Structural adhesive compositions

Patent metadata

Field	Value
Publication number	US-12049574-B2
Application number	US-202217697745-A
Country	US
Kind code	B2
Filing date	Mar 17, 2022
Priority date	Nov 19, 2010
Publication date	Jul 30, 2024
Grant date	Jul 30, 2024

Abstract

Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct. The heat-activated latent curing agent may include at least one reaction product of reactants including an epoxy compound and an amine and/or an alkaloid.

First claim

We claim:

1. A one-component composition comprising:
(a) an epoxy-capped flexibilizer comprising a reaction product of reactants comprising (i) a first epoxy compound and (ii) a primary or a secondary polyether amine;
(b) a heat-activated latent curing agent comprising (x) a reaction product of reactants comprising (i) a second epoxy compound and (ii) an amine, an alkaloid, or combinations thereof, and (y) dicyandiamide having a D98 of 6 μm;
(c) an optional epoxy/CTBN adduct;
(d) an epoxy/dimer acid adduct;
(e) rubber particles having a core/shell structure;
(f) optional graphenic carbon particles; and
an epoxy compound or an epoxy resin not incorporated into or reacted as a part of any of the components (a)-(f) and/or an epoxy carrier resin incorporated into the component (e).

2. The one-component composition of claim 1 , which comprises at least one of:
2% by weight to 40% by weight, based on total weight of the composition, of the epoxy-capped flexibilizer (a);
3% by weight to 25% by weight, based on total weight of the composition, of the heat-activated latent curing agent (b);
a positive amount of up to 75% by weight, based on total weight of the composition, of the rubber particles having a core/shell structure (e); and
1% by weight to 15% by weight, based on total weight of the composition, of the epoxy/dimer acid adduct (d).

3. The one-component composition of claim 1 , wherein (x) is a reaction product of reactants comprising (i) a second epoxy compound and (ii) an alkaloid, which are provided in a molar ratio of (i) to (ii) of 1:1 to 3:1.

4. The one-component composition of claim 1 , wherein (x) is a reaction product of reactants comprising (i) a second epoxy compound and (ii) an amine, which are provided in a molar ratio of (i) to (ii) of 1:2 to 8:9.

5. The one-component composition of claim 1 , wherein (x) is a reaction product of reactants comprising (i) a second epoxy compound and (ii) an amine or an alkaloid.

6. The one-component composition of claim 5 , wherein the alkaloid comprises an imidazole.

7. The one-component composition of claim 1 , wherein the heat-activated latent curing agent (b) further comprises 3,4-dichlorophenyl-N,N-dimethyl urea.

8. The one-component composition of claim 1 , wherein at least one of the epoxy/CTBN adduct (c) and the graphemic carbon particles (f) is present in the composition.

9. The one-component composition of claim 8 , wherein the epoxy/CTBN adduct (c) is formed from CTBN having a functionality of 1.6 to 2.4.

10. The one-component composition of claim 1 , wherein the epoxy/CTBN adduct (c) is present in an amount of 1% by weight to 20% by weight, based on total weight of the composition.

11. The one-component composition of claim 1 , further comprising 1,10-phenanthroline as a chelating agent.

12. The one-component composition of claim 1 , wherein the composition is formulated to cure at a temperature of 120° C. to 140° C. within 20 minutes or less.

13. The one-component composition of claim 1 , wherein the composition is formulated to cure following exposure to thermal conditions or actinic radiation.

14. A method of treating a substrate, comprising:
applying the one-component composition of claim 1 to a surface of the substrate.

15. The method of claim 14 , further comprising heating the composition at a temperature of 120° C. to 140° C.

16. The method of claim 14 , further comprising exposing the composition to thermal conditions or actinic radiation for 20 minutes or less.

17. An article comprising:
a coating formed on a surface of a substrate from the composition of claim 1 .

18. The article of claim 17 , further comprising a second substrate, wherein the composition is positioned between the surface and the second substrate.

19. The article of claim 18 wherein the coating has a measured lap shear strength of at least 15 MPa when tested at room temperature.

20. An automotive component comprising the article of claim 17 .

21. A wind turbine comprising the article of claim 17 .

Assignees

• Ppg Ind Ohio Inc

Inventors

• Desai Umesh C
• Chao Tien-Chieh
• Nakajima Masayuki
• Ragunathan Kaliappa G

Classifications

• C09J5/00

  Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers · CPC title

• C08K3/04

  Carbon · CPC title

• C08G59/184

  with amines · CPC title

• C08G59/066

  with chain extension or advancing agents · CPC title

• C08G59/182

  using pre-adducts of epoxy compounds with curing agents · CPC title