Method of manufacturing a flexible conductive track arrangement, flexible conductive track arrangement and neurostimulation system

US10357651B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10357651-B2
Application numberUS-201515311663-A
CountryUS
Kind codeB2
Filing dateMay 18, 2015
Priority dateMay 28, 2014
Publication dateJul 23, 2019
Grant dateJul 23, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Disclosed is a method of manufacturing a flexible conductive track arrangement for a neurostimulation system such as a cochlear implant device. The method allows for the arrangement to be manufactured without the need for a transfer substrate by embedding the metal structures of the arrangement in a ceramic dielectric material formed in an atomic layer deposition process, which can be performed at a temperature that is compatible with the polymer processing steps of such an arrangement. A flexible conductive track arrangement and a neurostimulation system are also disclosed.

First claim

Opening claim text (preview).

The invention claimed is: 1. A flexible conductive track arrangement, comprising: a distal portion comprising a plurality of electrodes; a proximal portion comprising a plurality of contacts; a strip between the distal portion and the proximal portion, the strip comprising a plurality of conductive tracks, each track connecting an electrode to a contact, wherein the conductive tracks are embedded in an dielectric layer, said dielectric layer being embedded in a biocompatible polymer layer, wherein the biocompatible polymer layer has at least one outer polymer surface that is substantially flat and wherein the dielectric layer has a thickness of less than 500 nm; and a central rod, wherein the flexible conductive track is wound around the central rod in a spiralling fashion with the substantially flat surface facing the central rod. 2. The flexible conductive track arrangement of claim 1 , wherein the dielectric layer has a thickness of less than 300 nm. 3. The flexible conductive track arrangement of claim 1 , wherein the dielectric layer comprises at least one of silicon oxide, silicon nitride, aluminum oxide, and other inorganic oxide. 4. A neurostimulation device, comprising: a flexible conductive track arrangement comprising: a distal portion including a plurality of electrodes; a proximal portion comprising a plurality of contacts; a strip between the distal portion and the proximal portion, the strip comprising a plurality of conductive tracks, each track connecting an electrode to a contact, wherein the conductive tracks are embedded in an dielectric layer, the dielectric layer being embedded in a biocompatible polymer layer, wherein the biocompatible polymer layer has at least one outer polymer surface that is substantially flat and wherein the dielectric layer has a thickness of less than 500 nm; and a central rod, wherein the flexible conductive track is wound around the central rod in a spiralling fashion with the substantially flat surface facing the central rod; and a neurostimulation detection having a plurality of further contacts for contacting respective contacts of the proximal portion of the flexible conductive track arrangement. 5. A hearing aid device comprising the neurostimulation device of claim 4 .

Assignees

Inventors

Classifications

  • Cochlear electrodes · CPC title

  • A61N1/0534Primary

    Electrodes for deep brain stimulation · CPC title

  • characterised by the manufacture of electrodes · CPC title

  • A61N1/0551Primary

    Spinal or peripheral nerve electrodes · CPC title

  • Human Necessities · mapped topic

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What does patent US10357651B2 cover?
Disclosed is a method of manufacturing a flexible conductive track arrangement for a neurostimulation system such as a cochlear implant device. The method allows for the arrangement to be manufactured without the need for a transfer substrate by embedding the metal structures of the arrangement in a ceramic dielectric material formed in an atomic layer deposition process, which can be performed…
Who is the assignee on this patent?
Koninklijke Philips Nv
What technology area does this patent fall under?
Primary CPC classification A61N1/0534. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Tue Jul 23 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).