Resist composition and method of forming resist pattern

Patent metadata

Field	Value
Publication number	US-11754922-B2
Application number	US-202117304622-A
Country	US
Kind code	B2
Filing date	Jun 23, 2021
Priority date	Jul 7, 2020
Publication date	Sep 12, 2023
Grant date	Sep 12, 2023

Abstract

A resist composition containing a resin component (A1) having a constitutional unit derived from a compound represented by General Formula (a01-1). In the formula, W01 represents a polymerizable group-containing group, Ct represents a tertiary carbon atom, and Xt represents a group that forms a monocyclic or polycyclic alicyclic group together with Ct, Ra1 to Ra3 represents a hydrocarbon group having 1 to 10 carbon atoms, which may have a substituent, or a hydrogen atom, or two or more of Ra1 to Ra3 are bonded to each other to form an aliphatic ring, not all of Ra1 to Ra3 are hydrogen atoms, n represents 0 or 1

First claim

What is claimed is:

1. A resist composition which generates an acid upon exposure and exhibits changed solubility in a developing solution under action of acid, the resist composition comprising:
a resin component (A1) which exhibits changed solubility in a developing solution under action of acid,
wherein the resin component (A1) has a constitutional unit (a01) derived from a compound represented by General Formula (a01-1):

wherein W 01 represents a polymerizable group-containing group, C t represents a tertiary carbon atom, X t represents a group that forms a monocyclic or polycyclic alicyclic group together with C t , wherein part or all of hydrogen atoms which the monocyclic or polycyclic alicyclic group has may be substituted with a substituent, Ra 1 to Ra 3 each independently represents a hydrocarbon group having 1 to 10 carbon atoms, which may have a substituent, or a hydrogen atom, or two or more of Ra 1 to Ra 3 are bonded to each other to form an aliphatic ring, provided that not all of Ra 1 to Ra 3 are hydrogen atoms, and n represents 0 or 1.

2. The resist composition according to claim 1 , wherein a proportion of the constitutional unit (a01) in the resin component (A1) is in a range of 30% to 70% by mole with respect to all constitutional units (100% by mole) constituting the resin component (A1).

3. The resist composition according to claim 1 , wherein in General Formula (a01-1), at least one of Ra 2 and Ra 3 represents a hydrocarbon group having 1 to 10 carbon atoms, which may have a substituent, or two or more of Ra 1 to Ra 3 are bonded to each other to form an aliphatic ring.

4. A method of forming a resist pattern, comprising:
forming a resist film on a support using the resist composition according to claim 1 ;
exposing the resist film; and
developing the exposed resist film to form a resist pattern.

5. The method of forming a resist pattern according to claim 4 , wherein the resist film is exposed with extreme ultraviolet (EUV) rays or electron beam (EB).

Assignees

• Tokyo Ohka Kogyo Co Ltd

Inventors

• Arai Masatoshi
• Nguyen Khanhtin

Classifications

• G03F7/0397 Primary

  the macromolecular compound having an alicyclic moiety in a side chain · CPC title

• G03F7/004 Primary

  Photosensitive materials (G03F7/12, G03F7/14 take precedence) · CPC title

• G03F7/039 Primary

  Macromolecular compounds which are photodegradable, e.g. positive electron resists (G03F7/075 takes precedence; macromolecular quinonediazides G03F7/023) · CPC title

• C08F212/24

  Phenols or alcohols · CPC title

• G03F7/038

  Macromolecular compounds which are rendered insoluble or differentially wettable (G03F7/075 takes precedence; macromolecular azides G03F7/012; macromolecular diazonium compounds G03F7/021) · CPC title