Control of steam generation for chemical mechanical polishing

US11833637B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11833637-B2
Application numberUS-202117360907-A
CountryUS
Kind codeB2
Filing dateJun 28, 2021
Priority dateJun 29, 2020
Publication dateDec 5, 2023
Grant dateDec 5, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A chemical mechanical polishing system includes a steam generator with a heating element to apply heat to a vessel to generate steam, an opening to deliver steam onto a polishing pad, a first valve in a fluid line between the opening and the vessel, a sensor to monitor a steam parameter, and a control system. The control system causes the valve to open and close in accordance with a steam delivery schedule in a recipe, receive a measured value for the steam parameter from the sensor, receive a target value for the steam parameter, and perform a proportional integral derivative control algorithm with the target value and measured value as inputs so as to control the first valve and/or a second pressure release valve and/or the heating element such that the measured value reaches the target value substantially just before the valve is opened according to the steam delivery schedule.

First claim

Opening claim text (preview).

What is claimed is: 1. A chemical mechanical polishing system, comprising: a platen to support a polishing pad; a carrier head to hold a substrate in contact with the polishing pad; a motor to generate relative motion between the platen and the carrier head; a steam generator including a vessel having a water inlet and a steam outlet, and a heating element configured to apply heat to a portion of a lower chamber of the steam generator to generate steam; an arm extending over the platen having at least one opening oriented to deliver steam from the steam generator onto the polishing pad; a first valve in a fluid line between the opening and the steam outlet to controllably connect and disconnect the opening and the steam outlet; a second pressure release valve coupled to the fluid line between the opening and the steam outlet, the second pressure release valve configured to bleed pressure off the steam generator; a sensor to monitor a steam parameter in the steam generator; and a control system coupled to the sensor, the first valve, the second pressure release valve, and optionally to the heating element, the control system configured to cause the first valve to open and close in accordance with a steam delivery schedule in a polishing process recipe that alternates between a recuperation phase and a dispense phase, the polishing process recipe stored as data in a non-transitory storage device, receive a measured value for the steam parameter from the sensor, receive a target value for the steam parameter, and perform a proportional integral derivative control algorithm with the target value and measured value as inputs so as to control the second pressure release valve and/or the heating element such that the measured value reaches the target value substantially just before a beginning of a next dispense phase and opening the first valve according to the steam delivery schedule, wherein a plurality of gain values of the proportional integral derivative control algorithm are selected to minimize a time that the measured value is at the target value before the next dispense phase begins and the first valve opens delivering steam from the steam generator onto the polishing pad. 2. The system of claim 1 , wherein the steam parameter is steam temperature, the measured value is a measured steam temperature value, and the target value is a target steam temperature value. 3. The system of claim 1 , wherein the steam parameter is steam pressure, the measured value is a measured steam pressure value, and the target value is a target steam pressure value. 4. The system of claim 1 , wherein the control system is configured to perform the proportional integral derivative control algorithm so as to control the first valve during times other than a delivery period in the steam delivery schedule. 5. The system of claim 1 , wherein the control system is configured to perform the proportional integral derivative control algorithm so as to control the heating element. 6. The system of claim 1 , wherein the control system is configured to perform the proportional integral derivative control algorithm such that the measured value reaches the target value less than 10 seconds before the first valve is opened. 7. The system of claim 6 , wherein the control system is configured to perform the proportional integral derivative control algorithm such that the measured value reaches the target value less than 3 seconds before the first valve is opened. 8. The system of claim 7 , wherein the control system is configured to perform the proportional integral derivative control algorithm such that the measured value reaches the target value less than 1 second before the first valve is opened. 9. The system of claim 1 , comprising a water level sensor to monitor a water level in the vessel, and wherein the control system is configured to receive a signal from the water level sensor and to modify a flow rate of water through the water inlet based on the signal from the water level sensor to keep a water level in the vessel above the heating element and below the steam outlet. 10. The system of claim 1 , wherein the control system is configured to open the first valve during a dispense phase of a cycle and configured to close the first valve during a recuperation phase of the cycle. 11. The system of claim 10 , wherein each cycle corresponds to polishing of a single substrate. 12. The system of claim 10 , wherein each cycle consists of a single dispense phase and a single recuperation phase. 13. The system of claim 10 , further comprising a temperature sensor position to measure a temperature of the polishing pad. 14. The system of claim 13 , wherein the control system is configured to receive a signal representing the temperature of the polishing pad from the sensor and to set the target value for the steam parameter based on the signal. 15. The system of claim 14 , wherein the control system is configured to set the target value on a cycle-by-cycle basis. 16. The system of claim 14 , wherein the control system is configured to set the target value on a continuous basis through a cycle. 17. The chemical mechanical polishing system of claim 1 , wherein the plurality of gain values comprise a K P , K I , and K D pre-selected during a tuning operation such that K P is kept as low as possible, and then K I and K D are increased based on overshoot and settling time such that the target value is achieved just before the beginning of the next dispense phase. 18. A chemical mechanical polishing system, comprising: a platen to support a polishing pad; a carrier head to hold a substrate in contact with the polishing pad; a motor to generate relative motion between the platen and the carrier head; a steam generator including a vessel having a water inlet and a steam outlet, and a heating element configured to apply heat to a portion of lower chamber to generate steam; an arm extending over the platen having at least one opening oriented to deliver steam from the steam generator onto the polishing pad; a first valve in a fluid line between the opening and the steam outlet to controllably connect and disconnect the opening and the steam outlet; a second valve or flow regulator in the fluid line between the first valve and the steam outlet, the second valve configured to controllably bleed pressure from the vessel; a sensor to monitor a steam parameter; and a control system coupled to the sensor, the first valve, the second valve, and optionally to the heating element, the control system configured to cause the first valve to open and close in accordance with a steam delivery schedule in a polishing process recipe that alternates between a recuperation phase and a dispense phase, the polishing process recipe stored as data in a non-transitory storage device, receive a measured value for the steam parameter from the sensor, receive a target value for the steam parameter, and perform a proportional integral derivative control algorithm with the target value and measured value as inputs so as to control the second valve such that the measured value reaches the target value substantially just before the first valve is opened according to the steam delivery schedule, wherein a plurality of gain values of the proportional integral derivative control algorithm are selected to minimize a time that the measured value is at the target value before a next dispense phase begins and the first valve opens delivering steam from the steam generator onto the polishing pad.

Assignees

Inventors

Classifications

  • B24B37/015Primary

    Temperature control · CPC title

  • operating processes therefor · CPC title

  • Control systems for steam boilers (for regulating feed-water supply F22D5/00; for controlling superheat temperature F22G5/00) · CPC title

  • taking regard of the temperature during grinding · CPC title

  • Accessories · CPC title

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What does patent US11833637B2 cover?
A chemical mechanical polishing system includes a steam generator with a heating element to apply heat to a vessel to generate steam, an opening to deliver steam onto a polishing pad, a first valve in a fluid line between the opening and the vessel, a sensor to monitor a steam parameter, and a control system. The control system causes the valve to open and close in accordance with a steam deliv…
Who is the assignee on this patent?
Applied Materials Inc
What technology area does this patent fall under?
Primary CPC classification B24B37/015. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Dec 05 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).