Sensor and its manufacturing method

US11976989B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11976989-B2
Application numberUS-202016832161-A
CountryUS
Kind codeB2
Filing dateMar 27, 2020
Priority dateMar 29, 2019
Publication dateMay 7, 2024
Grant dateMay 7, 2024

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A strain sensor that includes a first atomic layer deposition layer, a flexible molecular layer deposition layer on top of the first atomic layer deposition layer, and a second atomic layer deposition layer on top of the molecular layer deposition layer.

First claim

Opening claim text (preview).

The invention claimed is: 1. A strain sensor device, comprising: a first electrically conductive atomic layer deposition, ALD, layer attached or deposited on a substrate; a flexible or compressible electrically insulating molecular layer deposition, MLD, layer on top of the first ALD layer; and a second electrically conductive ALD layer on top of the MLD layer, the strain sensor forming a circuit providing information indicative of strain. 2. The device of claim 1 being an implantable device. 3. The device of claim 1 , comprising: an antenna to provide said information indicative of strain. 4. The device of claim 1 , wherein said substrate is biodegradable. 5. The device of claim 1 being biodegradable. 6. The device of claim 1 , wherein the substrate is a biodegradable screw or nail. 7. The device of claim 1 , comprising an RC or RLC circuit to provide said information indicative of strain. 8. The device of claim 1 , wherein the device is configured to provide said information indicative of strain externally readable by radio frequency. 9. A sensor, comprising: a molecular layer deposition, MLD, layer in between two electrically conductive atomic layer deposition, ALD, layers, at least one of the electrically conductive ALD layers having at least one hole for material to push through to absorb to the MLD layer. 10. A method for manufacturing a strain sensor device, comprising: taking an implantable substrate; depositing on the implantable substrate a capacitor structure comprising an electrically conductive ALD layer on opposite sides of a flexible or compressible electrically insulating MLD layer; and providing a circuit comprising the capacitor structure configured to provide information indicative of strain. 11. The method of claim 10 , wherein the MLD layer together with the device is biodegradable.

Assignees

Inventors

Classifications

  • G01L1/2287Primary

    constructional details of the strain gauges (adjustable resistors H01C10/00) · CPC title

  • Monitoring the patient using a local or closed circuit, e.g. in a room or building (A61B5/0017 takes precedence) · CPC title

  • Prosthesis assessment or monitoring · CPC title

  • Nails or pins, i.e. anchors without movable parts, holding by friction only, with or without structured surface (A61B17/72, A61B17/86 take precedence) · CPC title

  • Pins or screws {or threaded wires; nuts therefor (A61B17/72 take precedence)} · CPC title

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Frequently asked questions

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What does patent US11976989B2 cover?
A strain sensor that includes a first atomic layer deposition layer, a flexible molecular layer deposition layer on top of the first atomic layer deposition layer, and a second atomic layer deposition layer on top of the molecular layer deposition layer.
Who is the assignee on this patent?
Picosun Oy
What technology area does this patent fall under?
Primary CPC classification G01L1/2287. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue May 07 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).