Methods for passivating a carbonic nanolayer
US-9281185-B2 · Mar 8, 2016 · US
US9196849B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9196849-B2 |
| Application number | US-201414149852-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 8, 2014 |
| Priority date | Jan 9, 2013 |
| Publication date | Nov 24, 2015 |
| Grant date | Nov 24, 2015 |
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This invention relates to a polymer/inorganic multi-layer encapsulation film, and more particularly, to a multi-layer encapsulation film, which includes a plasma polymer thin film layer formed using a cross-shaped precursor having Si—O bonding and an inorganic thin film layer, and ensures flexibility and has improved encapsulation.
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The invention claimed is: 1. A multi-layer encapsulation film, comprising: a plasma polymer thin film layer formed by using a precursor represented by Chemical Formula 1 below; and an inorganic thin film layer: wherein R 1 to R 12 are each independently H or C 1 -C 5 alkyl, and wherein the plasma polymer thin film layer is stacked between inorganic thin film…
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