Eddy current sensor, eddy current sensor assembly, and polishing apparatus
US-2024399536-A1 · Dec 5, 2024 · US
Systems and methods for substrate polishing end point detection using improved friction measurement
US9862070B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9862070-B2 |
| Application number | US-201213459071-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 27, 2012 |
| Priority date | Nov 16, 2011 |
| Publication date | Jan 9, 2018 |
| Grant date | Jan 9, 2018 |
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Abstract
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Methods, apparatus, and systems for polishing a substrate are provided. The invention includes an upper platen; a torque/strain measurement instrument coupled to the upper platen; and a lower platen coupled to the torque/strain measurement instrument and adapted to drive the upper platen to rotate through the torque/strain measurement instrument. In other embodiments, the invention includes an upper carriage; a side force measurement instrument coupled to the upper carriage; and a lower carriage coupled to the side force measurement instrument and adapted to support a polishing head. Numerous additional aspects are disclosed.
First claim
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The invention claimed is: 1. An apparatus for polishing a substrate, the apparatus comprising: an upper platen; a torque/strain measurement instrument coupled to the upper platen; and a lower platen coupled to the torque/strain measurement instrument and adapted to drive the upper platen to rotate through the torque/strain measurement instrument, wherein the torque/strain measurement instrument includes an arrangement of a plurality of flexures, at least one flexure includin…
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Operations & Transport · mapped topic
- B24B37/013Primary
Operations & Transport · mapped topic
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- What does patent US9862070B2 cover?
- Methods, apparatus, and systems for polishing a substrate are provided. The invention includes an upper platen; a torque/strain measurement instrument coupled to the upper platen; and a lower platen coupled to the torque/strain measurement instrument and adapted to drive the upper platen to rotate through the torque/strain measurement instrument. In other embodiments, the invention includes an …
- Who is the assignee on this patent?
- Chang Shou-Sung, Chen Hung, Karuppiah Lakshmanan, and 3 more
- What technology area does this patent fall under?
- Primary CPC classification B24B37/013. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Jan 09 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).