RF amplifier output circuit device with integrated current path, and methods of manufacture thereof
US-10432152-B2 · Oct 1, 2019 · US
US12034425B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12034425-B2 |
| Application number | US-202117458665-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 27, 2021 |
| Priority date | Mar 12, 2019 |
| Publication date | Jul 9, 2024 |
| Grant date | Jul 9, 2024 |
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A high power thin film filter is disclosed includes a substrate having a substrate thickness in a Z-direction between a first surface and a second surface. A thin film capacitor may be formed over the first surface. A thin film inductor may be spaced apart from the thin film capacitor by at least the thickness of the substrate. A via may be formed in the substrate that electrically connects the thin film capacitor and the thin film inductor. The via may include a polymeric composition.
Opening claim text (preview).
What is claimed is: 1. A high power thin film filter comprising: a substrate having a first surface and a second surface opposite the first surface in a Z-direction; a first component formed over the first surface; a second component spaced apart from the first component by at least the substrate in the Z-direction; and a via formed in the substrate and electrically connecting the first component and the second component spaced apart from the first component, the via comprising a polymeric composition. 2. The filter of claim 1 , wherein the via comprises a conductive layer formed over an inner surface of the substrate, the conductive layer extending through the substrate from the first surface to the second surface of the substrate. 3. The filter of claim 1 , wherein the via has a via width in an X-Y plane that is perpendicular to the Z-direction, and the substrate has a substrate thickness in the Z-direction, and a ratio of the substrate thickness to the via width is less than about 7. 4. The filter of claim 1 , wherein a substrate thickness of the substrate in the Z-direction is greater than about 300 microns. 5. The filter of claim 1 , wherein the via width is greater than about 100 microns. 6. The filter of claim 1 , wherein the first component is a thin film capacitor. 7. The filter of claim 1 , wherein the second component is a thin film inductor. 8. The filter of claim 1 , wherein the polymeric composition comprises conductive particles. 9. The filter of claim 1 , wherein the filter has a length and a width, and wherein the length is greater than the width, and wherein the length is less than about 14 mm. 10. The filter of claim 1 , wherein the first component is a thin film capacitor, and further comprising a dielectric layer arranged over the first surface of the substrate, the dielectric layer having a first surface and a second surface, the second surface of the dielectric layer facing the first surface of the substrate, and wherein the thin film capacitor comprises a first electrode formed over the first surface of the substrate and a second electrode formed over the first surface of the dielectric layer. 11. The filter of claim 1 , wherein the second component is a thin film inductor, and further comprising a dielectric layer arranged over the second surface of the substrate, the dielectric layer having a first surface and a second surface, the second surface of the dielectric layer facing the second surface of the substrate, and wherein the thin film inductor comprises a first conductive layer formed over the first surface of the substrate, a second conductive layer formed over the second surface of the dielectric layer, and a via connecting the first conductive layer with the second conductive layer. 12. The filter of claim 1 , wherein the second component is formed over the second surface of the substrate. 13. The filter of claim 1 , further comprising a plurality of contact pads exposed along a bottom surface of the filter for mounting the filter to a mounting surface. 14. The filter of claim 1 , wherein the filter has a power capacity that is greater than about 15 W. 15. The filter of claim 1 , wherein the filter has an area power capacity that is greater than about 0.6 W/mm 2 . 16. A high power thin film filter comprising: a substrate having a first surface and a second surface opposite the first surface in a Z-direction; and a thin film capacitor formed over the first surface; and a thin film inductor spaced apart from the thin film capacitor by at least the substrate; wherein the high power thin film filter has a power capacity that is greater than about 15 W. 17. A high power thin film filter comprising: a substrate having a first surface and a second surface opposite the first surface in a Z-direction; and a first component spaced apart from a second component by the substrate; wherein the high power thin film filter has an area power capacity that is greater than about 0.5 W/mm 2 . 18. The filter of claim 17 , wherein the first component is formed over the first surface and the second component is formed over the second surface. 19. The filter of claim 17 , further comprising a via formed in the substrate and electrically connecting the first component and the second component, the via comprising a polymeric composition.
Capacitors having no potential barriers · CPC title
Inductors · CPC title
characterised by only passive components · CPC title
Multilayer, e.g. LTCC, HTCC, green sheets · CPC title
without voltage- or current-dependent elements · CPC title
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