Resist composition and method of forming resist pattern

Patent metadata

Field	Value
Publication number	US-2016209745-A1
Application number	US-201614995987-A
Country	US
Kind code	A1
Filing date	Jan 14, 2016
Priority date	Jan 16, 2015
Publication date	Jul 21, 2016
Grant date	—

Abstract

A resist composition which generates acid upon exposure and exhibits changed solubility in a developing solution under action of acid, the resist composition including a base component (A) which exhibits changed solubility in a developing solution under action of acid and an acid generator (B) which generates acid upon exposure, the base component (A) including a resin component having a structural unit (a0) represented by general formula (a0-1) shown below, and the acid generator component (B) containing a compound having a cation moiety having an electron withdrawing group (wherein R represents a hydrogen atom, an alkyl group of 1 to 5 carbon atoms or a halogenated alkyl group of 1 to 5 carbon atoms; Ya represents a carbon atom; Xa represents an atomic group required to form an alicyclic hydrocarbon group with Ya; and Ra 01 represents an aromatic hydrocarbon group optionally having a substituent).

First claim

What is claimed is:

1 . A resist composition which generates acid upon exposure and exhibits changed solubility in a developing solution under action of acid,
the resist composition comprising a base component (A) which exhibits changed solubility in a developing solution under action of acid and an acid generator (B) which generates acid upon exposure, the base component (A) comprising a resin component comprising a structural unit (a0) represented by general formula (a0-1) shown below, and the acid generator component (B) comprising a compound having a cation moiety having an electron withdrawing group:

wherein R represents a hydrogen atom, an alkyl group of 1 to 5 carbon atoms or a halogenated alkyl group of 1 to 5 carbon atoms; Ya represents a carbon atom; Xa represents an atomic group required to form an alicyclic hydrocarbon group with Ya; and Ra 01 represents an aromatic hydrocarbon group optionally having a substituent.

2 . The resist composition according to claim 1 , wherein the resin component comprises a polymeric compound (A1) comprising the structural unit (a0) and a polymeric compound (A2) comprising a structural unit (a9) represented by general formula (a9-1) shown below:

wherein R represents a hydrogen atom, an alkyl group of 1 to 5 carbon atoms or a halogenated alkyl group of 1 to 5 carbon atoms; Ya 91 represents a single bond or a divalent linking group; R 91 represents a hydrocarbon group optionally having a substituent; and Ya 92 represents a divalent linking group.

3 . The resist composition according to claim 2 , wherein the polymeric compound (A1) further comprises a structural unit derived from hydroxystyrene or a hydroxystyrene derivative.

4 . A method of forming a resist pattern, comprising:
forming a resist film on a substrate using the resist composition according to claim 1 ; exposing the resist film; and developing the resist film to form a resist pattern.

5 . A resist composition which generates acid upon exposure and exhibits changed solubility in a developing solution under action of acid,
the resist composition comprising a base component (A′) which exhibits changed solubility in a developing solution under action of acid and an acid diffusion control agent (D′), the base component (A′) comprising a resin component comprising a structural unit (a0) represented by general formula (a0-1) shown below and a structural unit (a2′) derived from an acrylate ester monomer having a log P value of less than 1.2, and the acid diffusion control agent (D′) having an acid dissociation constant of 1.5 or more:

wherein R represents a hydrogen atom, an alkyl group of 1 to 5 carbon atoms or a halogenated alkyl group of 1 to 5 carbon atoms; Ya represents a carbon atom; Xa represents an atomic group required to form an alicyclic hydrocarbon group with Ya; and Ra 01 represents an aromatic hydrocarbon group optionally having a substituent.

6 . The resist composition according to claim 5 , wherein the resin component further comprises a structural unit (a9) represented by general formula (a9-1) shown below:

wherein R represents a hydrogen atom, an alkyl group of 1 to 5 carbon atoms or a halogenated alkyl group of 1 to 5 carbon atoms; Ya 91 represents a single bond or a divalent linking group; R 91 represents a hydrocarbon group optionally having a substituent; and Ya 92 represents a divalent linking group.

