Adhesive compositions containing graphenic carbon particles

Patent metadata

Field	Value
Publication number	US-9562175-B2
Application number	US-201414312920-A
Country	US
Kind code	B2
Filing date	Jun 24, 2014
Priority date	Nov 19, 2010
Publication date	Feb 7, 2017
Grant date	Feb 7, 2017

Abstract

Disclosed herein are adhesive compositions comprising (a) a first component; (b) a second component that chemically reacts with said first component; and (c) graphenic carbon particles having an oxygen content of no more than 2 atomic weight percent. Disclosed herein are associated methods for forming the adhesive compositions and applying the adhesive compositions to a substrate to form a bonded substrate.

First claim

We claim:

1. An adhesive composition comprising:
(a) a first component;
(b) a second component that chemically reacts with said first component; and
(c) graphenic carbon particles comprising one or more stacked layers of one-atom-thick planar sheets of sp 2 -bonded carbon atoms that are densely packed in a honeycomb crystal lattice having an oxygen content of no more than 2 atomic weight percent, a substantially curved, curled or buckled morphology, and a Raman spectroscopy 2D/G peak ratio of at least 1.1.

2. The adhesive composition of claim 1 , wherein said graphenic carbon particles are thermally produced.

3. The adhesive composition of claim 1 , wherein said graphenic carbon particles have a thickness, measured in a direction perpendicular to at least one carbon atom layer, of no more than 10 nanometers.

4. The adhesive composition of claim 1 , wherein said graphenic carbon particles have an aspect ratio of greater than 3:1.

5. The adhesive composition of claim 1 , wherein said graphenic carbon particles comprise from 1 to 10 weight percent of the total weight of the adhesive composition.

6. The adhesive composition of claim 1 , wherein said second component chemically reacts with said first component without the need for activation from an external energy source.

7. The adhesive composition of claim 6 , further comprising rubber particles having a core/shell structure.

8. The adhesive composition of claim 1 , wherein a mixture comprising (a) and (c) is stored separately from (b), wherein a shear thinning ratio at 45 degrees Celsius of the mixture is at least 20 percent greater than a shear thinning ratio at 45 degrees Celsius of a comparative mixture comprising component (a) but not including (c) as measured by an Aton-Paar Physica MCR 301 Rheometer with 25 mm plate and 0.7 mm gap.

9. The adhesive composition of claim 1 , wherein a mixture comprising (a) and (c) is stored separately from (b), wherein a viscosity recovery ((T3) at 17 minutes) of the mixture is at least 3 times greater than a viscosity recovery ((T3) at 17 minutes) of a comparative mixture comprising component (a) but not including (c) as measured as a function of time by an Aton-Paar Physica MCR 301 Rheometer with 25 mm plate and 0.7 mm gap.

10. The adhesive composition of claim 1 , wherein a mixture comprising (a) and (c) is stored separately from (b), wherein a Thixotropic Index of the mixture is at least 25 percent greater than the Thixotropic Index of a comparative mixture comprising component (a) but not including (c) as determined by logarithmically comparing the viscosity of the adhesive sample after 7 minutes of recovery versus the viscosity of the sample as it is being applied.

11. The adhesive composition of claim 1 , wherein said second component chemically reacts with said first component after mixing and upon activation from an external energy source.

12. The adhesive composition of claim 11 , wherein said second component (b) comprises a heat activated latent curing agent.

13. The adhesive composition of claim 1 , wherein a 0.5% by weight solution of said graphenic carbon particles in butyl cellosolve has a bulk liquid conductivity of at least 100 microSiemens as measured by a Fisher Scientific AB 30 conductivity meter.

14. A method for forming a bonded substrate comprising:
applying the adhesive composition of claim 1 to a first substrate;
contacting a second substrate to the adhesive composition such that the adhesive composition is located between said first substrate and said second substrate; and
curing the adhesive composition.

15. A coating composition comprising:
a film forming polymer; and
graphenic carbon particles comprising one or more stacked layers of one-atom-thick planar sheets of sp 2 -bonded carbon atoms that are densely packed in a honeycomb crystal lattice having an oxygen content of no more than 2 atomic weight percent, a substantially curved, curled or buckled morphology, and a Raman spectroscopy 2D/G peak ratio of at least 1.1.

16. A coating comprising:
the cured coating composition of claim 15 .

17. An adhesive comprising:
the cured adhesive composition of claim 1 .

18. A method of making a composition comprising:
mixing thermally produced graphenic carbon particles and an adhesive component comprising an epoxy, wherein the graphenic carbon particles comprise one or more stacked layers of one-atom-thick planar sheets of sp 2 -bonded carbon atoms that are densely packed in a honeycomb crystal lattice having an oxygen content of no more than 2 atomic weight percent, a substantially curved, curled or buckled morphology, and a Raman spectroscopy 2D/G peak ratio of at least 1.1.

19. The method of claim 18 , wherein the thermally produced graphenic carbon particles are produced by heating at least one hydrocarbon precursor material capable of forming a two-carbon species in a thermal zone at a temperature of at least 1000° C.

20. The method of claim 18 , wherein the thermally produced graphenic carbon particles are produced by heating a methane precursor material in a thermal zone at a temperature of at least 1000° C.

21. The method of claim 19 , wherein the thermal zone is at a temperature of from greater than 3,500° C. to 20,000° C.

22. The method of claim 20 , wherein the thermal zone is at a temperature of from greater than 3,500° C. to 20,000° C.

Assignees

• Ppg Ind Ohio Inc

Inventors

• Asay David B
• Chao Tien-Chieh
• Desai Umesh C
• Hung Cheng-Hung
• Nakajima Masayuki
• Vanier Noel R

Classifications

• C09J163/00

  Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins · CPC title

• C09J11/04 Primary

  inorganic · CPC title

• B82Y30/00

  Nanotechnology for materials or surface science, e.g. nanocomposites · CPC title

• C08K3/04

  Carbon · CPC title

• C09J5/00

  Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers · CPC title