Structural adhesive compositions

Patent metadata

Field	Value
Publication number	US-11629276-B2
Application number	US-202117198504-A
Country	US
Kind code	B2
Filing date	Mar 11, 2021
Priority date	Nov 19, 2010
Publication date	Apr 18, 2023
Grant date	Apr 18, 2023

Abstract

Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct. The heat-activated latent curing agent may include at least one reaction product of reactants including an epoxy compound and an amine and/or an alkaloid.

First claim

We claim:

1. A one-component composition comprising:
(a) 2% by weight to 40% by of an epoxy-capped flexibilizer, based on total weight of the one-component composition;
(b) 3% by weight to 25% by weight of a heat-activated latent curing agent, based on total weight of the one-component composition, wherein the heat-activated latent curing agent comprises dicyandiamide having a D98 maximum of 6 μm and a reaction product of reactants comprising a polyepoxide compound and an imidazole;
(c) optionally an epoxy/CTBN adduct;
(d) 1% by weight to 15% by weight of an epoxy-dimer acid adduct, based on total weight of the one-component composition;
(e) 5% by weight to 60% by weight of rubber particles having a core/shell structure, based on total weight of the one-component composition;
(f) optionally graphenic carbon particles; and
an epoxy compound or an epoxy resin not incorporated into or reacted as a part of any of the components (a)-(f) and/or an epoxy carrier resin incorporated into the component (e).

2. The one-component composition of claim 1 , wherein the epoxy-capped flexibilizer (a) comprises a reaction product of reactants comprising (i) an epoxy compound, (ii) a polyol comprising a polytetrahydrofuran, and (iii) an anhydride and/or a diacid.

3. The one-component composition of claim 2 , wherein the epoxy compound reactant (i) of the epoxy-capped flexibilizer (a) comprises Bisphenol A diglycidyl ether, phenyl diglycidyl ether, or combinations thereof.

4. The one-component composition of claim 1 , wherein the epoxy-capped flexibilizer (a) comprises a reaction product of reactants comprising (i) an epoxy compound and (ii) a primary or a secondary polyether amine.

5. The one-component composition of claim 4 , wherein the epoxy compound reactant (i) of the epoxy-capped flexibilizer (a) comprises Bisphenol A diglycidyl ether, phenyl diglycidyl ether, or combinations thereof.

6. The one-component composition of claim 1 , wherein the heat activated latent curing agent (b) further comprises a reaction product of reactants comprising a polyepoxide compound and an amine.

7. The one-component composition of claim 6 , wherein the amine reactant comprises a secondary amine.

8. The one-component composition of claim 1 , wherein the heat activated latent curing agent (b) further comprises 3,4-dichlorophenyl-N,N-dimethyl urea.

9. The one-component composition of claim 1 , wherein at least one of the epoxy/CTBN adduct (c) and the graphenic carbon particles (f) is present in the composition.

10. The one-component composition of claim 1 , wherein the composition is curable at a temperature of 140° C. or less and/or is heat-curable within 15 minutes or less.

11. A method of treating a substrate, comprising: applying the composition of claim 1 to a surface of the substrate; and heating the composition at a temperature of 140° C. or less.

12. The method of claim 11 , wherein the temperature is less than 140° C.

13. An article comprising: a coating formed on a surface of a substrate from the composition of claim 1 following heating the composition at a temperature of 140° C. or less.

14. The article of claim 13 , wherein the temperature is less than 140° C.

15. The article of claim 13 , further comprising a second substrate, wherein the composition is positioned between the surface and the second substrate.

16. The article of claim 13 , wherein the coating has a measured lap shear strength of at least 15 MPa when tested at room temperature.

17. An automotive component comprising the article of claim 13 .

18. A wind turbine comprising the article of claim 13 .

Assignees

• Ppg Ind Ohio Inc

Inventors

• Desai Umesh C
• Chao Tien-Chieh
• Nakajima Masayuki
• Ragunathan Kaliappa G

Classifications

• C08G59/4276

  Polyesters · CPC title

• C08G59/5006

  aliphatic · CPC title

• C09J163/00 Primary

  Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins · CPC title

• C08L63/00

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

• C08G59/182

  using pre-adducts of epoxy compounds with curing agents · CPC title