vapor guide channels positioned between the plurality of jet orifice rows and parallel to a first axis such that the jet orifice surface is defined by alternating jet orifice rows and vapor guide channels. The target surface has a plurality of surface fins extending from a surface of the target surface and parallel to a second axis that is orthogonal to the first axis, wherein the jet orifice surface is positioned proximate the surface fins.

First claim

What is claimed is:

1. A cooling apparatus comprising:
a fluid inlet channel;
a jet orifice surface comprising:
an array of jet orifices comprising a plurality of jet orifice rows, wherein coolant fluid within the fluid inlet channel flows through the array of jet orifices as impingement jets; and
a plurality of vapor guide channels positioned between the plurality of jet orifice rows and parallel to a first axis such that the jet orifice surface is defined by alternating jet orifice rows and vapor guide channels; and

a target surface comprising a plurality of surface fins extending from a surface of the target surface and parallel to a second axis that is orthogonal to the first axis, wherein the jet orifice surface is positioned proximate the plurality of surface fins;
a coolant fluid chamber; and
a plurality of sloped vapor outlet channels fluidly coupled to the coolant fluid chamber, wherein each sloped vapor outlet channel slopes in a direction that is both away from the jet orifice surface and opposite from a direction of the impingement jets.

2. The cooling apparatus of claim 1 , wherein:
the impingement jets of coolant fluid impinge the target surface between adjacent surface fins;
at least a portion of the coolant fluid enters the plurality of vapor guide channels and flows away from an impingement region of the target surface in directions along the first axis; and
at least a portion of the coolant fluid flows away from the impingement region of the target surface between the surface fins in directions along the second axis.

3. The cooling apparatus of claim 1 , further comprising an insulation assembly and a heat generating device coupled to the insulation assembly and the target surface.

4. The cooling apparatus of claim 3 , wherein the heat generating device is a semiconductor device.

5. A cooling apparatus comprising:
a jet plate manifold, wherein the jet plate manifold is configured to receive a coolant fluid;
a jet orifice surface within the jet plate manifold, the jet orifice surface comprising:
an array of jet orifices comprising a plurality of jet orifice rows, wherein coolant fluid within the fluid inlet channel flows through the array of jet orifices as impingement jets; and
a plurality of vapor guide channels positioned between the plurality of jet orifice rows and parallel to a first axis such that the jet orifice surface is defined by alternating jet orifice rows and vapor guide channels;

a vapor manifold having an opening, wherein the jet plate manifold is disposed within the opening of the vapor manifold such that a plurality of vapor outlet channels is located between the jet plate manifold and the vapor manifold; and
a target surface coupled to the vapor manifold, wherein the impingement jets strike the target surface, and at least some of the coolant fluid changes to a vapor that enters the plurality of vapor guide channels of the jet orifice surface, wherein:
the jet plate manifold comprises a tapered portion and a jet plate manifold opening;
the vapor manifold comprises a plurality of tapered walls defining the opening; and
the tapered portion of the jet plate manifold is disposed within the opening of the vapor manifold such that the plurality of vapor outlet channels are located between the plurality of tapered walls of the vapor manifold and the tapered portion of the jet plate manifold.

6. The cooling apparatus of claim 5 , wherein the target surface comprises a plurality of surface fins extending from a surface of the target surface and parallel to a second axis that is orthogonal to the first axis.

7. The cooling apparatus of claim 6 , wherein:
the jet orifice surface is positioned proximate the plurality of surface fins;
the impingement jets of coolant fluid impinge the target surface between adjacent surface fins;
at least a portion of the coolant fluid enters the plurality of vapor guide channels and flows away from an impingement region of the target surface in directions along the first axis;
at least a portion of the coolant fluid flows away from the impingement region of the target surface between the surface fins in directions along the second axis; and
the coolant fluid flows into the plurality of vapor outlet channels and exits the cooling apparatus.

8. The cooling apparatus of claim 5 , wherein:
the cooling apparatus further comprises a jet orifice plate comprising:
a flange portion; and
an opening on a surface of the flange portion, wherein the jet orifice surface is provided on the jet orifice plate opposite the flange portion such that a jet channel is located between the opening and the jet orifice surface;

the jet plate manifold comprises a jet plate manifold opening and a seat within the jet plate manifold opening; and
the jet orifice plate is disposed within the jet plate manifold opening such that the flange portion is positioned on the seat.

9. The cooling apparatus of claim 5 , wherein the plurality of tapered walls is substantially parallel to the tapered portion of the jet plate manifold.

10. The cooling apparatus of claim 5 , wherein:
the tapered portion of the jet plate manifold extends from an upper portion having a plurality of walls;
a plurality of slot channels are disposed within the plurality of walls of the upper portion; and
the plurality of slot channels are fluidly coupled to the plurality of vapor outlet channels.

11. The cooling apparatus of claim 10 , further comprising an inlet-outlet manifold coupled to the jet plate manifold, the inlet-outlet manifold comprising:
a fluid inlet;
an inlet manifold channel fluidly coupled to the fluid inlet and the jet plate manifold opening;
a plurality of outlet manifold channels fluidly coupled to the plurality of slot channels of the jet plate manifold; and
a fluid outlet fluidly coupled to the plurality of outlet manifold channels.

12. The cooling apparatus of claim 11 , wherein:
the plurality of outlet manifold channels is defined by a first outlet manifold channel, a second outlet manifold channel, a third outlet manifold channel, and a fourth outlet manifold channel, wherein the first through fourth outlet manifold channels are fluidly coupled;
the fluid outlet is positioned above the first outlet manifold channel, and the fourth outlet manifold channel is opposite from the first outlet manifold channel;
the fourth outlet manifold channel has a height that is shorter than the first outlet manifold channel; and
the second outlet manifold channel and the third outlet manifold channel slope upwardly toward the first outlet manifold channel and the fluid outlet.

13. The cooling apparatus of claim 5 , further comprising an insulation assembly and a semiconductor device coupled to the insulation assembly and the target surface.

14. A cooling apparatus comprising:
an inlet-outlet manifold, the inlet-outlet manifold comprising:
a fluid inlet configured to receive a coolant fluid;
an inlet manifold channel fluidly coupled to the fluid inlet;
a plurality of outlet manifold channels; and
a fluid outlet fluidly coupled to the plurality of outlet manifold channels;

a jet plate manifold coupled to the inlet-outlet manifold, the jet plate manifold comprising:
an upper portion comprising a plurality of walls;
a plurality of slot channels within the plurality of walls, wherein the plurality of slot channels are fluidly coupled to the plurality of outlet manifold channels;
a tapered portion extending from the upper portion;
a jet plate manifold opening extending through the upper portion and the tapered portion wherein the jet plate manifold opening is fluidly cou

Assignees

• Toyota Motor Eng & Mfg North America Inc

Inventors

• Joshi Shailesh N
• Kuhlmann Joshua Sean
• Rau Matthew Joseph
• Gaikwad Mayur Prakash

Classifications

• H10W40/73

  for cooling by change of state · CPC title

• H10W40/475 Primary

  using jet impingement (H10W40/776 takes precedence) · CPC title

• H01L23/4735 Primary

  Electricity · mapped topic

• H01L2924/0002

  Electricity · mapped topic

• H01L2924/00

  Electricity · mapped topic