Surface-treated copper foil, and copper-clad laminate plate, resin-attached copper foil and circuit board each using same

Patent metadata

Field	Value
Publication number	US-11770904-B2
Application number	US-201917426310-A
Country	US
Kind code	B2
Filing date	Dec 24, 2019
Priority date	Feb 4, 2019
Publication date	Sep 26, 2023
Grant date	Sep 26, 2023

Abstract

A surface treated copper foil includes: a copper foil; a finely roughened particle treatment layer of copper on at least one surface of the copper foil, the finely roughened particle treatment layer including fine copper particles having a particle size of 40 to 200 nm; a heat resistance treatment layer containing nickel on the finely roughened particle treatment layer; a rust prevention treatment layer containing at least chromium on the heat resistance treatment layer; and a silane coupling agent treatment layer on the rust prevention treatment layer. An amount of nickel attached in the heat resistance treatment layer is 30 to 60 mg/m2.

First claim

The invention claimed is:

1. A surface treated copper foil comprising:
a copper foil;
a finely roughened particle treatment layer of copper on at least one surface of the copper foil, the finely roughened particle treatment layer including fine copper particles having a particle size of 40 to 200 nm;
a heat resistance treatment layer containing nickel on the finely roughened particle treatment layer;
a rust prevention treatment layer containing at least chromium on the heat resistance treatment layer; and
a silane coupling agent treatment layer on the rust prevention treatment layer, wherein
an amount of nickel attached in the heat resistance treatment layer is 30 to 60 mg/m 2 , and
the heat resistance treatment layer is composed of nickel, or nickel and phosphorus.

2. A copper-clad laminate comprising:
an insulating layer containing a cured product of a resin composition; and
the surface treated copper foil according to claim 1 on one surface or both surfaces of the insulating layer.

3. A copper foil with resin comprising:
a resin layer containing a resin composition or a semi-cured product of the resin composition; and
the surface treated copper foil according to claim 1 on one surface of the resin layer.

4. A circuit board comprising:
the copper-clad laminate according to claim 2 , wherein a conductor pattern as a circuit is provided on a surface of the circuit board.

5. A circuit board comprising the resin-attached copper foil according to claim 3 , wherein a conductor pattern as a circuit is provided on a surface of the circuit board.

Assignees

• Panasonic Ip Man Co Ltd
• Fukuda Metal Foil & Powder Co Ltd

Inventors

• Kitai Yuki
• Okamoto Takeshi

Classifications

• H05K3/389 Primary

  by the use of a coupling agent, e.g. silane · CPC title

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• H05K3/384 Primary

  by plating · CPC title

• H05K2201/0355

  Metal foils · CPC title

• C25D5/12 Primary

  at least one layer being of nickel or chromium · CPC title