Copper foil for high frequency circuit and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-2019145014-A1
Application number	US-201815943735-A
Country	US
Kind code	A1
Filing date	Apr 3, 2018
Priority date	Nov 15, 2017
Publication date	May 16, 2019
Grant date	—

Abstract

A copper foil for a high frequency circuit and a method of manufacturing the same are provided. The copper foil for a high frequency circuit includes an electroplated copper layer, a fine roughness copper nodule layer, a Zn—Ni plating layer, a rust-proof layer, and a hydrophobic layer. The fine roughness copper nodule layer is located on a surface of the electroplated copper layer and is consisted essentially of copper particles or copper alloy particles with a particle size of 100 nm to 200 nm. The Zn—Ni plating layer is located on the fine roughness copper nodule layer and includes 90-150 μg/dm 2 of zinc and 75-120 μg/dm 2 of nickel. The rust-proof layer is located on the Zn—Ni plating layer and includes 20-40 μg/dm 2 of chromium. The hydrophobic layer is located on the rust-proof layer and has a contact angle of 80 to 150 degrees.

First claim

What is claimed is:

1 . A copper foil for a high frequency circuit, comprising:
an electroplated copper layer; a fine roughness copper nodule layer located on a surface of the electroplated copper layer, wherein the fine roughness copper nodule layer is consisted essentially of copper particles or copper alloy particles with a particle size of 100 nm to 200 nm; a Zn—Ni plating layer located on the fine roughness copper nodule layer, wherein the Zn—Ni plating layer comprises 90-150 μg/dm 2 of zinc and 75-120 μg/dm 2 of nickel; a rust-proof layer located on the Zn—Ni plating layer, wherein the rust-proof layer comprises 20-40 μg/dm 2 of chromium; and a hydrophobic layer located on the rust-proof layer, wherein the hydrophobic layer has a contact angle of 80 to 150 degrees.

2 . The copper foil for a high frequency circuit according to claim 1 , wherein the hydrophobic layer is selected from a group consisting of organosilane materials.

3 . The copper foil for a high frequency circuit according to claim 1 , wherein a weight ratio of nickel of the Zn—Ni plating layer to silicon of the hydrophobic layer is 1.8 to 4.5.

4 . The copper foil for a high frequency circuit according to claim 1 , wherein a weight ratio of zinc of the Zn—Ni plating layer to silicon of the hydrophobic layer is 2.2 to 5.5.

5 . The copper foil for a high frequency circuit according to claim 1 , wherein the copper alloy is formed of copper and elements selected from a group consisting of Co, Ni, Fe, and Mo.

6 . The copper foil for a high frequency circuit according to claim 2 , wherein the organosilane comprises vinyl silane, epoxy silane, or amino silane.

7 . The copper foil for a high frequency circuit according to claim 6 , wherein the amino silane comprises: (3-trimethoxysilylpropyl)ethylenediamine, (3-triethoxysilylpropyl)ethylenediamine, (3-anopropyl)trimethoxysilane, or (3-aminopropyl)triethoxysilane.

8 . The copper foil for a high frequency circuit according to claim 6 , wherein the vinyl silane comprises: vinyltrimethoxysilane or vinyltriethoxysilane.

9 . The copper foil for a high frequency circuit according to claim 1 , wherein a roughness sRq of the copper foil is 0.1 μm to 0.5 μm.

10 . A method of manufacturing a copper foil for a high frequency circuit, comprising:
forming a fine roughness copper nodule layer on a surface of an electroplated copper layer, the fine roughness copper nodule layer being consisted essentially of copper particles or copper alloy particles with a particle size of 100 nm to 200 nm; performing electroplating with a Zn—Ni co-electroplating formula for 3 seconds or more to form a Zn—Ni plating layer on the fine roughness copper nodule layer, the Zn—Ni plating layer comprising 90-150 μg/dm 2 of zinc and 75-120 μg/dm 2 of nickel; forming a rust-proof layer on the Zn—Ni plating layer, the rust-proof layer comprising 20-40 μg/dm 2 of chromium; and forming a hydrophobic layer on the rust-proof layer, the hydrophobic layer having a contact angle of 80 to 150 degrees.

11 . The method of manufacturing a copper foil for a high frequency circuit according to claim 10 , wherein the Zn—Ni co-electroplating formula comprises zinc, nickel, and potassium pyrophosphate.

12 . The method of manufacturing a copper foil for a high frequency circuit according to claim 10 , wherein a duration of the electroplating for forming the Zn—Ni plating layer is 3 to 5 seconds.

13 . The method of manufacturing a copper foil for a high frequency circuit according to claim 10 , wherein an organosilane solution for forming the hydrophobic layer comprises vinyl silane, epoxy silane, or amino silane.

Assignees

• Ind Tech Res Inst

Inventors

• Chen Jhen-Rong
• Chiu Chiu-Yen

Classifications

• H05K3/384

  by plating · CPC title

• H05K2201/0355

  Metal foils · CPC title

• H05K3/389

  by the use of a coupling agent, e.g. silane · CPC title

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• H05K1/0237

  High frequency adaptations (H05K1/0216 takes precedence) · CPC title