High power, double-sided thin film filter

US12034425B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12034425-B2
Application numberUS-202117458665-A
CountryUS
Kind codeB2
Filing dateAug 27, 2021
Priority dateMar 12, 2019
Publication dateJul 9, 2024
Grant dateJul 9, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A high power thin film filter is disclosed includes a substrate having a substrate thickness in a Z-direction between a first surface and a second surface. A thin film capacitor may be formed over the first surface. A thin film inductor may be spaced apart from the thin film capacitor by at least the thickness of the substrate. A via may be formed in the substrate that electrically connects the thin film capacitor and the thin film inductor. The via may include a polymeric composition.

First claim

Opening claim text (preview).

What is claimed is: 1. A high power thin film filter comprising: a substrate having a first surface and a second surface opposite the first surface in a Z-direction; a first component formed over the first surface; a second component spaced apart from the first component by at least the substrate in the Z-direction; and a via formed in the substrate and electrically connecting the first component and the second component spaced apart from the first component, the via comprising a polymeric composition. 2. The filter of claim 1 , wherein the via comprises a conductive layer formed over an inner surface of the substrate, the conductive layer extending through the substrate from the first surface to the second surface of the substrate. 3. The filter of claim 1 , wherein the via has a via width in an X-Y plane that is perpendicular to the Z-direction, and the substrate has a substrate thickness in the Z-direction, and a ratio of the substrate thickness to the via width is less than about 7. 4. The filter of claim 1 , wherein a substrate thickness of the substrate in the Z-direction is greater than about 300 microns. 5. The filter of claim 1 , wherein the via width is greater than about 100 microns. 6. The filter of claim 1 , wherein the first component is a thin film capacitor. 7. The filter of claim 1 , wherein the second component is a thin film inductor. 8. The filter of claim 1 , wherein the polymeric composition comprises conductive particles. 9. The filter of claim 1 , wherein the filter has a length and a width, and wherein the length is greater than the width, and wherein the length is less than about 14 mm. 10. The filter of claim 1 , wherein the first component is a thin film capacitor, and further comprising a dielectric layer arranged over the first surface of the substrate, the dielectric layer having a first surface and a second surface, the second surface of the dielectric layer facing the first surface of the substrate, and wherein the thin film capacitor comprises a first electrode formed over the first surface of the substrate and a second electrode formed over the first surface of the dielectric layer. 11. The filter of claim 1 , wherein the second component is a thin film inductor, and further comprising a dielectric layer arranged over the second surface of the substrate, the dielectric layer having a first surface and a second surface, the second surface of the dielectric layer facing the second surface of the substrate, and wherein the thin film inductor comprises a first conductive layer formed over the first surface of the substrate, a second conductive layer formed over the second surface of the dielectric layer, and a via connecting the first conductive layer with the second conductive layer. 12. The filter of claim 1 , wherein the second component is formed over the second surface of the substrate. 13. The filter of claim 1 , further comprising a plurality of contact pads exposed along a bottom surface of the filter for mounting the filter to a mounting surface. 14. The filter of claim 1 , wherein the filter has a power capacity that is greater than about 15 W. 15. The filter of claim 1 , wherein the filter has an area power capacity that is greater than about 0.6 W/mm 2 . 16. A high power thin film filter comprising: a substrate having a first surface and a second surface opposite the first surface in a Z-direction; and a thin film capacitor formed over the first surface; and a thin film inductor spaced apart from the thin film capacitor by at least the substrate; wherein the high power thin film filter has a power capacity that is greater than about 15 W. 17. A high power thin film filter comprising: a substrate having a first surface and a second surface opposite the first surface in a Z-direction; and a first component spaced apart from a second component by the substrate; wherein the high power thin film filter has an area power capacity that is greater than about 0.5 W/mm 2 . 18. The filter of claim 17 , wherein the first component is formed over the first surface and the second component is formed over the second surface. 19. The filter of claim 17 , further comprising a via formed in the substrate and electrically connecting the first component and the second component, the via comprising a polymeric composition.

Assignees

Inventors

Classifications

  • Capacitors having no potential barriers · CPC title

  • Inductors · CPC title

  • characterised by only passive components · CPC title

  • Multilayer, e.g. LTCC, HTCC, green sheets · CPC title

  • H03H5/02Primary

    without voltage- or current-dependent elements · CPC title

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Frequently asked questions

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What does patent US12034425B2 cover?
A high power thin film filter is disclosed includes a substrate having a substrate thickness in a Z-direction between a first surface and a second surface. A thin film capacitor may be formed over the first surface. A thin film inductor may be spaced apart from the thin film capacitor by at least the thickness of the substrate. A via may be formed in the substrate that electrically connects the…
Who is the assignee on this patent?
Avx Corp, Kyocera Avx Components Corp
What technology area does this patent fall under?
Primary CPC classification H03H5/02. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jul 09 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).