Wafer processing method
US-2024395620-A1 · Nov 28, 2024 · US
US11769676B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11769676-B2 |
| Application number | US-202217656087-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 23, 2022 |
| Priority date | Mar 25, 2021 |
| Publication date | Sep 26, 2023 |
| Grant date | Sep 26, 2023 |
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Official abstract text for this publication.
A protective sheet sticking apparatus includes a cutting unit that cuts a protective sheet stuck to a wafer along an outer circumference of the wafer while bringing a cutting part of a cutting blade into contact with the outer circumference of the wafer. The cutting unit has a cutting blade support part that supports the cutting blade rotatably in such a manner that the direction of a cutting edge of the cutting part is adjustable from the outside in the radial direction of the wafer to the inside. The cutting blade support part includes a first biasing spring that makes biasing to cause the cutting part to be oriented toward the inside and a second biasing spring that makes biasing to cause the cutting part to be oriented toward the outside in order to prevent the cutting part from being oriented toward the inside by a predetermined angle or larger.
Opening claim text (preview).
What is claimed is: 1. A protective sheet sticking apparatus that sticks a protective sheet to a wafer with a circular shape, the protective sheet sticking apparatus comprising: a sheet sticking unit that sticks the protective sheet to the wafer held by a table; and a cutting unit that cuts the protective sheet stuck to the wafer by the sheet sticking unit along an outer circumference of the wafer while bringing a cutting part of a cutting blade into contact with the outer circumference of the wafer, wherein: the cutting unit has a cutting blade support part that supports the cutting blade rotatably in such a manner that a direction of a cutting edge of the cutting part is adjustable from an outside in a radial direction of the wafer to an inside, the cutting blade support part includes: a first biasing spring that makes biasing to cause the cutting part to be oriented toward the inside, and a second biasing spring that makes biasing to cause the cutting part to be oriented toward the outside in order to prevent the cutting part from being oriented toward the inside by a predetermined angle or larger, and a direction of the cutting part is adjusted according to the shape of the outer circumference of the water. 2. The protective sheet sticking apparatus according to claim 1 , wherein: the cutting blade support part further includes a third biasing spring that makes biasing to prevent the direction of the cutting part from being oriented toward the outside by a predetermined angle or larger.
Apparatus for placing on an insulating substrate, e.g. tape · CPC title
Apparatus for mechanical treatment or grinding or cutting · CPC title
used to protect an active side of a device or wafer · CPC title
Wafer tapes, e.g. grinding or dicing support tapes · CPC title
Electricity · mapped topic
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