7 . The resist composition according to claim 5 , wherein the resin component comprises:
a polymeric compound (A2′) comprising the structural unit (a0) and the structural unit (a2′); and a polymeric compound (A3′) comprising the structural unit (a0).

8 . The resist composition according to claim 6 , wherein the resin component comprises:
a polymeric compound (A4′) comprising the structural unit (a2′) and the structural unit (a9); and a polymeric compound (A3′) comprising the structural unit (a0).

9 . The resist composition according to claim 5 , wherein the resin component comprises a polymeric compound (A1′) comprising the structural unit (a0) and the structural unit (a2′).

10 . The resist composition according to claim 9 , wherein the polymeric compound (A1′) further comprises a structural unit (a9) represented by general formula (a9-1) shown below:

wherein R represents a hydrogen atom, an alkyl group of 1 to 5 carbon atoms or a halogenated alkyl group of 1 to 5 carbon atoms; Ya 91 represents a single bond or a divalent linking group; R 91 represents a hydrocarbon group optionally having a substituent; and Ya 92 represents a divalent linking group.

11 . The resist composition according to claim 7 , wherein the polymeric compound (A3′) further comprises a structural unit derived from hydroxystyrene or a hydroxystyrene derivative.

12 . The resist composition according to claim 9 , wherein the polymeric compound (A1′) further comprises a structural unit derived from hydroxystyrene or a hydroxystyrene derivative.

13 . A method of forming a resist pattern, comprising:
forming a resist film on a substrate using a resist composition according to claim 5 ; exposing the resist film; and developing the resist film to form a resist pattern.

14 . A resist composition which generates acid upon exposure and exhibits changed solubility in a developing solution under action of acid,
the resist composition comprising a base component (A″) which exhibits changed solubility in a developing solution under action of acid, the base component (A″) comprising a resin component comprising a structural unit (a0) represented by general formula (a0-1) shown below and a structural unit (a9) represented by general formula (a9-1) shown below:

wherein R represents a hydrogen atom, an alkyl group of 1 to 5 carbon atoms or a halogenated alkyl group of 1 to 5 carbon atoms; Ya represents a carbon atom; Xa represents an atomic group required to form an alicyclic hydrocarbon group with Ya; and Ra 01 represents an aromatic hydrocarbon group optionally having a substituent;

wherein R represents a hydrogen atom, an alkyl group of 1 to 5 carbon atoms or a halogenated alkyl group of 1 to 5 carbon atoms; Ya 91 represents a single bond or a divalent linking group; R 91 represents a hydrocarbon group optionally having a substituent; and Ya 92 represents a divalent linking group.

15 . The resist composition according to claim 14 , wherein the base component (A″) comprises a polymeric compound (A1″) comprising the structural unit (a0) and the structural unit (a9).

16 . The resist composition according to claim 14 , wherein the base component (A″) comprises:
a polymeric compound (A2″) comprising the structural unit (a0); and
a polymeric compound (A3″) comprising the structural unit (a9).

17 . The resist composition according to claim 15 , wherein the polymeric compound (A1″) f

Assignees

• Tokyo Ohka Kogyo Co Ltd

Inventors

• Hirayama Taku
• Kawana Daisuke
• Matsumaru Shogo
• Suzuki Kenta
• Kamizono Takashi
• Yahagi Masahito
• Fujii Tatsuya

Classifications

• G03F7/0045

  with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors · CPC title

• G03F7/0397 Primary

  the macromolecular compound having an alicyclic moiety in a side chain · CPC title

• G03F7/322

  Aqueous alkaline compositions · CPC title

• G03F7/325

  Non-aqueous compositions · CPC title

• G03F7/2041

  in the presence of a fluid, e.g. immersion; using fluid cooling means · CPC title