Polymer/inorganic multi-layer encapsulation film

US9196849B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9196849-B2
Application numberUS-201414149852-A
CountryUS
Kind codeB2
Filing dateJan 8, 2014
Priority dateJan 9, 2013
Publication dateNov 24, 2015
Grant dateNov 24, 2015

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

This invention relates to a polymer/inorganic multi-layer encapsulation film, and more particularly, to a multi-layer encapsulation film, which includes a plasma polymer thin film layer formed using a cross-shaped precursor having Si—O bonding and an inorganic thin film layer, and ensures flexibility and has improved encapsulation.

First claim

Opening claim text (preview).

The invention claimed is: 1. A multi-layer encapsulation film, comprising: a plasma polymer thin film layer formed by using a precursor represented by Chemical Formula 1 below; and an inorganic thin film layer: wherein R 1 to R 12 are each independently H or C 1 -C 5 alkyl, and wherein the plasma polymer thin film layer is stacked between inorganic thin film…

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What does patent US9196849B2 cover?
This invention relates to a polymer/inorganic multi-layer encapsulation film, and more particularly, to a multi-layer encapsulation film, which includes a plasma polymer thin film layer formed using a cross-shaped precursor having Si—O bonding and an inorganic thin film layer, and ensures flexibility and has improved encapsulation.
Who is the assignee on this patent?
Univ Sungkyunkwan Res & Bus
What technology area does this patent fall under?
Primary CPC classification H01L51/107. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Nov 24 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).