Method and system for transferring alignment marks between substrate systems

Patent metadata

Field	Value
Publication number	US-11545474-B2
Application number	US-202117241324-A
Country	US
Kind code	B2
Filing date	Apr 27, 2021
Priority date	May 11, 2020
Publication date	Jan 3, 2023
Grant date	Jan 3, 2023

Abstract

A method for transferring alignment marks between substrate systems includes providing a substrate having semiconductor devices and alignment marks in precise alignment with the semiconductor devices; and physically transferring and bonding the semiconductor devices and the alignment marks to a temporary substrate of a first substrate system. The method can also include physically transferring and bonding the semiconductor devices and the alignment marks to a mass transfer substrate of a second substrate system; and physically transferring and bonding the semiconductor devices and the alignment marks to a circuitry substrate of a third substrate system. A system for transferring alignment marks between substrate systems includes the substrate having the semiconductor devices and the alignment marks in precise alignment with the semiconductor devices. The system also includes the first substrate system, and can include the second substrate system and the third substrate system.

First claim

We claim:

1. A method for transferring alignment marks between substrate systems comprising:
providing a substrate comprising a plurality of semiconductor devices and a plurality of alignment marks in precise alignment;
providing a first substrate system comprising a temporary substrate;
physically transferring and bonding the semiconductor devices and the alignment marks to the temporary substrate of the first substrate system while maintaining the precise alignment between the semiconductor devices and the alignment marks; and
separating the substrate from the first substrate system leaving the semiconductor devices and alignment marks on the temporary substrate while maintaining the precise alignment between the semiconductor devices and the alignment marks.

2. The method of claim 1 further comprising providing a second substrate system and physically transferring and bonding the semiconductor devices and the alignment marks to the second substrate system while maintaining the precise alignment between the semiconductor devices and the alignment marks.

3. The method of claim 2 further comprising providing a third substrate system, and physically transferring and bonding the semiconductor devices and the alignment marks to the third substrate system while maintaining the precise alignment between the semiconductor devices and the alignment marks.

4. The method of claim 1 wherein the substrate comprises a semiconductor substrate having epitaxial structures that form the semiconductor devices and the alignment marks.

5. The method of claim 1 wherein the substrate comprises a carrier substrate configured for holding the semiconductor devices.

6. The method of claim 1 wherein the alignment marks comprise portions of an epitaxial structure, a deposited material, or a combination thereof formed on the substrate as physical transferrable structures.

7. The method of claim 1 wherein the transferring and bonding step is performed using thermal energy, optical energy, mechanical energy, electrical energy, adhesive energy or combinations thereof.

8. A method for transferring alignment marks between substrate systems comprising:
providing a substrate comprising a plurality of semiconductor devices and a plurality of alignment marks in precise alignment, the alignment marks comprising transferrable physical structures;
providing a first substrate system comprising a temporary substrate;
physically transferring and bonding the semiconductor devices and the alignment marks to the temporary substrate of the first substrate system while maintaining the precise alignment between the semiconductor devices and the alignment marks;
separating the substrate from the first substrate system leaving the semiconductor devices and alignment marks on the temporary substrate while maintaining the precise alignment between the semiconductor devices and the alignment marks;
providing a second substrate system comprising a mass transfer substrate; and
physically transferring and bonding the semiconductor devices and the alignment marks to the second substrate system while maintaining the precise alignment between the semiconductor devices and the alignment marks.

9. The method of claim 8 further comprising providing a third substrate system comprising a circuitry substrate and circuits on the circuitry substrate, and physically transferring the semiconductor devices and the alignment marks from the mass transfer substrate and bonding to the circuitry substrate while maintaining the precise alignment between the semiconductor devices and the alignment marks.

10. The method of claim 9 further comprising separating the mass transfer substrate of the second substrate system leaving the circuitry substrate and the semiconductor devices on the circuitry substrate.

11. The method of claim 10 further comprising further processing the semiconductor devices on the third substrate system using at least one semiconductor fabrication process.

12. The method of claim 11 wherein the semiconductor fabrication process comprises forming of conductors in electrical communication with the semiconductor devices.

13. The method of claim 12 wherein the substrate comprises a semiconductor substrate having epitaxial structures that form the semiconductor devices and the alignment marks.

Assignees

• Semileds Corp
• Shinetsu Chemical Co

Inventors

• Doan David Trung
• Ogawa Yoshinori
• Matsumoto Nobuaki

Classifications

• H10W46/301

  for alignment · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W70/093

  Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps · CPC title

• H01L25/0753 Primary

  Electricity · mapped topic