Structural adhesive compositions

Patent metadata

Field	Value
Publication number	US-2022204823-A1
Application number	US-202217697745-A
Country	US
Kind code	A1
Filing date	Mar 17, 2022
Priority date	Nov 19, 2010
Publication date	Jun 30, 2022
Grant date	—

Abstract

Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct. The heat-activated latent curing agent may include at least one reaction product of reactants including an epoxy compound and an amine and/or an alkaloid.

First claim

We claim:

1 . A one-component composition comprising:
(a) an epoxy-capped flexibilizer comprising a reaction product of reactants comprising (i) a first epoxy compound and (ii) a primary or a secondary polyether amine; (b) a heat-activated latent curing agent; (c) rubber particles having a core/shell structure; and (d) a dimer acid adduct.

2 . The one-component composition of claim 1 , comprising:
(a) 2% by weight to 40% by weight based on total weight of the composition of the epoxy-capped flexibilizer; (b) 3% by weight to 25% by weight based on total weight of the composition of the heat-activated latent curing agent; (c) up to 75% by weight based on total weight of the composition of the rubber particles having a core/shell structure; and/or (d) 1% by weight to 15% by weight based on total weight of the composition of the dimer acid adduct.

3 . The one-component composition of claim 1 , wherein the heat-activated latent curing agent comprises dicyandiamide and/or a reaction product of reactants comprising a second epoxy compound and an imidazole.

4 . The one-component composition of claim 3 , wherein the second epoxy compound comprises a polyepoxide and the molar ratio of the epoxy compound to the imidazole is 1:1 to 3:1.

5 . The one-component composition of claim 1 , further comprising (e) an epoxy/CTBN adduct, graphemic carbon particles and/or 3,4-dichlorophenyl-N,N-dimethyl urea.

6 . The one-component composition of claim 5 , wherein the (e) epoxy/CTBN adduct is formed from CTBN having a functionality of 1.6 to 2.4.

7 . The one-component composition of claim 1 , further comprising (e) 1% by weight to 20% by weight based on total weight of the composition of an epoxy/CTBN adduct.

8 . The one-component composition of claim 1 , wherein the composition is curable at a temperature of 140° C. or less and/or is curable within 15 minutes or less.

9 . A method of treating a substrate, comprising:
applying the one-component composition of claim 1 to a surface of the substrate.

10 . The method of claim 9 , further comprising heating the composition at a temperature of 140° C. or less.

11 . The method of claim 9 , further comprising heating the composition for a time of 15 minutes or less.

12 . An article comprising:
a coating formed on a surface of a substrate from the composition of claim 1 .

13 . The article of claim 12 , further comprising a second substrate, wherein the composition is positioned between the surface and the second substrate.

14 . The article of claim 13 wherein the coating has a measured lap shear strength of at least 15 MPa when tested at room temperature.

15 . An automotive component comprising the article of claim 12 .

16 . A wind turbine comprising the article of claim 12 .

Assignees

• Ppg Ind Ohio Inc

Inventors

• Desai Umesh C
• Chao Tien-Chieh
• Nakajima Masayuki
• Ragunathan Kaliappa G

Classifications

• C08K3/04

  Carbon · CPC title

• C08G59/182

  using pre-adducts of epoxy compounds with curing agents · CPC title

• C08G59/066

  with chain extension or advancing agents · CPC title

• C09J5/06

  involving heating of the applied adhesive · CPC title

• C08G59/4276

  Polyesters · CPC title