Method and apparatus for DC voltage control on RF-powered electrode

Patent metadata

Field	Value
Publication number	US-9536711-B2
Application number	US-4782008-A
Country	US
Kind code	B2
Filing date	Mar 13, 2008
Priority date	Mar 30, 2007
Publication date	Jan 3, 2017
Grant date	Jan 3, 2017

Abstract

In a plasma processing chamber, a method for processing a substrate is provided. The method includes supporting the substrate in the plasma processing chamber configured with an upper electrode (UE) and a lower electrode (LE), configuring at least one radio frequency power source to ignite plasma between the UE and the LE, and providing a conductive coupling ring, the conductive coupling ring is coupled to the LE to provide a conductive path. The method further includes providing a plasma-facing-substrate-periphery (PFSP) ring, the PFSP ring being disposed above the conductive coupling ring. The method yet further includes coupling the PFSP ring to at least one of a direct current (DC) ground through an RF filter, the DC ground through the RF filter and a variable resistor, a positive DC power source through the RF filter, and a negative DC power source through the RF filter to control plasma processing parameters.

First claim

What is claimed is:

1. A method for processing a substrate in a plasma processing chamber, the method comprising:
providing an upper electrode, a lower electrode, an edge ring concentrically surrounding at least a portion of said lower electrode, and a conductive coupling ring formed of a direct current (DC) conductive material and disposed in the lower electrode below said edge ring;
configuring at least one radio frequency (RF) power source to ignite plasma between said upper electrode and said lower electrode to process said substrate when said substrate is disposed above said lower electrode;
using said conductive coupling ring to provide a conductive path that is coupled to at least said plasma, wherein said edge ring substantially covers and protects said conductive coupling ring from said plasma;
electrically coupling a DC control module via the lower electrode to the conductive coupling ring; and
switching, while the plasma is ignited in the plasma processing chamber, the electrical coupling from being open to a DC ground through an RF filter and a variable resistor, said conductive coupling ring causing setting of a DC bias voltage of the substrate, the switching causing a decrease in mean ion energy of said plasma at said substrate and, while the plasma is ignited, further decreasing the mean ion energy of said plasma at said substrate by increasing said DC bias voltage by adjusting the variable resistor,
wherein the conductive coupling ring disposed in the lower electrode below the edge ring enables current to traverse from the upper electrode, through the plasma when present, through the conductive coupling ring and to the DC control module that is connected to the lower electrode.

2. The method of claim 1 , wherein said conductive coupling ring is made of aluminum.

3. The method of claim 1 , wherein said RF power source has an RF frequency of about 2 MHz.

4. The method of claim 1 , wherein said RF power source has an RF frequency of about 27 MHz.

5. The method of claim 1 , wherein said RF power source has an RF frequency of about 60 MHz.

6. The method of claim 1 , wherein said plasma processing system is a capacitively-coupled plasma processing system.

7. The method of claim 1 , further comprising, during said processing said substrate, opening a switch between said RF filter and said DC ground to cause said substrate to have a negative DC bias voltage.

8. The method of claim 1 further comprising closing a switch between said RF filter and said DC ground to increase a DC bias voltage of said substrate.

9. The method of claim 1 further comprising closing a switch between said RF filter and said DC ground to increase a voltage potential of said plasma.

10. The method of claim 1 further comprising, during said processing said substrate, closing a switch between said RF filter and said DC ground to increase density of said plasma across said substrate.

11. A method for processing a substrate in a plasma processing chamber, the method comprising:
providing an upper electrode, a lower electrode, an edge ring concentrically surrounding at least a portion of said lower electrode, and a conductive coupling ring formed of a direct current (DC) conductive material and disposed in the lower electrode below said edge ring;
configuring at least one radio frequency (RF) power source to ignite plasma between said upper electrode and said lower electrode to process said substrate when said substrate is disposed above said lower electrode;
using said conductive coupling ring disposed in the lower electrode to provide a conductive path from said upper electrode through said plasma, when present, through said conductive coupling ring and to a DC control module that is coupled to said lower electrode, the conductive path initially being electrically floating;
coupling the conductive path to DC ground from the floating state via a switch of said DC control module while the plasma is ignited, the conductive path being via an RF filter and a variable resistor of said DC control module; and
adjusting, while the plasma is ignited, the variable resistor to increase a DC bias voltage of the substrate via the conductive path, the increase in DC bias voltage causing a decrease in mean ion energy of said plasma at the substrate.

12. The method of claim 11 , wherein said conductive coupling ring is made of aluminum.

13. The method of claim 11 , wherein said RF power source has an RF frequency of about 2 MHz.

14. The method of claim 11 , wherein said RF power source has an RF frequency of about 27 MHz.

15. The method of claim 11 , wherein said RF power source has an RF frequency of about 60 MHz.

16. The method of claim 11 , wherein said plasma processing system is a capacitively-coupled plasma processing system.

17. The method of claim 11 , further comprising, during said processing said substrate, opening a switch between said RF filter and said DC ground to cause said substrate to have a negative DC bias voltage.

18. The method of claim 11 further comprising closing a switch between said RF filter and said DC ground to increase a DC bias voltage of said substrate.

19. The method of claim 11 further comprising closing a switch between said RF filter and said DC ground to increase a voltage potential of said plasma.

20. The method of claim 11 further comprising, during said processing said substrate, closing a switch between said RF filter and said DC ground to increase density of said plasma across said substrate.

Assignees

• Dhindsa Rajinder
• Hudson Eric
• Marakhtanov Alexei
• Moravej Maryam
• Fischer Andreas
• Lam Res Corp

Inventors

• Dhindsa Rajinder
• Hudson Eric
• Marakhtanov Alexei
• Moravej Maryam
• Fischer Andreas

Classifications

• H01J37/32091 Primary

  the radio frequency energy being capacitively coupled to the plasma · CPC title

• H01J37/32174

  Circuits specially adapted for controlling the RF discharge · CPC title

• H01J37/32623

  Mechanical discharge control means · CPC title

• H01J37/32642 Primary

  Focus rings · CPC title

• H01J37/32697

  Electrostatic control · CPC title