Method and system for transferring alignment marks between substrate systems

Patent metadata

Field	Value
Publication number	US-12002792-B2
Application number	US-202217989770-A
Country	US
Kind code	B2
Filing date	Nov 18, 2022
Priority date	May 11, 2020
Publication date	Jun 4, 2024
Grant date	Jun 4, 2024

Abstract

A method for transferring alignment marks between substrate systems includes providing a substrate having semiconductor devices and alignment marks in precise alignment with the semiconductor devices; and physically transferring and bonding the semiconductor devices and the alignment marks to a temporary substrate of a first substrate system. The method can also include physically transferring and bonding the semiconductor devices and the alignment marks to a mass transfer substrate of a second substrate system; and physically transferring and bonding the semiconductor devices and the alignment marks to a circuitry substrate of a third substrate system. A system for transferring alignment marks between substrate systems includes the substrate having the semiconductor devices and the alignment marks in precise alignment with the semiconductor devices. The system also includes the first substrate system, and can include the second substrate system and the third substrate system.

First claim

We claim:

1. A system for transferring alignment marks between substrate systems comprising:
a substrate comprising a plurality of semiconductor devices and a plurality of alignment marks in alignment with the semiconductor devices, the alignment marks comprising physical structures that can be physically transferred between substrate systems; and
a first substrate system comprising a temporary substrate having an adhesive layer thereon configured to contact and apply adhesive forces to the semiconductor devices and the alignment marks, the temporary substrate configured to support and bond with the semiconductor devices and the alignment marks while maintaining the alignment between the semiconductor devices and the alignment marks, the adhesive layer configured to maintain the adhesive forces during bonding and separating of the substrate from the temporary substrate.

2. The system of claim 1 further comprising a second substrate system comprising a mass transfer substrate having a second adhesive layer thereon, the mass transfer substrate configured to support and bond with the semiconductor devices and the alignment marks while maintaining the alignment between the semiconductor devices and the alignment marks.

3. The system of claim 1 further comprising a third substrate system comprising a circuitry substrate having a plurality of circuits and a plurality of circuitry alignment marks in alignment with the circuits, the circuitry substrate configured to support and bond with the semiconductor devices and the alignment marks while maintaining the alignment between the semiconductor devices and the alignment marks.

4. The system of claim 1 wherein the substrate comprises a semiconductor substrate having epitaxial structures that form the semiconductor devices and the alignment marks.

5. The system of claim 1 wherein the alignment marks comprise portions of an epitaxial structure, a deposited material, or a combination thereof formed on the substrate as physically transferrable structures.

6. The system of claim 1 wherein the alignment marks comprise stickers.

7. The system of claim 1 wherein the semiconductor devices include contacts co-planar to surfaces of the alignment marks.

8. A system for transferring alignment marks between substrates comprising:
a first substrate comprising a plurality of semiconductor devices and a plurality of alignment marks in alignment with the semiconductor devices, the alignment marks comprising physical structures; and
a second substrate having an adhesive layer thereon configured to contact and apply adhesive forces to the semiconductor devices and the alignment marks, the second substrate configured to support and bond with the semiconductor devices and the alignment marks while maintaining the alignment between the semiconductor devices and the alignment marks, the adhesive layer configured to maintain the adhesive forces during bonding and separating of the substrate from the temporary substrate.

9. The system of claim 8 wherein the first substrate comprises a temporary substrate in a first substrate system.

10. The system of claim 8 further comprising a mass transfer substrate having a second adhesive layer thereon, the mass transfer substrate configured to support and bond with the semiconductor devices and the alignment marks while maintaining the alignment between the semiconductor devices and the alignment marks.

11. The system of claim 8 further comprising a circuitry substrate having a plurality of circuits and a plurality of circuitry alignment marks in alignment with the circuits, the circuitry substrate configured to support and bond with the semiconductor devices and the alignment marks while maintaining the alignment between the semiconductor devices and the alignment marks.

12. The system of claim 8 wherein the substrate comprises a semiconductor substrate having epitaxial structures that form the semiconductor devices and the alignment marks.

13. The system of claim 8 wherein the alignment marks comprise portions of an epitaxial structure, a deposited material, or a combination thereof formed on the substrate as physically transferrable structures.

14. The system of claim 8 wherein the alignment marks comprise stickers.

15. The system of claim 8 wherein the semiconductor devices include contacts co-planar to surfaces of the alignment marks.

16. A method for transferring alignment marks between substrates comprising:
providing a substrate comprising a plurality of semiconductor devices and a plurality of alignment marks;
providing a second substrate having an adhesive layer configured to contact and apply adhesive forces to the semiconductor devices and the alignment marks on the substrate;
bonding the semiconductor devices and the alignment marks on the substrate to the adhesive layer on the second substrate; and
separating the substrate from the second substrate leaving the semiconductor devices and the alignment marks on the adhesive layer on the second substrate.

17. The method of claim 16 wherein the semiconductor devices comprise epitaxial structures.

18. The method of claim 16 wherein the separating step is performed using a method selected from the group consisting of a thermal method, an optical method, a mechanical method, and an electrical method.

Assignees

• Semileds Corp
• Shinetsu Chemical Co

Inventors

• Doan David Trung
• Ogawa Yoshinori
• Matsumoto Nobuaki

Classifications

• H10W46/301

  for alignment · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W70/093

  Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps · CPC title

• H10P72/50

  for positioning, orientation or alignment · CPC title