Methods of detecting non-conforming substrate processing events during chemical mechanical polishing

Patent metadata

Field	Value
Publication number	US-12036635-B2
Application number	US-202117365848-A
Country	US
Kind code	B2
Filing date	Jul 1, 2021
Priority date	Jul 14, 2020
Publication date	Jul 16, 2024
Grant date	Jul 16, 2024

Abstract

Embodiments of the present disclosure generally relate to chemical mechanical polishing systems (CMP) systems and processes used in the manufacturing of electronic devices. In particular, embodiments herein relate to methods of detecting non-conforming substrate processing events during a polishing process. In one embodiment, a method of processing a substrate on a polishing system includes urging a surface of a silicon carbide substrate against a polishing pad in the presence of a polishing fluid, determining a temperature of the polishing pad using a temperature sensor that is positioned above the platen, monitoring the temperature of the polishing pad, and, if the change in polishing pad temperature reaches a threshold value, initiating a response using a controller of the polishing system.

First claim

The invention claimed is:

1. A method of processing a substrate on a polishing system, comprising:
(a) urging a surface of a substrate against a polishing pad, wherein the substrate is disposed in a substrate carrier, and wherein urging the surface of the substrate against the polishing pad comprises translating the substrate carrier relative to the polishing pad while exerting a downward force on the substrate;
(b) receiving polishing pad temperature information from a pad temperature sensor, wherein the pad temperature sensor is positioned to measure a polishing pad temperature at a location proximate to a trailing edge of the substrate carrier;
(c) determining a rate of change in the polishing pad temperature over time, using the polishing pad temperature information;
(d) comparing the rate of change of the polishing pad temperature to a predetermined control limit;
(e) communicating an out-of-control event to a user, wherein the out-of-control event comprises a determination that the rate of change of the polishing pad temperature is equal to or outside of the predetermined control limit; and
(f) at least one of suspending substrate processing operations or changing a substrate processing operation during substrate processing based on the out-of-control event.

2. The method of claim 1 , wherein urging the surface of the substrate against the polishing pad further comprises oscillating the substrate carrier between an inner diameter and an outer diameter of the polishing pad coupled to a rotating platen.

3. The method of claim 2 , wherein an oscillation of the substrate carrier is associated with corresponding oscillations in the polishing pad temperature information, wherein the method further comprises generating, from the polishing pad temperature information, smoothed temperature data, and wherein an amplitude of an oscillation in the smoothed temperature data is reduced from a corresponding amplitude of the oscillation in the polishing pad temperature information.

4. The method of claim 1 , wherein the out-of-control event is caused by a fracture in the substrate.

5. The method of claim 1 , wherein the rate of change in the polishing pad temperature information is determined using smoothed temperature data.

6. The method of claim 5 , wherein the rate of change is further determined by using a slope of a secant line disposed through a first point at a first time and second point proximate to the first point at a second time on a curve formed by smoothed temperature data.

7. The method of claim 1 , wherein the pad temperature sensor is positioned to measure the polishing pad temperature at a location proximate to a trailing edge of the substrate carrier in a direction of rotation of the polishing pad coupled to a rotating platen.

8. A polishing system, comprising:
a rotatable platen;
a substrate carrier disposed over the rotatable platen and facing there towards;
a temperature sensor disposed over the rotatable platen, wherein the temperature sensor is positioned to measure a polishing pad temperature at a location proximate to a trailing edge of the substrate carrier; and
a computer readable medium having instructions stored thereon for a substrate processing method, the method comprising:
(a) urging a surface of a substrate against a polishing pad, wherein the polishing pad is disposed on the rotatable platen, wherein the substrate is disposed in a substrate carrier, and wherein urging the surface of the substrate against the polishing pad comprises rotating the rotatable platen and the substrate carrier while exerting a downward force on the substrate;
(b) receiving polishing pad temperature information from the temperature sensor;
(c) determining, using the polishing pad temperature information, a rate of change in the polishing pad temperature over time;
(d) comparing the rate of change of the polishing pad temperature to a predetermined control limit;
(e) communicating an out-of-control event to a user, wherein the out-of-control event comprises a determination that the rate of change of the polishing pad temperature is equal to or outside of the predetermined control limit; and
(f) at least one of suspending substrate processing operations or changing a substrate processing operation during substrate processing based on the out-of-control event.

9. The polishing system of claim 8 , further comprising a system controller configured to suspend or change substrate processing operations based on the out-of-control event.

10. The polishing system of claim 8 , further comprising oscillating the substrate carrier between an inner diameter and an outer diameter of the rotatable platen.

11. The polishing system of claim 10 , wherein the oscillation of the substrate carrier is associated with corresponding oscillations in the polishing pad temperature information, wherein the method further comprises generating, from the polishing pad temperature information, smoothed temperature data, and wherein an amplitude of an oscillation in the smoothed temperature data is reduced from a corresponding amplitude of the oscillation in the polishing pad temperature information.

12. The polishing system of claim 8 , wherein the rate of change in the polishing pad temperature information is determined by using a slope of a secant line disposed through a first point a first time and second point proximate to the first point at a second time on a curved formed by smoothed temperature data.

13. A method of polishing a substrate comprising:
(a) urging a surface of a substrate against a polishing pad, wherein the substrate is disposed in a substrate carrier, and wherein urging the surface of the substrate against the polishing pad comprises translating the substrate carrier relative to the polishing pad while exerting a downward force on the substrate;
(b) receiving motor torque information from one or more motor torque sensors;
(c) determining a rate of change in the motor torque information over time using the motor torque information from the one or more motor torque sensors, wherein the rate of change in motor torque is determined using smoothed motor torque data;
(d) comparing the rate of change of the motor torque information to a predetermined control limit;
(e) communicating to a desired user a first out-of-control event, wherein the first out-of-control event comprises a determination that the rate of change of the motor torque information is equal to or outside of the predetermined control limit;
(f) at least one of suspending substrate processing operations or changing a substrate processing operation during substrate processing based on the first out-of-control event
(g) receiving polishing pad temperature information from a pad temperature sensor, wherein the pad temperature sensor is positioned to measure a polishing pad temperature at a location proximate to a trailing edge of the substrate carrier;
(h) determining a rate of change in the polishing pad temperature over time, using the polishing pad temperature information;
(i) comparing the rate of change of the polishing pad temperature to a predetermined control limit; and
(j) communicating a second out-of-control event to a user, wherein the second out-of-control event comprises a determination that the rate of change of the polishing pad temperature is equal to or outside of the predetermined control limit; and
(k) at least one of suspending substrate processing operations or changing a substrate processing operation during substrate processing based on the second out-of-control event.

14. The method of claim 13 , wherein the polishing pad is coupled to a plat

Assignees

• Applied Materials Inc

Inventors

• Oh Jeonghoon
• Bhushan Ashish
• Leighton Jamie Stuart
• Garcia John Anthony
• Cormier Stephen Thomas
• Jackson Nick Joseph
• Balakumar Manoj
• Patidar Nandkishore

Classifications

• B24B49/16

  taking regard of the load · CPC title

• B24B37/013

  Devices or means for detecting lapping completion · CPC title

• B24B37/005

  Control means for lapping machines or devices · CPC title

• B24B37/042

  operating processes therefor · CPC title

• B24B49/14

  taking regard of the temperature during grinding · CPC title