Depositing a carbon hardmask by high power pulsed low frequency RF

Patent metadata

Field	Value
Publication number	US-11837441-B2
Application number	US-202017595505-A
Country	US
Kind code	B2
Filing date	May 28, 2020
Priority date	May 29, 2019
Publication date	Dec 5, 2023
Grant date	Dec 5, 2023

Abstract

Methods and related apparatus for depositing an ashable hard mask (AHM) on a substrate include pulsing a low frequency radio frequency component at a high power. Pulsing low frequency power may be used to increase the selectivity or reduce the stress of an AHM. The AHM may then be used to etch features into underlying layers of the substrate.

First claim

What is claimed is:

1. A method of forming an ashable hardmask (AHM) film, comprising:
exposing a semiconductor substrate to a process gas comprising a hydrocarbon precursor gas and helium gas, substantially without any other inert gas; and
depositing on the substrate an AHM film by a plasma enhanced chemical vapor deposition (PECVD) process, wherein the process comprises:
igniting a plasma generated by a dual radio frequency (RF) plasma source including a high frequency (HF) component and a low frequency (LF) component;
a power of the HF component is constant during deposition, and
a power of the LF component is pulsed, with at least about 3000 W per 300 mm wafer and a duty cycle between about 10% and about 75%.

2. The method of claim 1 , wherein the hydrocarbon precursor gas comprises compounds having a molecular weight of at most about 50 g/mol.

3. The method of claim 1 , wherein the hydrocarbon precursor gas comprises compounds having a C:H ratio of at least 0.5.

4. The method of claim 1 , wherein the hydrocarbon precursor gas comprises acetylene (C 2 H 2 ).

5. The method of claim 1 , wherein the hydrocarbon precursor has a partial pressure between about 1-2% of the process gas.

6. The method of claim 1 , wherein the LF power is provided at a frequency of less than or equal to about 2 MHz.

7. The method of claim 1 , wherein the LF power is between about 3500 W and about 6500 W per 300 mm wafer.

8. The method of claim 1 , wherein the LF power is pulsed at a frequency of at least about 100 Hz.

9. The method of claim 1 , wherein the LF power is pulsed at a frequency between about 100 Hz and about 1000 Hz.

10. The method of claim 1 , wherein the LF power duty cycle is between about 10% and about 50%.

11. The method of claim 1 , wherein the LF power duty cycle is between about 60% and about 75%.

12. The method of claim 1 , wherein the LF power has an on period for a duration of between about 200 microseconds and about 300 microseconds.

13. The method of claim 1 , wherein the method is performed in a multi-station reactor.

14. The method of claim 1 , wherein an internal stress of the AHM film is at most about −1400 MPa.

15. The method of claim 1 , wherein a modulus of the AHM film is at least about 80 GPa.

16. The method of claim 1 , wherein a density of the AHM film is at least about 1.5 g/cm 3 .

17. The method of claim 1 , wherein a hydrogen concentration of the AHM film is at most about 25 atomic percent.

18. The method of claim 1 , wherein a thickness of the AHM film is at most about 2500 nm.

19. The method of claim 1 , wherein the method is performed in a process chamber having a pedestal and a showerhead, and a gap between the pedestal and the showerhead is less than about 20 mm.

20. The method of claim 1 , further comprising patterning the AHM film and etching the patterned AHM film to define features of the AHM film in the substrate.

21. The method of claim 20 , further comprising etching layers of the substrate underlying the AHM film.

22. A method of forming an ashable hardmask (AHM) film, comprising:
exposing a semiconductor substrate to a process gas comprising a hydrocarbon precursor gas and an inert gas; and
depositing on the substrate an AHM film by a plasma enhanced chemical vapor deposition (PECVD) process, wherein the process comprises:
igniting a plasma generated by a dual radio frequency (RF) plasma source including a high frequency (HF) component and a low frequency (LF) component;
a power of the HF component is constant during deposition, and
a power of the LF component is pulsed, with at least about 3000 W per 300 mm wafer and the LF power on time per duty cycle is less than about 300 microseconds.

23. The method of claim 22 , wherein the LF power duty cycle is between about 10% and 50%.

24. The method of claim 22 , wherein the LF power on time is between about 200 microseconds and about 300 microseconds.

25. The method of claim 22 , wherein the LF power is pulsed at a frequency of at least 100 Hz.

Assignees

• Lam Res Corp

Inventors

• Weimer Matthew Scott
• Subramonium Pramod
• Puthenkovilakam Ragesh
• Bai Rujun
• French David

Classifications

• H10P76/202

  for lift-off processes · CPC title

• H10P50/73

  using masks for insulating materials · CPC title

• H10P50/71

  using masks for conductive or resistive materials · CPC title

• H10P14/6336

  in the presence of a plasma [PECVD] · CPC title

• H10P76/405

  characterised by their composition, e.g. multilayer masks · CPC title