Inductor apparatus and inductor apparatus manufacturing method

Patent metadata

Field	Value
Publication number	US-9837208-B2
Application number	US-201414540674-A
Country	US
Kind code	B2
Filing date	Nov 13, 2014
Priority date	Jan 16, 2014
Publication date	Dec 5, 2017
Grant date	Dec 5, 2017

Abstract

An inductor apparatus includes: a substrate including an electrical insulation property and a non-magnetic material; and a plurality of inductors disposed in the substrate so as to extend from a first surface of the substrate to a second surface of the substrate, each of the plurality of inductors including: an inductor conductive part that has an electrical conductivity and extends in a thickness direction of the substrate; and a magnetic layer that covers a side of the inductor conductive part and include a relative permeability and a soft magnetic material.

First claim

What is claimed is:

1. An inductor apparatus comprising:
a substrate including an electrical insulation property and a non-magnetic material;
a plurality of inductors disposed in the substrate so as to extend from a first surface of the substrate to a second surface of the substrate;
a first conductive part arranged side by side with the plurality of inductors in a direction orthogonal to a longitudinal direction of the plurality of inductors on one side of the plurality of inductors and disposed in the substrate so as to extend from the first surface of the substrate to the second surface of the substrate;
a connection conductive layer that is disposed at the second surface of the substrate and electrically couples one end of each of the plurality of inductors and a first end of the first conductive part;
a capacitive element that is disposed at a third surface of the connection conductive layer in which the one end of each of the plurality of inductors and the one end of the first conductive part are not coupled, wherein the capacitive element is coupled to a first wiring layer disposed at a fourth surface of a connection substrate arranged side by side with the substrate; and
a second wiring layer that is disposed at the first surface of the substrate, wherein the second wiring layer is coupled to a second end of the of the first conductive part and extends along a fifth surface of the connection substrate that is opposite to the fourth surface of the connection substrate,
wherein each of the plurality of inductors includes:
an inductor conductive part that has an electrical conductivity and extends in a thickness direction of the substrate; and
a magnetic layer that covers a side of the inductor conductive part and include a relative permeability and a soft magnetic material.

2. The inductor apparatus according to claim 1 , wherein the relative permeability is 5000 or more.

3. The inductor apparatus according to claim 1 , wherein a resistivity of the magnetic layer is 10 times or more a resistivity of the inductor conductive part.

4. The inductor apparatus according to claim 1 , wherein a thickness of the magnetic layer is 10 μm or less.

5. The inductor apparatus according to claim 1 , wherein a coercive force of the magnetic layer is 2 A/m or less.

6. The inductor apparatus according to claim 1 , wherein a saturation magnetization of the magnetic layer is 0.8 T or more.

7. The inductor apparatus according to claim 1 , wherein other ends of each of the plurality of inductors is coupled to a power drive part disposed on a side of the first surface of the substrate and the second end of the first conductive part is coupled to a central processing unit via the second wiring layer.

8. The inductor apparatus according to claim 1 , wherein the plurality of inductors are disposed in a thickness direction of the substrate via a part of the substrate.

9. The inductor apparatus according to claim 1 , wherein a diameter of the first conductive part is larger than a diameter of the inductor conductive part and the magnetic layer of each of the plurality of inductors.

10. The inductor apparatus according to claim 1 , wherein the first wiring layer is coupled to a power drive part via a second conductive part disposed in the connection substrate.

11. The inductor apparatus according to claim 10 , wherein another plurality of inductors including the plurality of the inductors are disposed in a matrix and the first conductive part is disposed in a straight line with the plurality of the inductors.

Assignees

• Fujitsu Ltd

Inventors

• Nakao Hiroshi
• Yonezawa Yu
• Sugawara Takahiko
• Nakashima Yoshiyasu
• Ishizuki Yoshikatsu
• Sasaki Shinya
• Iijima Shinya

Classifications

• H01F2038/026

  non-linear inductive arrangements for converters, e.g. with additional windings · CPC title

• H01F2017/065

  Core mounted around conductor to absorb noise, e.g. EMI filter · CPC title

• H01F41/22 Primary

  Heat treatment; Thermal decomposition; Chemical vapour deposition · CPC title

• H01F2017/002

  Details of via holes for interconnecting the layers · CPC title

• Y10T29/4902

  Electromagnet, transformer or inductor · CPC title